JP6902778B2 - レーザー式はんだ付け方法及びレーザー式はんだ付け装置 - Google Patents
レーザー式はんだ付け方法及びレーザー式はんだ付け装置 Download PDFInfo
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- JP6902778B2 JP6902778B2 JP2017082255A JP2017082255A JP6902778B2 JP 6902778 B2 JP6902778 B2 JP 6902778B2 JP 2017082255 A JP2017082255 A JP 2017082255A JP 2017082255 A JP2017082255 A JP 2017082255A JP 6902778 B2 JP6902778 B2 JP 6902778B2
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- temperature
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- laser beam
- laser
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- 238000005476 soldering Methods 0.000 title claims description 159
- 238000000034 method Methods 0.000 title claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 49
- 230000005855 radiation Effects 0.000 claims description 34
- 238000005259 measurement Methods 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017082255A JP6902778B2 (ja) | 2017-04-18 | 2017-04-18 | レーザー式はんだ付け方法及びレーザー式はんだ付け装置 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017082255A JP6902778B2 (ja) | 2017-04-18 | 2017-04-18 | レーザー式はんだ付け方法及びレーザー式はんだ付け装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018176247A JP2018176247A (ja) | 2018-11-15 |
| JP2018176247A5 JP2018176247A5 (enExample) | 2020-01-30 |
| JP6902778B2 true JP6902778B2 (ja) | 2021-07-14 |
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ID=64282184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017082255A Active JP6902778B2 (ja) | 2017-04-18 | 2017-04-18 | レーザー式はんだ付け方法及びレーザー式はんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6902778B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022109905A1 (de) | 2021-04-26 | 2022-10-27 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zum Löten eines elektronischen Bauteils an eine Schaltkreisplatine, Computerprogrammprodukt und computerlesbares Medium |
| JP7447387B2 (ja) * | 2022-04-28 | 2024-03-12 | パック テック－パッケージング テクノロジーズ ゲーエムベーハー | 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体 |
| WO2024069857A1 (ja) * | 2022-09-29 | 2024-04-04 | スミダコーポレーション株式会社 | アンテナ装置およびアンテナ装置の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245469A (ja) * | 1985-08-26 | 1987-02-27 | Nippei Toyama Corp | レ−ザ半田付け装置の制御方法 |
| JPH11221683A (ja) * | 1998-02-04 | 1999-08-17 | Matsushita Electric Ind Co Ltd | 光ビーム加熱装置 |
| JP3938845B2 (ja) * | 2001-02-20 | 2007-06-27 | 松下電器産業株式会社 | 光ビーム加熱方法および装置 |
| JP2008277406A (ja) * | 2007-04-26 | 2008-11-13 | I-Pulse Co Ltd | レーザリフロー装置 |
| JP2011023609A (ja) * | 2009-07-16 | 2011-02-03 | Olympus Corp | 非接触加熱装置 |
| JP2013132655A (ja) * | 2011-12-26 | 2013-07-08 | Miyachi Technos Corp | レーザ半田付けシステム |
| JP6285154B2 (ja) * | 2013-11-14 | 2018-02-28 | 株式会社アマダミヤチ | レーザ溶接方法及びレーザ溶接システム |
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2017
- 2017-04-18 JP JP2017082255A patent/JP6902778B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2018176247A (ja) | 2018-11-15 |
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