JP2018176247A5 - - Google Patents

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Publication number
JP2018176247A5
JP2018176247A5 JP2017082255A JP2017082255A JP2018176247A5 JP 2018176247 A5 JP2018176247 A5 JP 2018176247A5 JP 2017082255 A JP2017082255 A JP 2017082255A JP 2017082255 A JP2017082255 A JP 2017082255A JP 2018176247 A5 JP2018176247 A5 JP 2018176247A5
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JP
Japan
Prior art keywords
target temperature
soldering point
soldering
heating target
solder
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Application number
JP2017082255A
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English (en)
Japanese (ja)
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JP6902778B2 (ja
JP2018176247A (ja
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Priority to JP2017082255A priority Critical patent/JP6902778B2/ja
Priority claimed from JP2017082255A external-priority patent/JP6902778B2/ja
Publication of JP2018176247A publication Critical patent/JP2018176247A/ja
Publication of JP2018176247A5 publication Critical patent/JP2018176247A5/ja
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Publication of JP6902778B2 publication Critical patent/JP6902778B2/ja
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JP2017082255A 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置 Active JP6902778B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017082255A JP6902778B2 (ja) 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017082255A JP6902778B2 (ja) 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置

Publications (3)

Publication Number Publication Date
JP2018176247A JP2018176247A (ja) 2018-11-15
JP2018176247A5 true JP2018176247A5 (enExample) 2020-01-30
JP6902778B2 JP6902778B2 (ja) 2021-07-14

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JP2017082255A Active JP6902778B2 (ja) 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置

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JP (1) JP6902778B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022109905A1 (de) 2021-04-26 2022-10-27 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Löten eines elektronischen Bauteils an eine Schaltkreisplatine, Computerprogrammprodukt und computerlesbares Medium
JP7447387B2 (ja) * 2022-04-28 2024-03-12 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体
JP2024048115A (ja) * 2022-09-27 2024-04-08 株式会社ジャパンユニックス レ－ザーハンダ付け装置
US20250353091A1 (en) * 2022-09-29 2025-11-20 Sumida Corporation Antenna device and method for manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245469A (ja) * 1985-08-26 1987-02-27 Nippei Toyama Corp レ−ザ半田付け装置の制御方法
JPH11221683A (ja) * 1998-02-04 1999-08-17 Matsushita Electric Ind Co Ltd 光ビーム加熱装置
JP3938845B2 (ja) * 2001-02-20 2007-06-27 松下電器産業株式会社 光ビーム加熱方法および装置
JP2008277406A (ja) * 2007-04-26 2008-11-13 I-Pulse Co Ltd レーザリフロー装置
JP2011023609A (ja) * 2009-07-16 2011-02-03 Olympus Corp 非接触加熱装置
JP2013132655A (ja) * 2011-12-26 2013-07-08 Miyachi Technos Corp レーザ半田付けシステム
JP6285154B2 (ja) * 2013-11-14 2018-02-28 株式会社アマダミヤチ レーザ溶接方法及びレーザ溶接システム

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