JP2014197631A5 - - Google Patents

Download PDF

Info

Publication number
JP2014197631A5
JP2014197631A5 JP2013072981A JP2013072981A JP2014197631A5 JP 2014197631 A5 JP2014197631 A5 JP 2014197631A5 JP 2013072981 A JP2013072981 A JP 2013072981A JP 2013072981 A JP2013072981 A JP 2013072981A JP 2014197631 A5 JP2014197631 A5 JP 2014197631A5
Authority
JP
Japan
Prior art keywords
substrate
preheat
output
operation output
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013072981A
Other languages
English (en)
Japanese (ja)
Other versions
JP6209842B2 (ja
JP2014197631A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013072981A priority Critical patent/JP6209842B2/ja
Priority claimed from JP2013072981A external-priority patent/JP6209842B2/ja
Priority to CN201410123722.6A priority patent/CN104070254B/zh
Publication of JP2014197631A publication Critical patent/JP2014197631A/ja
Publication of JP2014197631A5 publication Critical patent/JP2014197631A5/ja
Application granted granted Critical
Publication of JP6209842B2 publication Critical patent/JP6209842B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2013072981A 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置 Expired - Fee Related JP6209842B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013072981A JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置
CN201410123722.6A CN104070254B (zh) 2013-03-29 2014-03-28 基板加热装置和软钎焊装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013072981A JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Publications (3)

Publication Number Publication Date
JP2014197631A JP2014197631A (ja) 2014-10-16
JP2014197631A5 true JP2014197631A5 (enExample) 2016-03-24
JP6209842B2 JP6209842B2 (ja) 2017-10-11

Family

ID=51592083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013072981A Expired - Fee Related JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Country Status (2)

Country Link
JP (1) JP6209842B2 (enExample)
CN (1) CN104070254B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
CN107283016A (zh) * 2016-04-11 2017-10-24 Ok国际公司 可变温度受控烙铁
CN111725100B (zh) * 2020-06-16 2023-02-10 北京北方华创微电子装备有限公司 预热装置及预热方法
JP7422884B2 (ja) * 2020-08-17 2024-01-26 三菱電機株式会社 はんだ付けシステム、およびはんだ付け方法
JP7352321B2 (ja) * 2021-07-20 2023-09-28 株式会社新川 フラックス転写装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
JPS5994572A (ja) * 1982-11-22 1984-05-31 Nec Corp 半田リフロ−装置
JP2501334B2 (ja) * 1987-06-19 1996-05-29 松下電工株式会社 リフロ−炉
JPH0296394A (ja) * 1988-09-30 1990-04-09 Matsushita Electric Ind Co Ltd はんだ付けリフロー方法
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
JP3095433B2 (ja) * 1991-03-12 2000-10-03 松下電器産業株式会社 リフロー半田付装置およびリフロー半田付方法
JP3002015B2 (ja) * 1991-06-18 2000-01-24 松下電器産業株式会社 リフロー装置の温度制御方法
JP3192221B2 (ja) * 1992-07-01 2001-07-23 松下電工株式会社 リフロー炉
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

Similar Documents

Publication Publication Date Title
JP2014197632A5 (enExample)
JP2014197631A5 (enExample)
WO2015003169A3 (en) Thermocompression bonding apparatus and method
CN104400168B (zh) 一种自动送锡激光焊接方法
JP2016072613A5 (enExample)
PH12019550234B1 (en) Laser soldering method and device
WO2013083295A8 (de) Lötverfahren und entsprechende löteinrichtung
JP6200182B2 (ja) 基板加熱装置及びはんだ付装置
JP6209842B2 (ja) 基板加熱装置及びはんだ付装置
WO2014101705A1 (zh) 一种回流焊机温度控制方法
JP4974382B2 (ja) リフロー半田付け方法及びその装置
CN205147679U (zh) 焊锡治具
CN205166177U (zh) 一种电器元件与电路板激光焊接装置
WO2009031187A1 (ja) ソルダリング方法及びその装置
CN104507269A (zh) 将放置在电路光板上贴片电子元件加热焊接的方法
CN202498281U (zh) 一种焊锡机器人预热装置
JP2020040084A5 (enExample)
CN105799143B (zh) 基于hot-bar设备的热塑性材料弯折整形方法
JP2010161123A5 (enExample)
MX346911B (es) Sistema y método para evitar la combadura de componentes de metal durante procesos de fabricación.
JP2012247872A5 (enExample)
KR101728677B1 (ko) 플렉시블 디스플레이와 전자부품의 레이져 본딩방법
TWM358024U (en) Heavy-duty anti-soldering equipment
Mashkov et al. Apparatus and method for soldering electronic components to printed circuit boards
CN205300767U (zh) 一种拆焊台的外部温度传感器