CN104070254B - 基板加热装置和软钎焊装置 - Google Patents

基板加热装置和软钎焊装置 Download PDF

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Publication number
CN104070254B
CN104070254B CN201410123722.6A CN201410123722A CN104070254B CN 104070254 B CN104070254 B CN 104070254B CN 201410123722 A CN201410123722 A CN 201410123722A CN 104070254 B CN104070254 B CN 104070254B
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China
Prior art keywords
substrate
temperature
mentioned
heating
power
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Active
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CN201410123722.6A
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English (en)
Chinese (zh)
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CN104070254A (zh
Inventor
大清水和宪
桥本昇
向井直人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Publication date
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Publication of CN104070254A publication Critical patent/CN104070254A/zh
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Publication of CN104070254B publication Critical patent/CN104070254B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
CN201410123722.6A 2013-03-29 2014-03-28 基板加热装置和软钎焊装置 Active CN104070254B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-072981 2013-03-29
JP2013072981A JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Publications (2)

Publication Number Publication Date
CN104070254A CN104070254A (zh) 2014-10-01
CN104070254B true CN104070254B (zh) 2018-01-02

Family

ID=51592083

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410123722.6A Active CN104070254B (zh) 2013-03-29 2014-03-28 基板加热装置和软钎焊装置

Country Status (2)

Country Link
JP (1) JP6209842B2 (enExample)
CN (1) CN104070254B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
CN107283016A (zh) * 2016-04-11 2017-10-24 Ok国际公司 可变温度受控烙铁
CN111725100B (zh) * 2020-06-16 2023-02-10 北京北方华创微电子装备有限公司 预热装置及预热方法
CN116056825A (zh) * 2020-08-17 2023-05-02 三菱电机株式会社 焊接系统和焊接方法
JP7352321B2 (ja) * 2021-07-20 2023-09-28 株式会社新川 フラックス転写装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04288967A (ja) * 1991-03-12 1992-10-14 Matsushita Electric Ind Co Ltd リフロー半田付装置およびリフロー半田付方法
JPH04371365A (ja) * 1991-06-18 1992-12-24 Matsushita Electric Ind Co Ltd リフロー装置の温度制御方法
JPH0621643A (ja) * 1992-07-01 1994-01-28 Matsushita Electric Works Ltd リフロー炉
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
JPS5994572A (ja) * 1982-11-22 1984-05-31 Nec Corp 半田リフロ−装置
JP2501334B2 (ja) * 1987-06-19 1996-05-29 松下電工株式会社 リフロ−炉
JPH0296394A (ja) * 1988-09-30 1990-04-09 Matsushita Electric Ind Co Ltd はんだ付けリフロー方法
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04288967A (ja) * 1991-03-12 1992-10-14 Matsushita Electric Ind Co Ltd リフロー半田付装置およびリフロー半田付方法
JPH04371365A (ja) * 1991-06-18 1992-12-24 Matsushita Electric Ind Co Ltd リフロー装置の温度制御方法
JPH0621643A (ja) * 1992-07-01 1994-01-28 Matsushita Electric Works Ltd リフロー炉
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

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Publication number Publication date
CN104070254A (zh) 2014-10-01
JP2014197631A (ja) 2014-10-16
JP6209842B2 (ja) 2017-10-11

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