JP6209842B2 - 基板加熱装置及びはんだ付装置 - Google Patents

基板加熱装置及びはんだ付装置 Download PDF

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Publication number
JP6209842B2
JP6209842B2 JP2013072981A JP2013072981A JP6209842B2 JP 6209842 B2 JP6209842 B2 JP 6209842B2 JP 2013072981 A JP2013072981 A JP 2013072981A JP 2013072981 A JP2013072981 A JP 2013072981A JP 6209842 B2 JP6209842 B2 JP 6209842B2
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Japan
Prior art keywords
substrate
temperature
heating
operation output
predetermined position
Prior art date
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Expired - Fee Related
Application number
JP2013072981A
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English (en)
Japanese (ja)
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JP2014197631A5 (enExample
JP2014197631A (ja
Inventor
和憲 大清水
和憲 大清水
昇 橋本
昇 橋本
直人 向井
直人 向井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2013072981A priority Critical patent/JP6209842B2/ja
Priority to CN201410123722.6A priority patent/CN104070254B/zh
Publication of JP2014197631A publication Critical patent/JP2014197631A/ja
Publication of JP2014197631A5 publication Critical patent/JP2014197631A5/ja
Application granted granted Critical
Publication of JP6209842B2 publication Critical patent/JP6209842B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP2013072981A 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置 Expired - Fee Related JP6209842B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013072981A JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置
CN201410123722.6A CN104070254B (zh) 2013-03-29 2014-03-28 基板加热装置和软钎焊装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013072981A JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Publications (3)

Publication Number Publication Date
JP2014197631A JP2014197631A (ja) 2014-10-16
JP2014197631A5 JP2014197631A5 (enExample) 2016-03-24
JP6209842B2 true JP6209842B2 (ja) 2017-10-11

Family

ID=51592083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013072981A Expired - Fee Related JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Country Status (2)

Country Link
JP (1) JP6209842B2 (enExample)
CN (1) CN104070254B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
CN107283016A (zh) * 2016-04-11 2017-10-24 Ok国际公司 可变温度受控烙铁
CN111725100B (zh) * 2020-06-16 2023-02-10 北京北方华创微电子装备有限公司 预热装置及预热方法
CN116056825A (zh) * 2020-08-17 2023-05-02 三菱电机株式会社 焊接系统和焊接方法
US12145218B2 (en) * 2021-07-20 2024-11-19 Shinkawa Ltd. Flux transfer apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
JPS5994572A (ja) * 1982-11-22 1984-05-31 Nec Corp 半田リフロ−装置
JP2501334B2 (ja) * 1987-06-19 1996-05-29 松下電工株式会社 リフロ−炉
JPH0296394A (ja) * 1988-09-30 1990-04-09 Matsushita Electric Ind Co Ltd はんだ付けリフロー方法
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
JP3095433B2 (ja) * 1991-03-12 2000-10-03 松下電器産業株式会社 リフロー半田付装置およびリフロー半田付方法
JP3002015B2 (ja) * 1991-06-18 2000-01-24 松下電器産業株式会社 リフロー装置の温度制御方法
JP3192221B2 (ja) * 1992-07-01 2001-07-23 松下電工株式会社 リフロー炉
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

Also Published As

Publication number Publication date
CN104070254A (zh) 2014-10-01
CN104070254B (zh) 2018-01-02
JP2014197631A (ja) 2014-10-16

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