JP6897166B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6897166B2 JP6897166B2 JP2017040869A JP2017040869A JP6897166B2 JP 6897166 B2 JP6897166 B2 JP 6897166B2 JP 2017040869 A JP2017040869 A JP 2017040869A JP 2017040869 A JP2017040869 A JP 2017040869A JP 6897166 B2 JP6897166 B2 JP 6897166B2
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- 239000004065 semiconductor Substances 0.000 title claims description 131
- 239000000758 substrate Substances 0.000 claims description 87
- 230000002093 peripheral effect Effects 0.000 claims description 45
- 239000012535 impurity Substances 0.000 claims description 20
- 239000002344 surface layer Substances 0.000 claims description 16
- 239000012212 insulator Substances 0.000 claims description 3
- 210000000746 body region Anatomy 0.000 description 28
- 230000005684 electric field Effects 0.000 description 18
- 239000010410 layer Substances 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 230000007704 transition Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
Description
2:ドレイン電極
3:ソース電極
4:トレンチゲート
4a:ゲート電極
4b:ゲート絶縁膜
5:埋込み絶縁膜
6:層間絶縁膜
7:フィールドプレート電極
8:終端電極
10:半導体基板
10A:素子部
10B:周辺部
11:ドレイン領域
12:ドリフト領域
13:ボディ領域
14:ソース領域
15:ボディコンタクト領域
16:ガードリング領域
17:リサーフ領域
17a,17b,17c,17d:リサーフ部分領域
18:終端等電位領域
Claims (4)
- 半導体装置であって、
機能構造が設けられている素子部と終端耐圧構造が設けられている周辺部に区画されている半導体基板を備え、
前記機能構造は、
前記半導体基板内に設けられている第1導電型の素子部側ドリフト領域と、
前記半導体基板の表層部に設けられており、前記素子部側ドリフト領域上に配置されている第2導電型の表面領域と、を有しており、
前記終端耐圧構造は、
前記半導体基板の表面上に設けられており、前記素子部から離れる方向に沿って間隔を置いて配置されている複数の埋込み絶縁膜であって、前記半導体基板の表面に形成されている複数のシャロートレンチに充填されている絶縁体を有する、複数の埋込み絶縁膜と、
前記半導体基板内に設けられている第1導電型の周辺部側ドリフト領域と、
前記半導体基板の前記表層部に設けられている第2導電型の複数のガードリング領域であって、各々が隣り合う前記埋込み絶縁膜の間に配置されている、複数のガードリング領域と、
前記半導体基板の表層部に設けられており、前記周辺部側ドリフト領域上に配置されている第2導電型のリサーフ領域であって、前記素子部から離れる方向に沿って前記表面領域から延びており、前記複数のガードリング領域を被覆する、リサーフ領域と、
前記周辺部の終端に対応する範囲の前記半導体基板の表層部に設けられており、前記周辺部側ドリフト領域上に配置されている第1導電型の終端等電位領域と、を有しており、
前記複数の埋込み絶縁膜のうちの最も最外周の埋込み絶縁膜は、前記リサーフ領域と前記終端等電位領域の間に配置されており、前記リサーフ領域と前記終端等電位領域の双方に接しており、前記リサーフ領域よりも浅い、半導体装置。 - 前記リサーフ領域は、前記素子部から離れる方向に沿って並んでいる複数のリサーフ部分領域を有しており、
隣り合う前記リサーフ部分領域の不純物濃度を比較すると、前記素子部から遠い側の前記リサーフ部分領域の不純物濃度の方が低い、請求項1に記載の半導体装置。 - 隣り合う前記リサーフ部分領域の間の不純物濃度の変化領域は、前記ガードリング領域の下方に位置する、請求項2に記載の半導体装置。
- 前記終端耐圧構造はさらに、前記半導体基板上に延設して設けられており、前記ガードリング領域に接するフィールドプレート電極を有する、請求項1〜3のいずれか一項に記載の半導体装置。
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JP2018148000A JP2018148000A (ja) | 2018-09-20 |
JP6897166B2 true JP6897166B2 (ja) | 2021-06-30 |
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Families Citing this family (3)
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JP7355503B2 (ja) | 2019-02-19 | 2023-10-03 | ローム株式会社 | 半導体装置 |
US20210273090A1 (en) * | 2020-03-02 | 2021-09-02 | Cree, Inc. | Semiconductor die with improved edge termination |
CN111554677B (zh) * | 2020-05-06 | 2024-02-27 | 四川立泰电子有限公司 | 电磁干扰低的功率器件终端结构 |
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JP3424635B2 (ja) * | 1994-09-20 | 2003-07-07 | 株式会社日立製作所 | 半導体装置及びそれを使った電力変換装置 |
JP5129943B2 (ja) * | 2006-10-19 | 2013-01-30 | 株式会社豊田中央研究所 | 半導体装置 |
JP2008147361A (ja) * | 2006-12-08 | 2008-06-26 | Toyota Central R&D Labs Inc | 半導体装置 |
CN104205334B (zh) * | 2012-03-05 | 2017-09-01 | 三菱电机株式会社 | 半导体装置 |
EP3238260B1 (en) * | 2014-12-23 | 2020-03-25 | ABB Power Grids Switzerland AG | Reverse-conducting semiconductor device |
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