JP6881703B1 - 導波路型受光素子 - Google Patents
導波路型受光素子 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims abstract description 128
- 230000031700 light absorption Effects 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000927 vapour-phase epitaxy Methods 0.000 description 8
- 238000001459 lithography Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004943 liquid phase epitaxy Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001017 electron-beam sputter deposition Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PIN type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03046—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
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Abstract
Description
図1は、実施の形態1に係る導波路型受光素子を示す断面図である。図1は光入射方向に沿った断面図である。InP基板1の上に、n型コンタクト層2、n型クラッド層3、InGaAsからなる光吸収層4、p型クラッド層5、p型コンタクト層6が順に積層されている。少なくとも光吸収層4を含むリッジ構造7がInP基板1の上に設けられている。光吸収層4よりも低い屈折率を有する半導体埋め込み層8がリッジ構造7の両サイド、即ち光吸収層4の側面を埋め込んでいる。p型コンタクト層6の上にp型電極メタル9が設けられている。
実施の形態1では半導体層13の横方向の厚さd1を概ねλ/(4×n3)に設定することで反射率を低減している。ただし、正確には、光吸収層4は光を吸収する材料からなるため、光吸収層4の屈折率の虚部はゼロではない。このため、図5に示すように、厚さd1がλ/(4×n3)=114nmの場合は反射率が0.014%であるが、厚さd1を105nmに短くすると0.003%まで反射率を低減できる。即ち、半導体層13の横方向の厚さd1がλ/(4×n3)より短い場合に反射率が極小となる。そこで、本実施の形態では、半導体層13の横方向の厚さd1をλ/(4×n3)より短く、入射光15の反射率が極小となる厚さに設定する。これにより更に反射率を低減することができる。
図6は、図1の構造における半導体層の屈折率に対する反射率の計算結果を示す図である。計算において入射光15の波長λを1550nm、厚さd1をλ/(4×n3)、半導体埋め込み層8の屈折率n1を3.17、光吸収層4の屈折率n2を3.67とした。半導体層13の屈折率n3が3.41の場合に反射率が極小となることが分かる。そこで、本実施の形態では、半導体層13の屈折率n3を入射光15の反射率が極小値になる値に設定する。具体的には、屈折率n3を(n1×n2)^0.5とした場合に反射率を極小にすることができ、反射率を低減することができる。
図7及び図8は、実施の形態4に係る導波路型受光素子を示す断面図である。図7は光入射方向に沿った断面図である。図8は光入射方向に対して垂直な断面図である。実施の形態1では半導体層13が光吸収層4に接していたが、本実施の形態では半導体埋め込み層8が光吸収層4の側面と半導体層13の間にも設けられている。光吸収層4の側面と半導体層13の横方向の間隔d2は概ねλ/(2×n1)に設定されている。その他の構成は実施の形態1と同様であり、半導体層13の横方向の厚さd1は概ねλ/(4×n3)に設定されている。
実施の形態4では半導体層13の横方向の厚さd1を概ねλ/(4×n3)に設定することで反射率を低減している。ただし、正確には、光吸収層4は光を吸収する材料からなるため、光吸収層4の屈折率の虚部はゼロではない。このため、図9に示すように、厚さd1がλ/(4×n3)=114nmの場合は反射率が0.012%であるが、厚さd1を105nmに短くすると0.003%まで反射率を低減できる。即ち、半導体層13の横方向の厚さd1がλ/(4×n3)より短い場合に反射率が極小となる。そこで、本実施の形態では、半導体層13の横方向の厚さd1をλ/(4×n3)より短く、入射光15の反射率が極小となる厚さに設定する。これにより更に反射率を低減することができる。
図10は、図7及び図8の構造における半導体層の屈折率に対する反射率の計算結果を示す図である。計算において入射光15の波長λを1550nm、厚さd1をλ/(4×n3)、屈折率n1を3.17、屈折率n2を3.67とした。半導体層13の屈折率n3が=3.417の場合に反射率が極小となることが分かる。そこで、本実施の形態では、半導体層13の屈折率n3を入射光15の反射率が極小値になる値に設定する。なお、実施の形態3では屈折率n3を(n1×n2)^0.5とした場合に反射率を極小であったが、本実施の形態で同様に計算すると、屈折率n3をその値よりも大きくした方がより反射率を低減できる。これは、光吸収層4の屈折率の虚部がゼロでない場合に特有である。
Claims (3)
- 半導体基板と、
前記半導体基板の上に設けられ、少なくとも光吸収層を含むリッジ構造と、
前記光吸収層の側面を埋め込み、前記光吸収層よりも低い屈折率を有する半導体埋め込み層と、
前記光吸収層の側面と前記半導体埋め込み層の間に設けられ、前記光吸収層と前記半導体埋め込み層の間の屈折率を有する半導体層とを備え、
前記半導体層の屈折率をn3、入射光の波長をλとして、前記半導体層の横方向の厚さはλ/(4×n3)の−30%から+20%の範囲内であり、
前記半導体埋め込み層は、前記光吸収層の側面と前記半導体層の間にも設けられ、
前記半導体埋め込み層の屈折率をn1として、前記光吸収層の側面と前記半導体層の横方向の間隔はλ/(2×n1)であることを特徴とする導波路型受光素子。 - 前記光吸収層の屈折率の虚部がゼロでなく、
前記半導体層の屈折率をn3、入射光の波長をλとして、前記半導体層の横方向の厚さはλ/(4×n3)より短く、前記入射光の反射率が極小となる厚さに設定されていることを特徴とする請求項1に記載の導波路型受光素子。 - 前記半導体層の屈折率は、前記入射光の反射率が極小値になる値に設定されていることを特徴とする請求項1又は2に記載の導波路型受光素子。
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CN117199155A (zh) * | 2023-11-06 | 2023-12-08 | 杭州特洛伊光电技术有限公司 | 一种波导型可见光及近红外光探测器结构与制备方法 |
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WO2024116371A1 (ja) * | 2022-12-01 | 2024-06-06 | 三菱電機株式会社 | 導波路型受光素子 |
CN116759471B (zh) * | 2023-06-25 | 2024-05-24 | 无锡芯光互连技术研究院有限公司 | 一种光电探测器、光电探测器芯片以及硅基光子芯片 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04211209A (ja) * | 1990-03-07 | 1992-08-03 | Toshiba Corp | 集積化光半導体素子 |
JP2000089054A (ja) * | 1998-09-12 | 2000-03-31 | Korea Electronics Telecommun | Soi光導波路を利用したハイブリッド光集積回路用基板の製造方法 |
JP2001352131A (ja) * | 2000-03-31 | 2001-12-21 | Agere Systems Optoelectronics Guardian Corp | InAlAs又はInGaAlAsを使用する光電装置に関するドーパント拡散阻止 |
JP2002203984A (ja) * | 2000-10-30 | 2002-07-19 | Nec Corp | 半導体受光素子 |
JP2002314196A (ja) * | 2001-04-18 | 2002-10-25 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体及び半導体光素子 |
JP2006106587A (ja) * | 2004-10-08 | 2006-04-20 | Nippon Telegr & Teleph Corp <Ntt> | 集積光導波路、光素子および集積光導波路の製造方法 |
JP2008153547A (ja) * | 2006-12-19 | 2008-07-03 | Mitsubishi Electric Corp | 埋込導波路型受光素子 |
JP2010008807A (ja) * | 2008-06-27 | 2010-01-14 | Sharp Corp | 光学素子および低反射膜 |
JP2015162576A (ja) * | 2014-02-27 | 2015-09-07 | 住友電気工業株式会社 | 半導体光集積素子、半導体光集積素子を作製する方法 |
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- 2020-10-09 JP JP2021508024A patent/JP6881703B1/ja active Active
- 2020-10-09 US US17/997,821 patent/US20230178666A1/en active Pending
- 2020-10-09 WO PCT/JP2020/038360 patent/WO2022074838A1/ja active Application Filing
- 2020-10-09 CN CN202080102592.1A patent/CN116157925A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04211209A (ja) * | 1990-03-07 | 1992-08-03 | Toshiba Corp | 集積化光半導体素子 |
JP2000089054A (ja) * | 1998-09-12 | 2000-03-31 | Korea Electronics Telecommun | Soi光導波路を利用したハイブリッド光集積回路用基板の製造方法 |
JP2001352131A (ja) * | 2000-03-31 | 2001-12-21 | Agere Systems Optoelectronics Guardian Corp | InAlAs又はInGaAlAsを使用する光電装置に関するドーパント拡散阻止 |
JP2002203984A (ja) * | 2000-10-30 | 2002-07-19 | Nec Corp | 半導体受光素子 |
JP2002314196A (ja) * | 2001-04-18 | 2002-10-25 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体及び半導体光素子 |
JP2006106587A (ja) * | 2004-10-08 | 2006-04-20 | Nippon Telegr & Teleph Corp <Ntt> | 集積光導波路、光素子および集積光導波路の製造方法 |
JP2008153547A (ja) * | 2006-12-19 | 2008-07-03 | Mitsubishi Electric Corp | 埋込導波路型受光素子 |
JP2010008807A (ja) * | 2008-06-27 | 2010-01-14 | Sharp Corp | 光学素子および低反射膜 |
JP2015162576A (ja) * | 2014-02-27 | 2015-09-07 | 住友電気工業株式会社 | 半導体光集積素子、半導体光集積素子を作製する方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117199155A (zh) * | 2023-11-06 | 2023-12-08 | 杭州特洛伊光电技术有限公司 | 一种波导型可见光及近红外光探测器结构与制备方法 |
CN117199155B (zh) * | 2023-11-06 | 2024-02-13 | 杭州特洛伊光电技术有限公司 | 一种波导型可见光及近红外光探测器结构与制备方法 |
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US20230178666A1 (en) | 2023-06-08 |
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