JP6879325B2 - 発光モジュールの製造方法及び発光モジュール - Google Patents

発光モジュールの製造方法及び発光モジュール Download PDF

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Publication number
JP6879325B2
JP6879325B2 JP2019056065A JP2019056065A JP6879325B2 JP 6879325 B2 JP6879325 B2 JP 6879325B2 JP 2019056065 A JP2019056065 A JP 2019056065A JP 2019056065 A JP2019056065 A JP 2019056065A JP 6879325 B2 JP6879325 B2 JP 6879325B2
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Prior art keywords
light emitting
light
emitting element
guide plate
recess
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JP2019056065A
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English (en)
Japanese (ja)
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JP2019175846A (ja
Inventor
啓 橋本
啓 橋本
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Nichia Corp
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Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to US16/365,012 priority Critical patent/US11073725B2/en
Priority to KR1020190034704A priority patent/KR102512369B1/ko
Priority to EP19165147.0A priority patent/EP3547377B1/en
Priority to TW108110432A priority patent/TWI750466B/zh
Priority to CN201910232439.XA priority patent/CN110364515A/zh
Publication of JP2019175846A publication Critical patent/JP2019175846A/ja
Application granted granted Critical
Publication of JP6879325B2 publication Critical patent/JP6879325B2/ja
Priority to US17/304,548 priority patent/US11886078B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Planar Illumination Modules (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
JP2019056065A 2018-03-26 2019-03-25 発光モジュールの製造方法及び発光モジュール Active JP6879325B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US16/365,012 US11073725B2 (en) 2018-03-26 2019-03-26 Method of manufacturing light emitting module, and light emitting module
KR1020190034704A KR102512369B1 (ko) 2018-03-26 2019-03-26 발광 모듈의 제조 방법 및 발광 모듈
EP19165147.0A EP3547377B1 (en) 2018-03-26 2019-03-26 Method of manufacturing light emitting module, and light emitting module
TW108110432A TWI750466B (zh) 2018-03-26 2019-03-26 發光模組之製造方法及發光模組
CN201910232439.XA CN110364515A (zh) 2018-03-26 2019-03-26 发光模块的制造方法及发光模块
US17/304,548 US11886078B2 (en) 2018-03-26 2021-06-22 Method of manufacturing light emitting module, and light emitting module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018059064 2018-03-26
JP2018059064 2018-03-26

Publications (2)

Publication Number Publication Date
JP2019175846A JP2019175846A (ja) 2019-10-10
JP6879325B2 true JP6879325B2 (ja) 2021-06-02

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JP2019056065A Active JP6879325B2 (ja) 2018-03-26 2019-03-25 発光モジュールの製造方法及び発光モジュール

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Country Link
JP (1) JP6879325B2 (zh)
KR (1) KR102512369B1 (zh)
CN (1) CN110364515A (zh)
TW (1) TWI750466B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210001964A (ko) 2019-06-27 2021-01-06 니치아 카가쿠 고교 가부시키가이샤 발광 모듈
JP6864875B2 (ja) 2019-08-30 2021-04-28 日亜化学工業株式会社 発光モジュール及びその製造方法
EP4036414A4 (en) 2019-09-26 2023-10-18 Ebara Corporation VERTICAL MULTI-STAGE PUMP
JP6828794B1 (ja) 2019-11-29 2021-02-10 日亜化学工業株式会社 面発光光源
JP7111993B2 (ja) * 2019-12-20 2022-08-03 日亜化学工業株式会社 発光モジュールの製造方法
JP7140987B2 (ja) * 2019-12-25 2022-09-22 日亜化学工業株式会社 発光モジュール及び発光モジュールの製造方法
US11581460B2 (en) 2019-12-25 2023-02-14 Nichia Corporation Light emitting module and method for manufacturing light emitting module
JP6924958B1 (ja) * 2020-01-31 2021-08-25 日亜化学工業株式会社 面状光源
WO2021153561A1 (ja) 2020-01-31 2021-08-05 日亜化学工業株式会社 面状光源
JP7002714B2 (ja) * 2020-01-31 2022-02-04 日亜化学工業株式会社 発光モジュール、面状光源、及び発光モジュールの製造方法
TWI786715B (zh) 2020-07-21 2022-12-11 日商日亞化學工業股份有限公司 發光模組及面狀光源
JP7144694B2 (ja) 2020-07-31 2022-09-30 日亜化学工業株式会社 発光モジュール、面状光源、液晶表示装置
JP7270133B2 (ja) * 2020-08-31 2023-05-10 日亜化学工業株式会社 発光モジュールの製造方法
TWI807401B (zh) * 2020-08-31 2023-07-01 日商日亞化學工業股份有限公司 發光模組之製造方法
JP7239839B2 (ja) 2020-08-31 2023-03-15 日亜化学工業株式会社 発光モジュール
JP7277865B2 (ja) * 2020-10-29 2023-05-19 日亜化学工業株式会社 面状光源及びその製造方法

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JP4678256B2 (ja) * 2005-08-01 2011-04-27 ソニー株式会社 面状光源装置及びカラー液晶表示装置組立体
JP2007095674A (ja) 2005-08-30 2007-04-12 Showa Denko Kk 面光源装置および表示装置
US7378686B2 (en) * 2005-10-18 2008-05-27 Goldeneye, Inc. Light emitting diode and side emitting lens
JP2010008837A (ja) * 2008-06-30 2010-01-14 Hitachi Displays Ltd 液晶表示装置
US20110062469A1 (en) 2009-09-17 2011-03-17 Koninklijke Philips Electronics N.V. Molded lens incorporating a window element
CN102042562B (zh) 2009-10-16 2013-07-03 清华大学 导光板及背光模组
JP5684486B2 (ja) 2010-03-26 2015-03-11 株式会社住田光学ガラス 発光装置
DE102010028246A1 (de) * 2010-04-27 2011-10-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
WO2012101780A1 (ja) 2011-01-26 2012-08-02 日立コンシューマエレクトロニクス株式会社 液晶表示装置
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JP6118575B2 (ja) * 2013-02-12 2017-04-19 日亜化学工業株式会社 発光装置
JP2016533030A (ja) * 2013-07-24 2016-10-20 クーレッジ ライティング インコーポレイテッド 波長変換材料を組み込む発光ダイおよび関連方法
JP6119490B2 (ja) 2013-07-31 2017-04-26 ソニー株式会社 光源装置、および表示装置
JP6552190B2 (ja) 2014-12-11 2019-07-31 シチズン電子株式会社 発光装置及び発光装置の製造方法
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Also Published As

Publication number Publication date
KR102512369B1 (ko) 2023-03-20
KR20190112675A (ko) 2019-10-07
JP2019175846A (ja) 2019-10-10
TW202005112A (zh) 2020-01-16
TWI750466B (zh) 2021-12-21
CN110364515A (zh) 2019-10-22

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