JP6859736B2 - 電着液及びこれを用いた絶縁皮膜付き導体の製造方法 - Google Patents
電着液及びこれを用いた絶縁皮膜付き導体の製造方法 Download PDFInfo
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Description
[ポリイミド系樹脂ワニスの合成]
先ず、撹拌機、冷却管、窒素導入管及び温度計を備えた2リットルの四つ口フラスコ内に、極性溶剤と、イソシアネート成分と酸成分とを混合し、80〜130℃の温度に昇温してこの温度に2〜8時間保持して反応させることにより、ポリイミド系樹脂を得る。ここで、イソシアネート成分としては、ジフェニルメタン−4,4’−ジイソシアネート(MDI)、ジフェニルメタン−3,3’−ジイソシアネート、ジフェニルメタン−3,4’−ジイソシアネート、ジフェニルエーテル−4,4’−ジイソシアネート、ベンゾフェノン−4,4’−ジイソシアネート、ジフェニルスルホン−4,4’−ジイソシアネート等の芳香族ジイソシアネート等が挙げられ、酸成分としてはトリメリット酸無水物(TMA)、1,2,5−トリメリット酸(1,2,5−ETM)、ビフェニルテトラカルボン酸二無水物、ベンゾフェノンテトラカルボン酸二無水物、ジフェニルスルホンテトラカルボン酸二無水物、オキシジフタル酸二無水物(OPDA)、ピロメリット酸二無水物(PMDA)、4,4’−(2,2’−ヘキサフルオロイソプロピリデン)ジフタル酸二無水物等が挙げられる。その後、上記合成したポリイミド系樹脂を、極性溶剤により希釈してポリイミド系樹脂ワニスを調製する。
次いで、上記得られたポリイミド系樹脂ワニスを、有機溶剤で更に希釈し、塩基性化合物を加えた後、撹拌しつつ、室温下で水を添加する。これにより、メジアン径50〜400nmのポリイミド系樹脂粒子の分散液が得られる。
市販のフッ素樹脂粒子を水で希釈した後、撹拌することにより、メジアン径50〜500nmのフッ素樹脂粒子の分散液が得られる。
ポリイミド系樹脂粒子の分散液とフッ素樹脂粒子の分散液を混合することにより、電着液が得られる。
電着液の製造方法を説明する。
[ポリイミド系樹脂ワニスの合成]
先ず、撹拌機、冷却管、窒素導入管及び温度計を備えた2リットルの四つ口フラスコ内に、747gのN−メチル−2−ピロリドン(極性溶剤)と、298g(1.19モル)のジフェニルメタン−4,4’−ジイソシアネート(MDI、イソシアネート成分)と、227g(1.18モル)のトリメリット酸無水物(TMA、酸成分)とを投入して130℃まで昇温させた。この温度で約4時間反応させることにより、数平均分子量が17000のポリマー(ポリアミドイミド樹脂)を得た。その後、上記合成したポリアミドイミド樹脂を、N−メチル−2−ピロリドン(極性溶剤)で、ポリアミドイミド樹脂(不揮発分)の濃度が20質量%となるように希釈して、ポリアミドイミド樹脂ワニス(ポリアミドイミド樹脂:N−メチル−2−ピロリドン=20質量%:80質量%)を得た。
次いで、上記得られたポリアミドイミド樹脂ワニス62.5gを、N−メチル−2−ピロリドン140g(極性溶剤)で更に希釈し、トリ−n−プロピルアミン(塩基性化合物(塩基))0.5gを加えた後、この液を回転速度10000rpmの高速で撹拌しつつ、室温下(25℃)で水を47g添加した。これにより、メジアン径160nmのポリアミドイミド樹脂粒子の分散液(ポリアミドイミド樹脂粒子:N−メチル−2−ピロリドン:水:トリ−n−プロピルアミン=5質量%:76質量%:18.8質量%:0.2質量%)250gを得た。
フッ素樹脂粒子:水が60質量%:40質量%であるポリフロンPTFE−D(ダイキン工業社製)を水で希釈し、メジアン径200nmのフッ素樹脂粒子の分散液を得た(フッ素樹脂粒子:水=30質量%:70質量%)。
ポリイミド系樹脂粒子の分散液60gとフッ素樹脂粒子の分散液10gを混合し電着液を得た(ポリアミドイミド樹脂粒子:フッ素樹脂粒子:N−メチル−2−ピロリドン:水:トリ−n−プロピルアミン=4.3質量%:4.3質量%:65質量%:26.2質量%:0.2質量%)。なお、上記ポリアミドイミド樹脂粒子及びフッ素樹脂粒子が固形分であり、上記N−メチル−2−ピロリドン(極性溶剤)、水及びトリ−n−プロピルアミン(塩基)が分散媒である。
上記調製した電着液を用いて絶縁皮膜を作製した。具体的には、先ず、電着液を電着槽内に貯留し、この電着槽内の電着液の温度を20℃とした。次いで、直径及び長さがそれぞれ1mm及び300mmである銅線(導体)を陽極とし、上記電着槽内の電着液に挿入された円筒型の銅板を陰極とし、銅線と円筒型の銅板との間に直流電圧100Vを印加した状態で、銅線及び円筒型の銅板を電着槽内の電着液中に30秒間保持した。これにより銅線の表面に電着膜が形成された。次に、電着膜が形成された銅線を250℃のマッフル炉中に3分間静置し乾燥処理して、表面に厚さ40μmの絶縁皮膜が形成された銅線を得た。この絶縁皮膜付きの銅線を実施例1とした。
表1に示すように、ポリイミド系樹脂粒子及びフッ素系樹脂粒子の種類と、固形分中のポリイミド系樹脂粒子の含有割合と、固形分中のフッ素樹脂粒子の含有割合と、分散媒中の極性溶剤の含有割合と、分散媒中の水の含有割合と、分散媒中の塩基の含有割合と、ポリイミド系樹脂粒子のメジアン径とをそれぞれ変えて、実施例1と同様にして電着液を調製し、この電着液を用いて絶縁皮膜付き銅線を作製した。これらの絶縁皮膜付き銅線を実施例2〜10及び比較例1〜5とした。
実施例1〜10及び比較例1〜5の絶縁皮膜付き銅線の絶縁皮膜の外観を観察するとともに、比誘電率及び絶縁破壊電圧をそれぞれ測定した。具体的には、絶縁皮膜の外観は、目視により観察した。また、比誘電率は、LCRメーター(日置電機社製)を用いて、絶縁皮膜の静電容量と絶縁皮膜の膜厚から誘電率を算出し、この誘電率を真空の誘電率ε0(8.85×10-12F/m)で除することにより求めた。なお、絶縁皮膜の膜厚はマイクロメーター(ミツトヨ社製)を用いて測定した。更に、絶縁破壊電圧は、厚さ40μmの絶縁皮膜付きの導線に金属箔を巻付け、絶縁破壊試験機(東特塗料社製)を用いて測定した。その結果を表1に示す。
11 固形分
11a ポリイミド系樹脂粒子
11b フッ素樹脂粒子
12 導体
13 分散媒
14 絶縁皮膜
Claims (4)
- 分散媒と固形分からなり、
前記固形分が、ポリイミド系樹脂粒子とフッ素樹脂粒子とを含み、
前記固形分中の前記フッ素樹脂粒子の含有割合が、20〜70質量%であり、
前記ポリイミド系樹脂粒子のメジアン径が50〜400nmであり、
前記分散媒が、極性溶剤、水及び塩基を含み、
前記極性溶剤が前記水より高い沸点を有し、
前記分散媒中の前記極性溶媒の含有割合が59.8〜84.8質量%であり、
前記分散媒中の前記水の含有割合が15〜40質量%であり、
前記分散媒中の前記塩基の含有割合が0.1〜0.3質量%である
ことを特徴とする電着液。 - 前記ポリイミド系樹脂粒子が前記フッ素樹脂粒子より小さいメジアン径を有する請求項1記載の電着液。
- 請求項1又は2記載の電着液を用いて、導体表面に電着により絶縁皮膜を形成する絶縁皮膜付き導体の製造方法。
- 前記導体が金属線である請求項3記載の絶縁皮膜付き導体の製造方法。
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