JP6858576B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP6858576B2
JP6858576B2 JP2017014613A JP2017014613A JP6858576B2 JP 6858576 B2 JP6858576 B2 JP 6858576B2 JP 2017014613 A JP2017014613 A JP 2017014613A JP 2017014613 A JP2017014613 A JP 2017014613A JP 6858576 B2 JP6858576 B2 JP 6858576B2
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JP
Japan
Prior art keywords
adhesive layer
layer
conductive paste
semiconductor chip
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017014613A
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English (en)
Japanese (ja)
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JP2018125349A5 (enExample
JP2018125349A (ja
Inventor
直 荒井
直 荒井
良和 平林
良和 平林
秀敏 荒井
秀敏 荒井
小平　正司
正司 小平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2017014613A priority Critical patent/JP6858576B2/ja
Priority to US15/852,479 priority patent/US10121695B2/en
Publication of JP2018125349A publication Critical patent/JP2018125349A/ja
Publication of JP2018125349A5 publication Critical patent/JP2018125349A5/ja
Application granted granted Critical
Publication of JP6858576B2 publication Critical patent/JP6858576B2/ja
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Classifications

    • H10W20/075—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H10W20/063—
    • H10W20/42—
    • H10W20/47—
    • H10W70/60—
    • H10W70/685—
    • H10W72/012—
    • H10W74/012—
    • H10W74/15—
    • H10W72/072—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/222—
    • H10W72/225—
    • H10W72/241—
    • H10W72/252—
    • H10W72/253—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017014613A 2017-01-30 2017-01-30 半導体装置の製造方法 Active JP6858576B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017014613A JP6858576B2 (ja) 2017-01-30 2017-01-30 半導体装置の製造方法
US15/852,479 US10121695B2 (en) 2017-01-30 2017-12-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017014613A JP6858576B2 (ja) 2017-01-30 2017-01-30 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2018125349A JP2018125349A (ja) 2018-08-09
JP2018125349A5 JP2018125349A5 (enExample) 2019-12-12
JP6858576B2 true JP6858576B2 (ja) 2021-04-14

Family

ID=62980766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017014613A Active JP6858576B2 (ja) 2017-01-30 2017-01-30 半導体装置の製造方法

Country Status (2)

Country Link
US (1) US10121695B2 (enExample)
JP (1) JP6858576B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109729639B (zh) * 2018-12-24 2020-11-20 奥特斯科技(重庆)有限公司 在无芯基板上包括柱体的部件承载件
CN113711347A (zh) 2019-04-15 2021-11-26 大日本印刷株式会社 贯通电极基板、电子单元、贯通电极基板的制造方法以及电子单元的制造方法
CN111554639A (zh) * 2020-04-02 2020-08-18 珠海越亚半导体股份有限公司 嵌入式芯片封装及其制造方法
CN111668170B (zh) * 2020-06-05 2025-07-08 矽力杰半导体技术(杭州)有限公司 固晶结构及其制造方法
JP7449816B2 (ja) * 2020-08-21 2024-03-14 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光モジュール
CN114975610B (zh) * 2021-02-25 2026-01-16 广东美的白色家电技术创新中心有限公司 半导体器件组件及集成电路、电器设备
EP4099807A1 (en) * 2021-06-01 2022-12-07 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier interconnection and manufacturing method
CN114220785A (zh) * 2021-12-16 2022-03-22 华天科技(南京)有限公司 一种具有高可靠度焊点结构的散热倒装封装结构及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623352B2 (ja) * 1986-02-21 1994-03-30 東芝ケミカル株式会社 半導体素子接着用ペ−スト
JP2002076055A (ja) * 2000-08-22 2002-03-15 Hitachi Ltd 半導体装置の実装方法および実装構造
JP2005039240A (ja) * 2003-06-24 2005-02-10 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP4492233B2 (ja) * 2003-11-27 2010-06-30 株式会社デンソー 半導体チップの実装構造および半導体チップの実装方法
US8963340B2 (en) * 2011-09-13 2015-02-24 International Business Machines Corporation No flow underfill or wafer level underfill and solder columns
CN106233462B (zh) * 2014-04-14 2019-07-19 瑞萨电子株式会社 半导体器件以及半导体器件的制造方法
JP6467797B2 (ja) 2014-07-14 2019-02-13 凸版印刷株式会社 配線基板、配線基板を用いた半導体装置およびこれらの製造方法
JP6510897B2 (ja) * 2015-06-09 2019-05-08 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置

Also Published As

Publication number Publication date
US20180218941A1 (en) 2018-08-02
US10121695B2 (en) 2018-11-06
JP2018125349A (ja) 2018-08-09

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