JP6852479B2 - 近接センサ - Google Patents
近接センサ Download PDFInfo
- Publication number
- JP6852479B2 JP6852479B2 JP2017048296A JP2017048296A JP6852479B2 JP 6852479 B2 JP6852479 B2 JP 6852479B2 JP 2017048296 A JP2017048296 A JP 2017048296A JP 2017048296 A JP2017048296 A JP 2017048296A JP 6852479 B2 JP6852479 B2 JP 6852479B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- circuit board
- resin
- case body
- injection port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/20—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V3/00—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation
- G01V3/08—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices
- G01V3/10—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices using induction coils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/95—Proximity switches using a magnetic detector
- H03K17/9505—Constructional details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/95—Proximity switches using a magnetic detector
- H03K17/952—Proximity switches using a magnetic detector using inductive coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0073—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having specific features for mounting the housing on an external structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Description
本発明の第2の局面に基づく近接センサは、筐体と、検知コイルと、回路基板と、樹脂封止部とを備えている。上記検知コイルは、上記筐体に収容されており、上記回路基板は、上記筐体の内部の空間を仕切るように上記筐体に収容されている。上記回路基板には、上記検知コイルに電気的に接続された処理回路が設けられている。上記樹脂封止部は、上記筐体の内部の空間のうちの少なくとも一部を充填することで上記回路基板の少なくとも一部を覆うことにより、覆った部分の上記回路基板を封止している。上記筐体には、硬化することで上記樹脂封止部となる液状樹脂を注入するための樹脂注入口が設けられている。上記本発明の第2の局面に基づく近接センサにあっては、上記樹脂注入口に対向する部分の少なくとも一部を含むように、上記回路基板に切り欠き形状または開口形状を有する欠除部が設けられているとともに、上記回路基板に含まれる配線基板のうちの上記樹脂封止部によって封止された部分の稜部が、いずれも丸みを帯びた形状を有している。
Claims (5)
- 筐体と、
前記筐体に収容された検知コイルと、
前記筐体の内部の空間を仕切るように前記筐体に収容され、前記検知コイルに電気的に接続された処理回路が設けられた回路基板と、
前記筐体の内部の空間のうちの少なくとも一部を充填することで前記回路基板の少なくとも一部を覆うことにより、覆った部分の前記回路基板を封止する樹脂封止部とを備え、
前記筐体には、硬化することで前記樹脂封止部となる液状樹脂を注入するための樹脂注入口が設けられ、
前記筐体が、前端および後端が開口した筒状のケース本体と、前記検知コイルを収容するとともに、前記ケース本体の前端に挿入されることで前記ケース本体の前端を閉塞する有底筒状のコイルケースと、前記回路基板に接続されたケーブルを保持するとともに、前記ケース本体の後端に挿入されることで前記ケース本体の後端を閉塞するクランプとを含み、
前記回路基板が、前端が前記コイルケースに収容されるとともに後端が前記クランプに収容されるように前記ケース本体の軸方向に沿って延在することにより、前記回路基板の少なくとも一部が、前記クランプに対向し、
前記樹脂注入口が、前記クランプに設けられ、
前記ケース本体と前記コイルケースとの間に、前記筐体の内部の空間と前記筐体の外部の空間とを結ぶベントが設けられ、
前記樹脂注入口に対向する部分のうちの一部分を含むとともに前記樹脂注入口に対向する部分のうちの残りの部分を含まないように、前記回路基板に切り欠き形状または開口形状を有する欠除部が設けられ、
前記欠除部が、前記樹脂注入口に対向する部分である前記一部分から前記ケース本体の軸方向に沿って前記コイルケース側に向けて連続して延設された部分を含んでいる、近接センサ。 - 前記クランプが、前記ケース本体の軸方向に沿って、前記ケース本体に内挿された部分である前端部と、前記ケーブルを保持する部分である後端部と、前記前端部および前記後端部を結ぶ中間部とを含み、
前記樹脂注入口が、前記中間部に設けられている、請求項1に記載の近接センサ。 - 前記ケーブルが、複数の芯線と、前記複数の芯線を束ねるシースとを含み、
前記複数の芯線の各々が、前記樹脂注入口と前記欠除部とを結ぶ方向に沿って見た場合に、前記欠除部を迂回するように前記シースから引き出されて前記回路基板に接続されている、請求項1または2に記載の近接センサ。 - 前記回路基板に含まれる配線基板のうちの前記樹脂封止部によって封止された部分の稜部が、いずれも丸みを帯びた形状を有している、請求項1から3のいずれかに記載の近接センサ。
- 筐体と、
前記筐体に収容された検知コイルと、
前記筐体の内部の空間を仕切るように前記筐体に収容され、前記検知コイルに電気的に接続された処理回路が設けられた回路基板と、
前記筐体の内部の空間のうちの少なくとも一部を充填することで前記回路基板の少なくとも一部を覆うことにより、覆った部分の前記回路基板を封止する樹脂封止部とを備え、
前記筐体には、硬化することで前記樹脂封止部となる液状樹脂を注入するための樹脂注入口が設けられ、
前記樹脂注入口に対向する部分の少なくとも一部を含むように、前記回路基板に切り欠き形状または開口形状を有する欠除部が設けられ、
前記回路基板に含まれる配線基板のうちの前記樹脂封止部によって封止された部分の稜部が、いずれも丸みを帯びた形状を有している、近接センサ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017048296A JP6852479B2 (ja) | 2017-03-14 | 2017-03-14 | 近接センサ |
US15/839,871 US10466073B2 (en) | 2017-03-14 | 2017-12-13 | Proximity sensor |
DE102017130060.0A DE102017130060A1 (de) | 2017-03-14 | 2017-12-15 | Näherungssensor |
CN201711369918.3A CN108572395B (zh) | 2017-03-14 | 2017-12-18 | 接近传感器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017048296A JP6852479B2 (ja) | 2017-03-14 | 2017-03-14 | 近接センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018152266A JP2018152266A (ja) | 2018-09-27 |
JP6852479B2 true JP6852479B2 (ja) | 2021-03-31 |
Family
ID=63372068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017048296A Active JP6852479B2 (ja) | 2017-03-14 | 2017-03-14 | 近接センサ |
Country Status (4)
Country | Link |
---|---|
US (1) | US10466073B2 (ja) |
JP (1) | JP6852479B2 (ja) |
CN (1) | CN108572395B (ja) |
DE (1) | DE102017130060A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD894131S1 (en) * | 2018-08-02 | 2020-08-25 | Lester Electrical | Plug assembly |
CN109443408A (zh) * | 2018-10-29 | 2019-03-08 | 宜科(天津)电子有限公司 | 接近传感器 |
JP7033274B2 (ja) * | 2018-11-12 | 2022-03-10 | オムロン株式会社 | センサ及びその製造方法 |
JP7044043B2 (ja) | 2018-11-30 | 2022-03-30 | オムロン株式会社 | センサ |
DE202019004415U1 (de) * | 2019-10-28 | 2019-11-06 | K.W.H. Ciclosport Vertriebs GmbH | Sensorvorrichtung |
DE102020212238A1 (de) | 2020-09-29 | 2022-03-31 | Pepperl+Fuchs Se | Induktive Sensoreinrichtung |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08111132A (ja) * | 1994-10-12 | 1996-04-30 | Japan Aviation Electron Ind Ltd | 照光式キートップ |
JP3279187B2 (ja) * | 1995-07-18 | 2002-04-30 | オムロン株式会社 | 近接センサとその製造方法 |
JP3844073B2 (ja) | 2002-09-13 | 2006-11-08 | オムロン株式会社 | 近接センサ |
EP1416635B1 (en) * | 2002-11-01 | 2012-12-12 | Omron Corporation | Sensor device |
JP5263193B2 (ja) | 2010-02-04 | 2013-08-14 | オムロン株式会社 | 近接センサ |
JP6111751B2 (ja) * | 2013-03-08 | 2017-04-12 | オムロン株式会社 | 電子機器およびその製造方法 |
JP6291993B2 (ja) | 2014-04-18 | 2018-03-14 | オムロン株式会社 | 多光軸光電センサ |
US10061057B2 (en) | 2015-08-21 | 2018-08-28 | Stmicroelectronics (Research & Development) Limited | Molded range and proximity sensor with optical resin lens |
-
2017
- 2017-03-14 JP JP2017048296A patent/JP6852479B2/ja active Active
- 2017-12-13 US US15/839,871 patent/US10466073B2/en active Active
- 2017-12-15 DE DE102017130060.0A patent/DE102017130060A1/de active Pending
- 2017-12-18 CN CN201711369918.3A patent/CN108572395B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN108572395B (zh) | 2019-12-24 |
US10466073B2 (en) | 2019-11-05 |
JP2018152266A (ja) | 2018-09-27 |
CN108572395A (zh) | 2018-09-25 |
US20180266851A1 (en) | 2018-09-20 |
DE102017130060A1 (de) | 2018-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6852479B2 (ja) | 近接センサ | |
US8624585B2 (en) | Proximity sensor | |
US20060244439A1 (en) | Moving object detection device | |
US9705263B2 (en) | Plug connector assembly with light pipe and plural LEDs | |
EP1416635B1 (en) | Sensor device | |
JP2005265667A (ja) | 圧力センサおよびその製造方法 | |
JP2010153861A (ja) | 発光ダイオードパッケージ構造 | |
KR101229459B1 (ko) | 차량용 센서 조립체 및 이의 제조 방법 | |
JP6299199B2 (ja) | 電子機器 | |
KR102514493B1 (ko) | 센서의 제조 방법 | |
JP6686833B2 (ja) | 導電路 | |
JP2008232917A (ja) | 回転センサ | |
CN109920682B (zh) | 开关 | |
JP3759529B2 (ja) | エンコーダ付モータ | |
JP2017092192A (ja) | 電子機器の製造方法および電子機器 | |
JP5222233B2 (ja) | 光通信モジュール | |
JP2008244151A (ja) | 発光装置 | |
JP2005071769A (ja) | コネクタ | |
JP2017092193A (ja) | 電子機器 | |
KR102573360B1 (ko) | 센서 및 그 제조 방법 | |
JP2006220649A (ja) | 回転検出装置 | |
JP2007170966A (ja) | 回転検出センサ | |
CN109791853B (zh) | 位置检测开关及其制造方法 | |
US10045453B1 (en) | Electronic apparatus and electric cable sealed therein | |
JP2013165165A (ja) | 発光ダイオード |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180115 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200109 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200925 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201006 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201207 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210209 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210222 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6852479 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |