JP6847729B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP6847729B2 JP6847729B2 JP2017063638A JP2017063638A JP6847729B2 JP 6847729 B2 JP6847729 B2 JP 6847729B2 JP 2017063638 A JP2017063638 A JP 2017063638A JP 2017063638 A JP2017063638 A JP 2017063638A JP 6847729 B2 JP6847729 B2 JP 6847729B2
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- Prior art keywords
- cutting
- unit
- blade
- cutting blade
- spindle
- Prior art date
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- 238000003754 machining Methods 0.000 claims description 37
- 239000012530 fluid Substances 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 230000009977 dual effect Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
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- 239000000919 ceramic Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
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- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/04—Protective covers for the grinding wheel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Automatic Tool Replacement In Machine Tools (AREA)
Description
本発明の実施形態1に係る切削装置を図面に基いて説明する。図1は、実施形態1に係る切削装置の構成例を示す斜視図である。
本発明の実施形態2に係る切削装置を図面に基いて説明する。図17は、実施形態2に係る切削装置の切削ユニットに装着される切削ブレードとケースとを示す斜視図である。図17は、実施形態1と同一部分に同一符号を付して説明を省略する。
10 チャックテーブル
20 切削ユニット
20−1 第1の切削ユニット
20−2 第2の切削ユニット
21 切削ブレード
21−1 第1の切削ブレード
21−2 第2の切削ブレード
22 スピンドル
22−1 第1のスピンドル
22−2 第2のスピンドル
23 スピンドルハウジング
29 フランジ
30 ブレードカバー
31 固定部
32 可動部
60 ケース
71 バーコード(識別コード)
80 読み取りユニット
100 制御ユニット
101 ブレード情報登録部
102 加工条件登録部
201 被加工物
321 切削水ノズル(加工液ノズル)
Claims (3)
- 第1のスピンドルの先端に固定されたフランジに第1の切削ブレードが挟持され装着される第1の切削ユニットと、第2のスピンドルの先端に固定されたフランジに第2の切削ブレードが挟持され装着される第2の切削ユニットと、該切削ブレードに加工される被加工物を保持するチャックテーブルと、装着する該切削ブレードの品種を登録するブレード情報登録部を含み各構成要素を制御する制御ユニットと、を備える切削装置であって、
該切削ユニットは、
該スピンドルを回転自在に支持するスピンドルハウジングに固定され、該切削ブレードを覆って加工液を供給するブレードカバーを備え、
該ブレードカバーは、
該スピンドルハウジングに固定された固定部と、
加工液ノズルを該固定部に開閉可能に装着し、該加工液ノズルが該切削ブレードに近接した近接位置と、該切削ブレードから離間し該フランジに該切削ブレードを着脱する離間位置と、に選択的に位置付け可能な可動部と、を備え、
該制御ユニットは、
該第1の切削ブレードを装着する際に該第1の切削ブレードの品種が登録されると、該第2の切削ユニットの該ブレードカバーの可動部は離間位置に設定されないが、該第1の切削ユニットの該ブレードカバーの可動部は離間位置に設定され、
該第2の切削ブレードを装着する際に該第2の切削ブレードの品種が登録されると、該第1の切削ユニットの該ブレードカバーの可動部は離間位置に設定されないが、該第2の切削ユニットの該ブレードカバーの可動部は離間位置に設定されることを特徴とする切削装置。 - 該切削ブレード又は該切削ブレードを収容するケースに設置され該切削ブレードの品種情報を含む識別コードを読み取る読み取りユニットを備え、
該ブレード情報登録部には、該読み取りユニットによって読み取られた該品種情報が登録されることを特徴とする請求項1に記載の切削装置。 - 該制御ユニットは、該切削ブレードと該スピンドルの組合せを含む加工条件を登録する加工条件登録部を備え、登録された該切削ブレードの該品種と該スピンドルの組合せから、該ブレードカバーの可動部を離間位置に設定する該切削ユニットを決定する請求項1に記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017063638A JP6847729B2 (ja) | 2017-03-28 | 2017-03-28 | 切削装置 |
KR1020180031393A KR102325710B1 (ko) | 2017-03-28 | 2018-03-19 | 절삭 장치 |
TW107110244A TWI742263B (zh) | 2017-03-28 | 2018-03-26 | 切割裝置 |
CN201810251467.1A CN108655931B (zh) | 2017-03-28 | 2018-03-26 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017063638A JP6847729B2 (ja) | 2017-03-28 | 2017-03-28 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018166178A JP2018166178A (ja) | 2018-10-25 |
JP6847729B2 true JP6847729B2 (ja) | 2021-03-24 |
Family
ID=63782480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017063638A Active JP6847729B2 (ja) | 2017-03-28 | 2017-03-28 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6847729B2 (ja) |
KR (1) | KR102325710B1 (ja) |
CN (1) | CN108655931B (ja) |
TW (1) | TWI742263B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7157674B2 (ja) * | 2019-01-30 | 2022-10-20 | 株式会社ディスコ | ブレード交換ユニット |
JP7282461B2 (ja) | 2019-04-16 | 2023-05-29 | 株式会社ディスコ | 検査装置、及び加工装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2892459B2 (ja) | 1990-08-20 | 1999-05-17 | 株式会社ディスコ | 精密切削装置におけるブレードの位置調整方法 |
JP3446770B2 (ja) * | 1993-10-28 | 2003-09-16 | 関西日本電気株式会社 | アウタリードボンダ |
US5636745A (en) * | 1994-10-27 | 1997-06-10 | Illinois Tool Works Inc. | Tray for a component and an apparatus for accurately placing a component within the tray |
JP4192135B2 (ja) * | 2004-09-29 | 2008-12-03 | 株式会社東芝 | 加工装置及び加工方法 |
JP4783568B2 (ja) | 2004-12-28 | 2011-09-28 | 株式会社ディスコ | 切削装置及び被加工物の切削方法 |
JPWO2008010264A1 (ja) * | 2006-07-18 | 2009-12-10 | 三菱電機株式会社 | 数値制御装置 |
CN201275755Y (zh) * | 2008-07-14 | 2009-07-22 | 深圳创维-Rgb电子有限公司 | 一种工具存放装置及工具存放系统 |
JP5342826B2 (ja) * | 2008-07-29 | 2013-11-13 | 株式会社ディスコ | 切削加工装置 |
JP5457131B2 (ja) * | 2009-10-07 | 2014-04-02 | 株式会社ディスコ | ブレード交換装置 |
JP2014143323A (ja) * | 2013-01-24 | 2014-08-07 | Disco Abrasive Syst Ltd | 加工装置 |
JP6257360B2 (ja) * | 2014-02-04 | 2018-01-10 | 株式会社ディスコ | ブレードカバー装置 |
JP6327954B2 (ja) * | 2014-05-30 | 2018-05-23 | 株式会社ディスコ | 加工装置 |
JP6279431B2 (ja) * | 2014-08-26 | 2018-02-14 | Dmg森精機株式会社 | 工作機械 |
-
2017
- 2017-03-28 JP JP2017063638A patent/JP6847729B2/ja active Active
-
2018
- 2018-03-19 KR KR1020180031393A patent/KR102325710B1/ko active IP Right Grant
- 2018-03-26 CN CN201810251467.1A patent/CN108655931B/zh active Active
- 2018-03-26 TW TW107110244A patent/TWI742263B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI742263B (zh) | 2021-10-11 |
CN108655931B (zh) | 2021-11-23 |
KR20180109698A (ko) | 2018-10-08 |
CN108655931A (zh) | 2018-10-16 |
KR102325710B1 (ko) | 2021-11-11 |
JP2018166178A (ja) | 2018-10-25 |
TW201836798A (zh) | 2018-10-16 |
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