JP6824402B2 - 三次元印刷 - Google Patents
三次元印刷 Download PDFInfo
- Publication number
- JP6824402B2 JP6824402B2 JP2019526232A JP2019526232A JP6824402B2 JP 6824402 B2 JP6824402 B2 JP 6824402B2 JP 2019526232 A JP2019526232 A JP 2019526232A JP 2019526232 A JP2019526232 A JP 2019526232A JP 6824402 B2 JP6824402 B2 JP 6824402B2
- Authority
- JP
- Japan
- Prior art keywords
- methacrylate
- acrylate
- polymer particles
- ether
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010146 3D printing Methods 0.000 title claims description 34
- 239000002245 particle Substances 0.000 claims description 219
- 239000012530 fluid Substances 0.000 claims description 177
- 229920000642 polymer Polymers 0.000 claims description 171
- 239000011230 binding agent Substances 0.000 claims description 163
- 229910052751 metal Inorganic materials 0.000 claims description 150
- 239000002184 metal Substances 0.000 claims description 150
- 239000000843 powder Substances 0.000 claims description 138
- 239000000203 mixture Substances 0.000 claims description 55
- 239000004816 latex Substances 0.000 claims description 53
- 229920000126 latex Polymers 0.000 claims description 53
- 239000000178 monomer Substances 0.000 claims description 50
- -1 polyoxyethylene Polymers 0.000 claims description 49
- 239000007788 liquid Substances 0.000 claims description 45
- 239000003981 vehicle Substances 0.000 claims description 38
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 36
- 239000002904 solvent Substances 0.000 claims description 30
- 238000007639 printing Methods 0.000 claims description 25
- 239000004094 surface-active agent Substances 0.000 claims description 25
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 22
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 22
- 230000004927 fusion Effects 0.000 claims description 22
- 230000002209 hydrophobic effect Effects 0.000 claims description 20
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 claims description 15
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 15
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 claims description 15
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims description 13
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 12
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 10
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 9
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 7
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 7
- 125000005037 alkyl phenyl group Chemical group 0.000 claims description 7
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 7
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 7
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 7
- XTJDUBPOTVNQPI-UHFFFAOYSA-N (2-nonylphenyl) 2-methylprop-2-enoate Chemical class CCCCCCCCCC1=CC=CC=C1OC(=O)C(C)=C XTJDUBPOTVNQPI-UHFFFAOYSA-N 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 6
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 claims description 6
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 claims description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 6
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 6
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims description 6
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 claims description 6
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims description 6
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 6
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 claims description 6
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 claims description 6
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims description 6
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 claims description 6
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 claims description 6
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 claims description 6
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 claims description 6
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 claims description 6
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 claims description 6
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 claims description 5
- SLBOQBILGNEPEB-UHFFFAOYSA-N 1-chloroprop-2-enylbenzene Chemical compound C=CC(Cl)C1=CC=CC=C1 SLBOQBILGNEPEB-UHFFFAOYSA-N 0.000 claims description 5
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims description 5
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 claims description 5
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 claims description 5
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 5
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 claims description 5
- IBDVWXAVKPRHCU-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)ethyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OCCOC(=O)C(C)=C IBDVWXAVKPRHCU-UHFFFAOYSA-N 0.000 claims description 5
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 claims description 5
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims description 5
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 5
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 claims description 5
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims description 5
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 claims description 5
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims description 5
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 5
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 5
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 5
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 claims description 5
- TVWTZAGVNBPXHU-FOCLMDBBSA-N dioctyl (e)-but-2-enedioate Chemical compound CCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCC TVWTZAGVNBPXHU-FOCLMDBBSA-N 0.000 claims description 5
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 claims description 5
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 claims description 5
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 5
- 229920001451 polypropylene glycol Polymers 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- OCDWICPYKQMQSQ-UHFFFAOYSA-N docosyl 2-methylprop-2-enoate Chemical class CCCCCCCCCCCCCCCCCCCCCCOC(=O)C(C)=C OCDWICPYKQMQSQ-UHFFFAOYSA-N 0.000 claims description 4
- FURYAADUZGZUGQ-UHFFFAOYSA-N phenoxybenzene;sulfuric acid Chemical class OS(O)(=O)=O.C=1C=CC=CC=1OC1=CC=CC=C1 FURYAADUZGZUGQ-UHFFFAOYSA-N 0.000 claims description 4
- LORVPHHKJFSORQ-UHFFFAOYSA-N 1-[1-(1-butoxypropan-2-yloxy)propan-2-yloxy]propan-2-ol Chemical compound CCCCOCC(C)OCC(C)OCC(C)O LORVPHHKJFSORQ-UHFFFAOYSA-N 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims 3
- 241000282376 Panthera tigris Species 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 2
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 1
- 239000004035 construction material Substances 0.000 description 106
- 239000004566 building material Substances 0.000 description 79
- 238000005245 sintering Methods 0.000 description 58
- 238000010438 heat treatment Methods 0.000 description 46
- 238000000034 method Methods 0.000 description 46
- 238000010276 construction Methods 0.000 description 31
- 239000012071 phase Substances 0.000 description 27
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 239000007789 gas Substances 0.000 description 18
- 230000004913 activation Effects 0.000 description 17
- 230000008018 melting Effects 0.000 description 17
- 238000002844 melting Methods 0.000 description 17
- 239000007787 solid Substances 0.000 description 15
- 238000000197 pyrolysis Methods 0.000 description 14
- 230000009477 glass transition Effects 0.000 description 13
- 238000005979 thermal decomposition reaction Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 230000005496 eutectics Effects 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 238000007641 inkjet printing Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000003146 anticoagulant agent Substances 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 239000003139 biocide Substances 0.000 description 5
- 238000009835 boiling Methods 0.000 description 5
- 229910001092 metal group alloy Inorganic materials 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000003242 anti bacterial agent Substances 0.000 description 4
- 239000013590 bulk material Substances 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- PWQNOLAKMCLNJI-KTKRTIGZSA-N 2-[2-[2-[(z)-octadec-9-enoxy]ethoxy]ethoxy]ethyl dihydrogen phosphate Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCOCCOCCOP(O)(O)=O PWQNOLAKMCLNJI-KTKRTIGZSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 239000011258 core-shell material Substances 0.000 description 3
- 239000006184 cosolvent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920000140 heteropolymer Polymers 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 239000002736 nonionic surfactant Substances 0.000 description 3
- 229940093440 oleth-3-phosphate Drugs 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 3
- 239000012798 spherical particle Substances 0.000 description 3
- 125000000391 vinyl group Chemical class [H]C([*])=C([H])[H] 0.000 description 3
- 239000000080 wetting agent Substances 0.000 description 3
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- XUDBVJCTLZTSDC-UHFFFAOYSA-N 2-ethenylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C=C XUDBVJCTLZTSDC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 229910000684 Cobalt-chrome Inorganic materials 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 2
- 150000003869 acetamides Chemical class 0.000 description 2
- 229940091181 aconitic acid Drugs 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 235000010323 ascorbic acid Nutrition 0.000 description 2
- 229960005070 ascorbic acid Drugs 0.000 description 2
- 239000011668 ascorbic acid Substances 0.000 description 2
- DMSMPAJRVJJAGA-UHFFFAOYSA-N benzo[d]isothiazol-3-one Chemical compound C1=CC=C2C(=O)NSC2=C1 DMSMPAJRVJJAGA-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 2
- 239000010952 cobalt-chrome Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000003948 formamides Chemical class 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000003352 sequestering agent Substances 0.000 description 2
- FVEFRICMTUKAML-UHFFFAOYSA-M sodium tetradecyl sulfate Chemical compound [Na+].CCCCC(CC)CCC(CC(C)C)OS([O-])(=O)=O FVEFRICMTUKAML-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-N trans-cinnamic acid Chemical compound OC(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 229920002554 vinyl polymer Chemical class 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- APAUNQLFVGBQQW-UHFFFAOYSA-N (1,2,2-trimethylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C)CCCCC1(C)C APAUNQLFVGBQQW-UHFFFAOYSA-N 0.000 description 1
- FQOWJGGXNSRNJS-YFKPBYRVSA-N (2s)-2-(2-methylprop-2-enoylamino)propanoic acid Chemical compound OC(=O)[C@H](C)NC(=O)C(C)=C FQOWJGGXNSRNJS-YFKPBYRVSA-N 0.000 description 1
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- WJWWWPAIEGRAMF-UHFFFAOYSA-N 2-(sulfomethylidene)butanoic acid Chemical compound CCC(C(O)=O)=CS(O)(=O)=O WJWWWPAIEGRAMF-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- STVDIZSDTABYLF-UHFFFAOYSA-N 2-[hydroxy(prop-2-enoyl)amino]acetic acid Chemical compound OC(=O)CN(O)C(=O)C=C STVDIZSDTABYLF-UHFFFAOYSA-N 0.000 description 1
- IJVRPNIWWODHHA-UHFFFAOYSA-N 2-cyanoprop-2-enoic acid Chemical compound OC(=O)C(=C)C#N IJVRPNIWWODHHA-UHFFFAOYSA-N 0.000 description 1
- 229940100555 2-methyl-4-isothiazolin-3-one Drugs 0.000 description 1
- XBACSBFKXGHTIS-UHFFFAOYSA-N 2-methyl-5-sulfopent-2-enoic acid Chemical compound OC(=O)C(C)=CCCS(O)(=O)=O XBACSBFKXGHTIS-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- KFNGWPXYNSJXOP-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propane-1-sulfonic acid Chemical compound CC(=C)C(=O)OCCCS(O)(=O)=O KFNGWPXYNSJXOP-UHFFFAOYSA-N 0.000 description 1
- UYRCWWINMMLRGJ-UHFFFAOYSA-N 3-ethenoxypropane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCOC=C UYRCWWINMMLRGJ-UHFFFAOYSA-N 0.000 description 1
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 1
- NYUTUWAFOUJLKI-UHFFFAOYSA-N 3-prop-2-enoyloxypropane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCOC(=O)C=C NYUTUWAFOUJLKI-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- MAGFQRLKWCCTQJ-UHFFFAOYSA-N 4-ethenylbenzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=C(C=C)C=C1 MAGFQRLKWCCTQJ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910003407 AlSi10Mg Inorganic materials 0.000 description 1
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 1
- YNNXHEPZKJCMTC-QRPNPIFTSA-N C(C)(=O)O.C(CC)N[C@@H](CCCCN)C(=O)O Chemical compound C(C)(=O)O.C(CC)N[C@@H](CCCCN)C(=O)O YNNXHEPZKJCMTC-QRPNPIFTSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RUPBZQFQVRMKDG-UHFFFAOYSA-M Didecyldimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCC[N+](C)(C)CCCCCCCCCC RUPBZQFQVRMKDG-UHFFFAOYSA-M 0.000 description 1
- 240000002989 Euphorbia neriifolia Species 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 244000235659 Rubus idaeus Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910000883 Ti6Al4V Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- WAIPAZQMEIHHTJ-UHFFFAOYSA-N [Cr].[Co] Chemical compound [Cr].[Co] WAIPAZQMEIHHTJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- ZUQAPLKKNAQJAU-UHFFFAOYSA-N acetylenediol Chemical compound OC#CO ZUQAPLKKNAQJAU-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-N angelic acid Chemical compound C\C=C(\C)C(O)=O UIERETOOQGIECD-ARJAWSKDSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000004599 antimicrobial Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 239000008135 aqueous vehicle Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- XDSGMUJLZDSCPA-UHFFFAOYSA-N diazanium;phenoxybenzene;sulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=O.C=1C=CC=CC=1OC1=CC=CC=C1 XDSGMUJLZDSCPA-UHFFFAOYSA-N 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical group OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-M ethenesulfonate Chemical compound [O-]S(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-M 0.000 description 1
- BNKAXGCRDYRABM-UHFFFAOYSA-N ethenyl dihydrogen phosphate Chemical compound OP(O)(=O)OC=C BNKAXGCRDYRABM-UHFFFAOYSA-N 0.000 description 1
- VEWLDLAARDMXSB-UHFFFAOYSA-N ethenyl sulfate;hydron Chemical compound OS(=O)(=O)OC=C VEWLDLAARDMXSB-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002687 nonaqueous vehicle Substances 0.000 description 1
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical class C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 235000021013 raspberries Nutrition 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/16—Formation of a green body by embedding the binder within the powder bed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/32—Process control of the atmosphere, e.g. composition or pressure in a building chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/50—Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/10—Auxiliary heating means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1017—Multiple heating or additional steps
- B22F3/1021—Removal of binder or filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/295—Heating elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/364—Conditioning of environment
- B29C64/371—Conditioning of environment using an environment other than air, e.g. inert gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
- C08L13/02—Latex
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/53—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/60—Planarisation devices; Compression devices
- B22F12/63—Rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2201/00—Treatment under specific atmosphere
- B22F2201/01—Reducing atmosphere
- B22F2201/013—Hydrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2201/00—Treatment under specific atmosphere
- B22F2201/02—Nitrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2201/00—Treatment under specific atmosphere
- B22F2201/04—CO or CO2
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2201/00—Treatment under specific atmosphere
- B22F2201/20—Use of vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2304/00—Physical aspects of the powder
- B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
- B22F3/1007—Atmosphere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/08—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of toothed articles, e.g. gear wheels; of cam discs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Automation & Control Theory (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Powder Metallurgy (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Producing Shaped Articles From Materials (AREA)
Description
いくつかの例では、本明細書に記載されているのは、以下を含む三次元印刷用の組成物である:金属粉末構築材料であって、約10μmから約250μmの平均粒子サイズを有する金属粉末構築材料;ならびに以下を含む結合剤流体:水性液体ビヒクル、および該水性液体ビヒクル中に分散されたラテックスポリマー粒子、ここでラテックスポリマー粒子は約10nmから約300nmの平均粒子サイズを有し、ここでラテックスポリマー粒子は、(A)共重合性界面活性剤および(B)スチレン、p−メチルスチレン、α−メチルスチレン、メタクリル酸、アクリル酸、アクリルアミド、メタクリルアミド、2−ヒドロキシエチルアクリレート、2−ヒドロキシエチルメタクリレート、2−ヒドロキシプロピルアクリレート、2−ヒドロキシプロピルメタクリレート、メチルメタクリレート、ヘキシルアクリレート、ヘキシルメタクリレート、ブチルアクリレート、ブチルメタクリレート、エチルアクリレート、エチルメタクリレート、2−エチルヘキシルアクリレート、2−エチルヘキシルメタクリレート、プロピルアクリレート、プロピルメタクリレート、オクタデシルアクリレート、オクタデシルメタクリレート、ステアリルメタクリレート、ビニルベンジルクロリド、イソボルニルアクリレート、テトラヒドロフルフリルアクリレート、2−フェノキシエチルメタクリレート、ベンジルメタクリレート、ベンジルアクリレート、エトキシル化ノニルフェノールメタクリレート、エトキシル化ベヘニルメタクリレート、ポリプロピレングリコールモノアクリレート、イソボルニルメタクリレート、シクロヘキシルメタクリレート、シクロヘキシルアクリレート、t−ブチルメタクリレート、n−オクチルメタクリレート、ラウリルメタクリレート、トリデシルメタクリレート、アルコキシル化テトラヒドロフルフリルアクリレート、イソデシルアクリレート、イソボルニルメタクリレート、イソボルニルアクリレート、ジメチルマレエート、ジオクチルマレエート、アセトアセトキシエチルメタクリレート、ジアセトンアクリルアミド、N−ビニルイミダゾール、N−ビニルカルバゾール、N−ビニル−カプロラクタム、またはそれらの組み合わせから製造される。
いくつかの例では、本明細書で開示されるのは、三次元物体を印刷する方法であり、該方法は(i)金属粉末構築材料を堆積すること、ここで金属粉末構築材料は約10μmから約250μmの平均粒子サイズを有し;(ii)金属粉末構築材料の少なくとも一部分に結合剤流体を選択的に適用すること、ここで結合剤流体は、水性液体ビヒクルと、水性液体ビヒクル中に分散したラテックスポリマー粒子とを含み;(iii)金属粉末構築材料上に選択的に適用された結合剤流体を約40℃から約180℃の温度に加熱すること;ならびに(iv)(i)、(ii)、および(iii)を少なくとも1回繰り返して三次元物体を形成することを含む。
図1を参照すると、3D印刷システム10の一例が示されている。3D印刷システム10が追加の構成要素を含み得ること、および本明細書に記載の構成要素のうちのいくつかが除去および/または修正され得ることを理解されたい。さらに、図1に示す3D印刷システム10の構成要素は一定の縮尺で描かれていないことがあり、したがって3D印刷システム10は、そこに示されている以外の異なるサイズおよび/または構成を有することがある。
一例では、金属粉末構築材料16は、1つの元素からなる単相金属材料である。この例では、焼結温度は単一元素の融点より低くてもよい。
図1に示されるように、印刷システム10はまた、ここに開示される結合剤流体36(図2Cに示される)を含み得るアプリケータ24を含む。
本明細書に開示されている例では、ポリマー粒子は液体ビヒクル中に分散させることができる。ポリマー粒子は、任意の形態、例えば、単相、コアシェル、部分的な閉塞、多ローブ、またはそれらの組み合わせを有することができる。
いくつかの例では、結合剤流体36はポリマー粒子に加えて融合溶媒を含む。これらの例では、金属粉末構築材料粒子16を一時的に互いに結合させて硬化グリーン部品42’を形成するために、融合溶媒がポリマー粒子を可塑化し、熱に曝されるとポリマー粒子の融合を促進する。いくつかの例では、結合剤流体36は、ポリマー粒子と融合溶媒(他の成分を含まない)からなってもよい。これらの例では、液体ビヒクルは融合溶媒(他の成分を含まない)からなり、融合溶媒は結合剤流体36の残部を構成する。
他の適切な結合剤流体成分の例としては、共溶媒、界面活性剤、抗菌剤、コゲーション防止剤、粘度調整剤、pH調整剤および/または金属イオン封鎖剤が挙げられる。結合剤流体36中の共溶媒および/または界面活性剤の存在は、金属粉末構築材料16との特定の湿潤挙動を得るのを助け得る。
ラテックス調製A−対照
ラテックス調製B
サーマルインクジェット印刷−結合剤流体配合物
ピエゾ印刷−結合剤流体配合物
Claims (13)
- 金属粉末構築材料、ここで前記金属粉末構築材料は、10μmから250μmの平均粒子サイズを有し;ならびに
2−ピロリジノン、1−(2−ヒドロキシエチル)−2−ピロリドン、トリプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノプロピルエーテル、トリプロピレングリコールモノn−ブチルエーテル、プロピレングリコールフェニルエーテル、ジプロピレングリコールメチルエーテルアセテート、ジエチレングリコールモノブチルエーテル、ジエチレングリコールモノヘキシルエーテル、エチレングリコールフェニルエーテル、ジエチレングリコールモノn−ブチルエーテルアセテート、エチレングリコールモノn−ブチルエーテルアセテート、2−メチル−1,3−プロパンジオール、およびそれらの組み合わせからなる群から選択される融合溶媒を含む水性液体ビヒクル、および
前記水性液体ビヒクル中に分散したラテックスポリマー粒子を含む
結合剤流体を含み、
ここで前記ラテックスポリマー粒子は、10nmから300nmの平均粒子サイズを有し、
ここで前記ラテックスポリマー粒子は、(A)共重合性界面活性剤および(B)メタクリル酸、アクリル酸、アクリルアミド、メタクリルアミドまたはそれらの組み合わせからなる群から選択される高T g 親水性モノマー、およびスチレン、p−メチルスチレン、α−メチルスチレン、2−ヒドロキシエチルアクリレート、2−ヒドロキシエチルメタクリレート、2−ヒドロキシプロピルアクリレート、2−ヒドロキシプロピルメタクリレート、メチルメタクリレート、ヘキシルアクリレート、ヘキシルメタクリレート、ブチルアクリレート、ブチルメタクリレート、エチルアクリレート、エチルメタクリレート、2−エチルヘキシルアクリレート、2−エチルヘキシルメタクリレート、プロピルアクリレート、プロピルメタクリレート、オクタデシルアクリレート、オクタデシルメタクリレート、ステアリルメタクリレート、ビニルベンジルクロリド、テトラヒドロフルフリルアクリレート、2−フェノキシエチルメタクリレート、ベンジルメタクリレート、ベンジルアクリレート、エトキシル化ノニルフェノールメタクリレート、エトキシル化ベヘニルメタクリレート、ポリプロピレングリコールモノアクリレート、シクロヘキシルメタクリレート、シクロヘキシルアクリレート、t−ブチルメタクリレート、n−オクチルメタクリレート、ラウリルメタクリレート、トリデシルメタクリレート、アルコキシル化テトラヒドロフルフリルアクリレート、イソデシルアクリレート、イソボルニルメタクリレート、イソボルニルアクリレート、ジメチルマレエート、ジオクチルマレエート、アセトアセトキシエチルメタクリレート、ジアセトンアクリルアミド、N−ビニルイミダゾール、N−ビニルカルバゾール、およびN−ビニル−カプロラクタム、またはそれらの組み合わせから選択される低T g 疎水性モノマーから製造される、三次元印刷用組成物。 - 前記ラテックスポリマー粒子は、2−フェノキシエチルメタクリレート、シクロヘキシルメタクリレート、シクロヘキシルアクリレート、およびメタクリル酸から調製される、請求項1に記載の組成物。
- 前記ラテックスポリマー粒子は、スチレン、メチルメタクリレート、ブチルアクリレート、およびメタクリル酸から調製される、請求項1に記載の組成物。
- 前記ラテックスポリマー粒子は、前記結合剤流体の総重量に基づいて5重量%から50重量%の範囲の量で前記結合剤流体中に存在する、請求項1〜3の何れか1項に記載の組成物。
- 前記共重合性界面活性剤は、ポリオキシエチレン化合物を含む、請求項1〜4の何れか1項に記載の組成物。
- 前記共重合性界面活性剤は、ポリオキシエチレンアルキルフェニルエーテル硫酸アンモニウム、ナトリウムポリオキシエチレンアルキルエーテル硫酸エステル、ポリオキシエチレンスチレン化フェニルエーテル硫酸アンモニウム、またはそれらの混合物である、請求項5に記載の組成物。
- 三次元印刷用の結合流体組成物であって、
2−ピロリジノン、1−(2−ヒドロキシエチル)−2−ピロリドン、トリプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノプロピルエーテル、トリプロピレングリコールモノn−ブチルエーテル、プロピレングリコールフェニルエーテル、ジプロピレングリコールメチルエーテルアセテート、ジエチレングリコールモノブチルエーテル、ジエチレングリコールモノヘキシルエーテル、エチレングリコールフェニルエーテル、ジエチレングリコールモノn−ブチルエーテルアセテート、エチレングリコールモノn−ブチルエーテルアセテート、2−メチル−1,3−プロパンジオール、およびそれらの組み合わせからなる群から選択される融合溶媒を含む水性液体ビヒクル、および
前記水性液体ビヒクル中に分散したラテックスポリマー粒子を含み、
ここで前記ラテックスポリマー粒子は、10nmから300nmの平均粒子サイズを有し、
ここで前記ラテックスポリマー粒子は、(A)ポリオキシエチレンアルキルフェニルエーテル硫酸アンモニウム、ナトリウムポリオキシエチレンアルキルエーテル硫酸エステル、ポリオキシエチレンスチレン化フェニルエーテル硫酸アンモニウム、またはそれらの混合物から選択される共重合性界面活性剤、および(B)メタクリル酸、アクリル酸、アクリルアミド、メタクリルアミドまたはそれらの組み合わせからなる群から選択される高T g 親水性モノマー、およびスチレン、p−メチルスチレン、α−メチルスチレン、2−ヒドロキシエチルアクリレート、2−ヒドロキシエチルメタクリレート、2−ヒドロキシプロピルアクリレート、2−ヒドロキシプロピルメタクリレート、メチルメタクリレート、ヘキシルアクリレート、ヘキシルメタクリレート、ブチルアクリレート、ブチルメタクリレート、エチルアクリレート、エチルメタクリレート、2−エチルヘキシルアクリレート、2−エチルヘキシルメタクリレート、プロピルアクリレート、プロピルメタクリレート、オクタデシルアクリレート、オクタデシルメタクリレート、ステアリルメタクリレート、ビニルベンジルクロリド、テトラヒドロフルフリルアクリレート、2−フェノキシエチルメタクリレート、ベンジルメタクリレート、ベンジルアクリレート、エトキシル化ノニルフェノールメタクリレート、エトキシル化ベヘニルメタクリレート、ポリプロピレングリコールモノアクリレート、シクロヘキシルメタクリレート、シクロヘキシルアクリレート、t−ブチルメタクリレート、n−オクチルメタクリレート、ラウリルメタクリレート、トリデシルメタクリレート、アルコキシル化テトラヒドロフルフリルアクリレート、イソデシルアクリレート、イソボルニルメタクリレート、イソボルニルアクリレート、ジメチルマレエート、ジオクチルマレエート、アセトアセトキシエチルメタクリレート、ジアセトンアクリルアミド、N−ビニルイミダゾール、N−ビニルカルバゾール、およびN−ビニル−カプロラクタム、またはそれらの組み合わせから選択される低T g 疎水性モノマーから製造され、そして
ここで前記結合流体は、6.5から9のpHを有する、組成物。 - 前記ラテックスポリマー粒子は、2−フェノキシエチルメタクリレート、シクロヘキシルメタクリレート、シクロヘキシルアクリレート、およびメタクリル酸から調製される、請求項7に記載の組成物。
- 前記ラテックスポリマー粒子は、スチレン、メチルメタクリレート、ブチルアクリレート、およびメタクリル酸から調製される、請求項7に記載の組成物。
- 前記ラテックスポリマー粒子は、前記結合剤流体の総重量に基づいて10重量%から30重量%の範囲の量で前記結合剤流体中に存在する、請求項7〜9の何れか1項に記載の組成物。
- 水は、前記結合流体組成物の総重量に基づいて45重量%から65重量%の量で存在する、請求項7〜10の何れか1項に記載の組成物。
- 前記結合流体組成物の粘度は、10cps未満である、請求項7〜11の何れか1項に記載の組成物。
- 三次元物体を印刷するための組成物であって、
金属粉末構築材料、ここで前記金属粉末構築材料は、10μmから250μmの平均粒子サイズを有し;ならびに
2−ピロリジノン、1−(2−ヒドロキシエチル)−2−ピロリドン、トリプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノプロピルエーテル、トリプロピレングリコールモノn−ブチルエーテル、プロピレングリコールフェニルエーテル、ジプロピレングリコールメチルエーテルアセテート、ジエチレングリコールモノブチルエーテル、ジエチレングリコールモノヘキシルエーテル、エチレングリコールフェニルエーテル、ジエチレングリコールモノn−ブチルエーテルアセテート、エチレングリコールモノn−ブチルエーテルアセテート、2−メチル−1,3−プロパンジオール、およびそれらの組み合わせからなる群から選択される融合溶媒を含む水性液体ビヒクル;および
前記水性液体ビヒクル中に分散したラテックスポリマー粒子を含む
結合剤流体を含み、
ここで前記ラテックスポリマー粒子は、10nmから300nmの平均粒子サイズを有し、
ここで前記ラテックスポリマー粒子は、(A)ポリオキシエチレンアルキルフェニルエーテル硫酸アンモニウム、ナトリウムポリオキシエチレンアルキルエーテル硫酸エステル、ポリオキシエチレンスチレン化フェニルエーテル硫酸アンモニウム、またはそれらの混合物から選択される共重合性界面活性剤、および(B)スチレン、メタクリル酸、メチルメタクリレート、ブチルアクリレート、2−フェノキシエチルメタクリレート、シクロヘキシルメタクリレート、シクロヘキシルアクリレート、またはそれらの組み合わせから製造され、
ここで前記結合流体は、6.5から9のpHを有し、そして
ここで前記ラテックスポリマー粒子は、前記結合剤流体の総重量に基づいて10重量%から30重量%の範囲の量で結合剤流体中に存在する、組成物。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2017/019298 WO2018156143A1 (en) | 2017-02-24 | 2017-02-24 | Three-dimensional (3d) printing |
USPCT/US2017/019298 | 2017-02-24 | ||
PCT/US2017/056363 WO2018156207A1 (en) | 2017-02-24 | 2017-10-12 | Three-dimensional printing |
USPCT/US2017/056363 | 2017-10-12 | ||
PCT/US2018/019482 WO2018156933A1 (en) | 2017-02-24 | 2018-02-23 | Three-dimensional printing |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020509157A JP2020509157A (ja) | 2020-03-26 |
JP6824402B2 true JP6824402B2 (ja) | 2021-02-03 |
Family
ID=63252919
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019523752A Active JP6842536B2 (ja) | 2017-02-24 | 2017-02-24 | 3次元(3d)印刷 |
JP2019526232A Active JP6824402B2 (ja) | 2017-02-24 | 2018-02-23 | 三次元印刷 |
JP2019526283A Active JP6824403B2 (ja) | 2017-02-24 | 2018-02-23 | 三次元印刷 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019523752A Active JP6842536B2 (ja) | 2017-02-24 | 2017-02-24 | 3次元(3d)印刷 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019526283A Active JP6824403B2 (ja) | 2017-02-24 | 2018-02-23 | 三次元印刷 |
Country Status (7)
Country | Link |
---|---|
US (5) | US11389867B2 (ja) |
EP (4) | EP3519125B1 (ja) |
JP (3) | JP6842536B2 (ja) |
KR (2) | KR102231843B1 (ja) |
CN (4) | CN110198796B (ja) |
BR (2) | BR112019010426A2 (ja) |
WO (2) | WO2018156143A1 (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3388169B1 (en) * | 2017-04-11 | 2023-07-26 | Fundació Institut de Ciències Fotòniques | A method and a system for producing a three-dimensional object |
EP3548209A4 (en) | 2017-04-28 | 2020-04-29 | Hewlett-Packard Development Company, L.P. | PELLETS OF METAL CONSTRUCTION MATERIAL |
EP3765269A4 (en) * | 2018-10-29 | 2021-09-22 | Hewlett-Packard Development Company, L.P. | THREE-DIMENSIONAL PRINTING |
US20220126366A1 (en) * | 2018-12-21 | 2022-04-28 | Hewlett-Packard Development Company, L.P. | Three-dimensionalprinting |
JP7321624B2 (ja) * | 2018-12-25 | 2023-08-07 | エルジー・ケム・リミテッド | 成形装置及び成形体の製造方法 |
EP3938180A4 (en) * | 2019-03-15 | 2022-09-28 | Hewlett-Packard Development Company, L.P. | THREE-DIMENSIONAL PRINTING |
WO2020246991A1 (en) * | 2019-06-07 | 2020-12-10 | Hewlett-Packard Development Company, L.P. | Binding agents for printing 3d green body objects |
WO2020260520A1 (de) * | 2019-06-28 | 2020-12-30 | Sindlhauser Materials Gmbh | Zusammensetzung für 3d-druckverfahren, 3d-druckverfahren und aus der zusammensetzung erzeugte körper |
CN114174042A (zh) * | 2019-09-05 | 2022-03-11 | 惠普发展公司,有限责任合伙企业 | 采用润湿试剂的三维打印 |
EP3941719A4 (en) * | 2019-09-26 | 2022-10-05 | Hewlett-Packard Development Company, L.P. | BINDERS FOR PRINTING AND CURING |
EP3996921A4 (en) * | 2019-10-11 | 2023-01-25 | Hewlett-Packard Development Company, L.P. | BINDERS FOR THREE-DIMENSIONAL PRINTING |
EP4028184A4 (en) * | 2019-11-15 | 2023-03-22 | Hewlett-Packard Development Company, L.P. | THREE-DIMENSIONAL PRINT |
CN110625924B (zh) * | 2019-11-18 | 2022-04-01 | 西交利物浦大学 | 基于双数字电子显微镜的电喷生物支架制造装置监控系统 |
WO2021126153A1 (en) * | 2019-12-16 | 2021-06-24 | Hewlett-Packard Development Company, L.P. | Three-dimensional printed polymer objects |
WO2021141591A1 (en) * | 2020-01-10 | 2021-07-15 | Hewlett-Packard Development Company, L.P. | Three-dimensional printing with wetting agent |
EP3915698A1 (en) * | 2020-05-26 | 2021-12-01 | General Electric Company | Binder solutions comprising nanoparticles for use in additive manufacturing |
CN111875394A (zh) * | 2020-07-24 | 2020-11-03 | 山东工业陶瓷研究设计院有限公司 | 一种用于陶瓷粉末3dp成型的粘结剂及其制备方法 |
KR102481286B1 (ko) | 2021-01-27 | 2022-12-26 | 주식회사 엔씨소프트 | 온라인 팬덤 활동 서비스 제공 방법 및 장치 |
WO2022211777A1 (en) * | 2021-03-29 | 2022-10-06 | Hewlett-Packard Development Company, L.P. | Manufacturing 3d printed objects |
US20220355381A1 (en) * | 2021-05-04 | 2022-11-10 | Desktop Metal, Inc. | Layer Spreading and Compaction in Binder Jet 3D Printing |
CN113737039B (zh) * | 2021-09-15 | 2022-08-02 | 重庆大学 | 一种井下暂堵工具用高强快速溶解镁合金的3dp制备工艺 |
LU502626B1 (en) * | 2022-08-04 | 2024-02-07 | Fyzikalni Ustav Av Cr V V I | Method for improving surface integrity of an additive manufactured mesoscopic gear, product thereof and device carrying out the method |
CN116175730B (zh) * | 2023-03-23 | 2023-09-08 | 中国科学院空间应用工程与技术中心 | 一种光固化陶瓷3d打印铺料中辊子刮刀的改进方法及装置 |
Family Cites Families (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE754592A (fr) * | 1969-08-07 | 1971-02-08 | Hoechst Ag | Matieres a mouler thermoplastiques a base de polyoxymethylene |
JPS5322559A (en) | 1976-08-12 | 1978-03-02 | Shigemasa Takagi | Injection molding method and device |
US5204055A (en) * | 1989-12-08 | 1993-04-20 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
US5387380A (en) | 1989-12-08 | 1995-02-07 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
US5541253A (en) | 1994-10-11 | 1996-07-30 | The B. F. Goodrich Company | High solids copolymer dispersion from a latex and its use in sealants |
US6596224B1 (en) | 1996-05-24 | 2003-07-22 | Massachusetts Institute Of Technology | Jetting layers of powder and the formation of fine powder beds thereby |
US6624225B1 (en) * | 1996-06-03 | 2003-09-23 | Liburdi Engineering Limited | Wide-gap filler material |
JP4314396B2 (ja) | 1997-09-26 | 2009-08-12 | マサチューセッツ・インスティテュート・オブ・テクノロジー | 塩から得られたバインダーを使用して粉末から製造される金属及びセラミック含有パーツの製造方法 |
US6433117B1 (en) | 1999-08-04 | 2002-08-13 | E. I. Du Pont De Nemours & Company | Phosphorylated polymer dispersants for inks |
US20010050031A1 (en) | 2000-04-14 | 2001-12-13 | Z Corporation | Compositions for three-dimensional printing of solid objects |
DE10021490C2 (de) * | 2000-05-03 | 2002-03-28 | Lin Ching Bin | Mikroherstellungsprozess zur Herstellung von geometrisch miniaturisierten Mikrostrukturen aus dreidimensionalen Gebilden |
US6550763B2 (en) | 2001-01-31 | 2003-04-22 | Lexmark International, Inc. | Finisher with sheet placement control |
GB0112675D0 (en) | 2001-05-24 | 2001-07-18 | Vantico Ltd | Three-dimensional structured printing |
US6746506B2 (en) | 2002-07-12 | 2004-06-08 | Extrude Hone Corporation | Blended powder solid-supersolidus liquid phase sintering |
JPWO2004019324A1 (ja) | 2002-08-23 | 2005-12-15 | ソニー株式会社 | レーザ出力設定方法および光記録装置 |
US6742456B1 (en) * | 2002-11-14 | 2004-06-01 | Hewlett-Packard Development Company, L.P. | Rapid prototyping material systems |
JP2004306557A (ja) | 2003-04-10 | 2004-11-04 | Seiko Epson Corp | インクジェット記録方法、及びこれに用いるクリアインク組成物 |
US6966960B2 (en) * | 2003-05-07 | 2005-11-22 | Hewlett-Packard Development Company, L.P. | Fusible water-soluble films for fabricating three-dimensional objects |
KR101148770B1 (ko) * | 2003-05-21 | 2012-05-24 | 3디 시스템즈 인코오퍼레이티드 | 3d 인쇄 시스템으로부터의 외관 모형용 열가소성 분말 물질 시스템 |
US7108733B2 (en) | 2003-06-20 | 2006-09-19 | Massachusetts Institute Of Technology | Metal slurry for electrode formation and production method of the same |
US7120512B2 (en) * | 2003-08-25 | 2006-10-10 | Hewlett-Packard Development Company, L.P. | Method and a system for solid freeform fabricating using non-reactive powder |
US6819906B1 (en) | 2003-08-29 | 2004-11-16 | Xerox Corporation | Printer output sets compiler to stacker system |
US7220380B2 (en) | 2003-10-14 | 2007-05-22 | Hewlett-Packard Development Company, L.P. | System and method for fabricating a three-dimensional metal object using solid free-form fabrication |
US20050191200A1 (en) | 2004-02-27 | 2005-09-01 | Guido Canzona | Method and composition for metal free form fabrication |
EP1773559A1 (en) | 2004-06-28 | 2007-04-18 | Ex One Corporation | Gas permeable molds |
US7141207B2 (en) * | 2004-08-30 | 2006-11-28 | General Motors Corporation | Aluminum/magnesium 3D-Printing rapid prototyping |
US7389154B2 (en) | 2004-09-29 | 2008-06-17 | Hewlett-Packard Development Company, L.P. | Fabricating a three-dimensional object |
US7439168B2 (en) | 2004-10-12 | 2008-10-21 | Dcg Systems, Inc | Apparatus and method of forming silicide in a localized manner |
US20060166158A1 (en) * | 2005-01-25 | 2006-07-27 | Norbert Abels | Laser shaping of green metal body to yield an orthodontic bracke |
AU2006208555B2 (en) * | 2005-01-25 | 2011-11-03 | Ormco Corporation | Methods for shaping green bodies and articles made by such methods |
JP4207161B2 (ja) | 2005-04-20 | 2009-01-14 | セイコーエプソン株式会社 | マイクロカプセル化金属粒子及びその製造方法、水性分散液、並びに、インクジェット用インク |
JP2009508723A (ja) | 2005-09-20 | 2009-03-05 | ピーティーエス ソフトウェア ビーブイ | 三次元物品を構築する装置及び三次元物品を構築する方法 |
US7744205B2 (en) | 2006-03-17 | 2010-06-29 | Hewlett-Packard Development Company, L.P. | Solvent/latex binder system for heated inkjet printing |
US7608646B1 (en) | 2006-04-28 | 2009-10-27 | Hewlett-Packard Development Company, L.P. | Polymer-encapsulated pigment with bridging layer |
US20090288739A1 (en) | 2006-07-13 | 2009-11-26 | Basf Se | Binder-comprising thermoplastic compositions for producing shaped metallic bodies |
JP5334233B2 (ja) | 2007-01-31 | 2013-11-06 | 住化エンビロサイエンス株式会社 | レーザー焼結に使用される球状ポリアミド粉体およびそれを用いた成形体の製造方法およびレーザー焼結物品 |
WO2008087214A1 (en) * | 2007-01-19 | 2008-07-24 | Cinvention Ag | Porous, non-degradable implant made by powder molding |
JP4483880B2 (ja) | 2007-03-15 | 2010-06-16 | セイコーエプソン株式会社 | 成形体形成用組成物、脱脂体および焼結体 |
US10040216B2 (en) | 2007-04-04 | 2018-08-07 | The Exone Company | Powder particle layerwise three-dimensional printing process |
US20090022615A1 (en) * | 2007-07-20 | 2009-01-22 | Phillips Plastics Corporation | Method of molding complex structures using a sacrificial material |
JP2009275100A (ja) | 2008-05-14 | 2009-11-26 | Fujifilm Corp | 三次元造形用材料、三次元造形物の製造方法及び三次元造形物 |
CN102803409B (zh) * | 2009-06-26 | 2014-06-11 | 惠普发展公司,有限责任合伙企业 | 含聚合物和近红外吸收染料的喷墨油墨 |
CN102884145B (zh) | 2010-06-14 | 2016-04-13 | 惠普发展公司,有限责任合伙企业 | 预处理组合物 |
WO2011159306A1 (en) | 2010-06-17 | 2011-12-22 | Hewlett-Packard Development Company, L.P. | Polyurethane-containing inkjet ink |
US8663886B2 (en) | 2010-12-21 | 2014-03-04 | Xerox Corporation | Toner compositions and processes |
US8393608B2 (en) | 2011-04-26 | 2013-03-12 | Xerox Corporation | Sheet finishing system including dual sheet stacking |
US9757801B2 (en) | 2011-06-01 | 2017-09-12 | Bam Bundesanstalt Für Material Forschung Und Prüfung | Method for producing a moulded body and device |
US9446604B2 (en) | 2011-06-10 | 2016-09-20 | Hewlett-Packard Development Company, L.P. | White pre-treatment composition |
US9156999B2 (en) | 2011-07-28 | 2015-10-13 | Hewlett-Packard Development Company, L.P. | Liquid inkjettable materials for three-dimensional printing |
US8517368B1 (en) | 2012-02-10 | 2013-08-27 | Xerox Corporation | Stapler eject with alternating offset and position controlled grip |
ITMI20120331A1 (it) | 2012-03-02 | 2013-09-03 | Legor Group S P A | Silver-based alloy powder for manufacturing of 3-dimensional metal objects |
TWI482699B (zh) | 2012-05-21 | 2015-05-01 | Univ Nat Taipei Technology | A method for preparing inorganic green bodies with three - dimensional contours |
WO2014009765A1 (en) | 2012-07-11 | 2014-01-16 | Omnova Solutions | Rheological agent, preparation methods and uses thereof |
US9623605B2 (en) * | 2012-09-12 | 2017-04-18 | International Business Machines Corporation | Thermally cross-linkable photo-hydrolyzable inkjet printable polymers for microfluidic channels |
RU2535704C1 (ru) | 2013-04-18 | 2014-12-20 | Общество С Ограниченной Ответственностью "Группа "Магнезит" | Способ трехмерной печати огнеупорных изделий |
JP6392324B2 (ja) | 2013-04-25 | 2018-09-19 | ユナイテッド テクノロジーズ コーポレイションUnited Technologies Corporation | 金属バインダーを用いた部分的な過渡液相接合によるセラミックタービン構成要素の付加製造 |
US9512544B2 (en) * | 2013-07-11 | 2016-12-06 | Tundra Composites, LLC | Surface modified particulate and sintered or injection molded products |
US20160158453A1 (en) | 2013-07-17 | 2016-06-09 | Sanofi | Drive mechanism |
US9327448B2 (en) | 2013-08-02 | 2016-05-03 | Northwestern University | Methods for fabricating three-dimensional metallic objects via additive manufacturing using metal oxide pastes |
DE102013018182A1 (de) | 2013-10-30 | 2015-04-30 | Voxeljet Ag | Verfahren und Vorrichtung zum Herstellen von dreidimensionalen Modellen mit Bindersystem |
US20150125334A1 (en) * | 2013-11-01 | 2015-05-07 | American Hakko Products, Inc. | Materials and Process Using a Three Dimensional Printer to Fabricate Sintered Powder Metal Components |
DE102013019716A1 (de) | 2013-11-27 | 2015-05-28 | Voxeljet Ag | 3D-Druckverfahren mit Schlicker |
US20150166277A1 (en) | 2013-12-16 | 2015-06-18 | Xerox Corporation | Ejector for improved stack registration |
JP6519100B2 (ja) * | 2014-04-23 | 2019-05-29 | セイコーエプソン株式会社 | 焼結造形方法、液状結合剤、および焼結造形物 |
CN106255582B (zh) * | 2014-04-30 | 2018-11-06 | 惠普发展公司,有限责任合伙企业 | 三维(3d)印刷方法 |
WO2015171182A1 (en) | 2014-05-04 | 2015-11-12 | Eoplex Limited | Multi-material three dimensional printer |
US9505058B2 (en) | 2014-05-16 | 2016-11-29 | Xerox Corporation | Stabilized metallic nanoparticles for 3D printing |
CN204018721U (zh) | 2014-07-09 | 2014-12-17 | 山东科技大学 | 一种金属粉末激光烧结三维打印机 |
JP6657601B2 (ja) | 2014-08-08 | 2020-03-04 | 株式会社リコー | 立体造形用粉末材料、立体造形材料セット、及び立体造形物の製造方法 |
JP6606861B2 (ja) | 2014-08-11 | 2019-11-20 | 株式会社リコー | 積層造形用粉末及び積層造形物の製造方法 |
US10392521B2 (en) * | 2014-09-30 | 2019-08-27 | Hewlett-Packard Development Company, L.P. | Particle compositions for three-dimensional printing |
EP3212383A4 (en) | 2014-10-29 | 2017-11-08 | Hewlett-Packard Development Company, L.P. | Three-dimensional (3d) printing method |
JP2016088004A (ja) | 2014-11-07 | 2016-05-23 | セイコーエプソン株式会社 | 三次元造形物の製造方法、三次元造形物製造装置および三次元造形物 |
US20160158843A1 (en) | 2014-12-05 | 2016-06-09 | Charles Frederick Yolton | Method of achieving full density binder jet printed metallic articles |
US9550328B2 (en) | 2014-12-22 | 2017-01-24 | Xerox Corporation | System and method for reducing or eliminating hue shift in three-dimensional printed objects |
JP2016179638A (ja) * | 2015-03-25 | 2016-10-13 | 株式会社リコー | 立体造形用組成液、立体造形セット、立体造形物の製造装置及び立体造形物の製造方法 |
KR102054658B1 (ko) * | 2015-04-30 | 2019-12-11 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 3차원(3d) 프린팅 |
JP2016221682A (ja) | 2015-05-27 | 2016-12-28 | 三菱レイヨン株式会社 | 3dプリンター用フィラメント |
CN106303170A (zh) | 2015-05-29 | 2017-01-04 | 上海臻图信息技术有限公司 | 基于手机摄像头的自动拍照侧面积方法 |
EP3117982B1 (en) | 2015-07-16 | 2019-12-25 | Sculpman Bvba | 3d printing system and process |
US10919217B2 (en) | 2015-07-23 | 2021-02-16 | Hewlett-Packard Development Company, L.P. | Three-dimensional (3D) printing build material composition |
JP2017025386A (ja) * | 2015-07-24 | 2017-02-02 | セイコーエプソン株式会社 | 3次元成形物および3次元成形方法 |
WO2017018984A1 (en) | 2015-07-24 | 2017-02-02 | Hewlett-Packard Development Company, L.P. | Stabilizing liquid functional material for three-dimensional (3d) printing |
CN105057664B (zh) | 2015-08-14 | 2017-10-10 | 东莞劲胜精密组件股份有限公司 | 一种3d打印粉料及3d打印方法 |
WO2017053306A1 (en) | 2015-09-21 | 2017-03-30 | The Nanosteel Company, Inc. | Infiltrated segregated ferrous materials |
CN105364065B (zh) * | 2015-11-19 | 2017-10-10 | 东莞劲胜精密组件股份有限公司 | 一种用于3d打印的金属粉料及其制备方法以及3d打印方法 |
CN108885915B (zh) | 2015-12-23 | 2021-09-10 | 汉高知识产权控股有限责任公司 | 可烧结导电组合物、改善组合物的导电性的方法及基材 |
-
2017
- 2017-02-24 WO PCT/US2017/019298 patent/WO2018156143A1/en unknown
- 2017-02-24 EP EP17897438.2A patent/EP3519125B1/en active Active
- 2017-02-24 KR KR1020197014858A patent/KR102231843B1/ko active IP Right Grant
- 2017-02-24 BR BR112019010426A patent/BR112019010426A2/pt active Search and Examination
- 2017-02-24 US US16/077,770 patent/US11389867B2/en active Active
- 2017-02-24 CN CN201780073075.4A patent/CN110198796B/zh active Active
- 2017-02-24 JP JP2019523752A patent/JP6842536B2/ja active Active
- 2017-10-12 US US16/077,772 patent/US11583920B2/en active Active
- 2017-10-12 CN CN201780073074.XA patent/CN110177677B/zh active Active
- 2017-10-12 WO PCT/US2017/056363 patent/WO2018156207A1/en unknown
- 2017-10-12 EP EP17897383.0A patent/EP3519158A4/en active Pending
-
2018
- 2018-02-23 EP EP18756871.2A patent/EP3519128A4/en active Pending
- 2018-02-23 CN CN201880004721.6A patent/CN110177638B/zh active Active
- 2018-02-23 JP JP2019526232A patent/JP6824402B2/ja active Active
- 2018-02-23 CN CN201880004536.7A patent/CN109982794B/zh active Active
- 2018-02-23 US US16/081,499 patent/US11511338B2/en active Active
- 2018-02-23 BR BR112019010994-3A patent/BR112019010994B1/pt active IP Right Grant
- 2018-02-23 JP JP2019526283A patent/JP6824403B2/ja active Active
- 2018-02-23 EP EP18758233.3A patent/EP3525963A4/en active Pending
- 2018-02-23 KR KR1020197015488A patent/KR102227616B1/ko active IP Right Grant
-
2022
- 2022-06-10 US US17/838,050 patent/US20220297182A1/en active Pending
-
2023
- 2023-01-31 US US18/104,237 patent/US20230173756A1/en active Pending
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6824402B2 (ja) | 三次元印刷 | |
US11577316B2 (en) | Three-dimensional printing | |
US20190111479A1 (en) | Three-dimensional printing | |
CN111050953B (zh) | 三维(3d)打印 | |
US12042858B2 (en) | Three-dimensional printing | |
US20210402468A1 (en) | Three-dimensional printing | |
CN113490562B (zh) | 三维打印 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190516 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200512 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200811 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201215 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210112 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6824402 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |