JP6821606B2 - ビーム位置センサを有する走査ヘッドおよび調整装置 - Google Patents

ビーム位置センサを有する走査ヘッドおよび調整装置 Download PDF

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Publication number
JP6821606B2
JP6821606B2 JP2017566141A JP2017566141A JP6821606B2 JP 6821606 B2 JP6821606 B2 JP 6821606B2 JP 2017566141 A JP2017566141 A JP 2017566141A JP 2017566141 A JP2017566141 A JP 2017566141A JP 6821606 B2 JP6821606 B2 JP 6821606B2
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Prior art keywords
laser beam
scanning head
positioning system
unit
adjusting device
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JP2017566141A
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Japanese (ja)
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JP2018525227A (ja
JP2018525227A5 (enExample
Inventor
クリスチャン ソンナー，
クリスチャン ソンナー，
マティアス ラベ，
マティアス ラベ，
Original Assignee
スキャンラボ ゲーエムベーハー
スキャンラボ ゲーエムベーハー
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2017566141A 2015-06-22 2016-06-03 ビーム位置センサを有する走査ヘッドおよび調整装置 Active JP6821606B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015109984.5A DE102015109984A1 (de) 2015-06-22 2015-06-22 Scannerkopf mit integriertem Strahllagesensor sowie Justageanordnung zur Offline-Justage
DE102015109984.5 2015-06-22
PCT/EP2016/062577 WO2016206943A1 (de) 2015-06-22 2016-06-03 Scannerkopf mit integriertem strahllagesensor sowie justageanordnung zur offline-justage

Publications (3)

Publication Number Publication Date
JP2018525227A JP2018525227A (ja) 2018-09-06
JP2018525227A5 JP2018525227A5 (enExample) 2019-07-04
JP6821606B2 true JP6821606B2 (ja) 2021-01-27

Family

ID=56097133

Family Applications (1)

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JP2017566141A Active JP6821606B2 (ja) 2015-06-22 2016-06-03 ビーム位置センサを有する走査ヘッドおよび調整装置

Country Status (7)

Country Link
US (1) US10773339B2 (enExample)
EP (1) EP3310519B1 (enExample)
JP (1) JP6821606B2 (enExample)
KR (1) KR20180020207A (enExample)
CN (1) CN107771112B (enExample)
DE (1) DE102015109984A1 (enExample)
WO (1) WO2016206943A1 (enExample)

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DE102017125120A1 (de) * 2017-10-26 2019-05-02 Scanlab Gmbh Steuerungsverfahren zur Bewegungsführung eines Laserstrahls mit Interpolation der Fokuslage und/oder Strahlrichtung
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DE102018105877B3 (de) * 2018-03-14 2019-02-28 Precitec Gmbh & Co. Kg Vorrichtung für die Bestimmung einer Ausrichtung einer optischen Vorrichtung eines Kohärenztomographen, Kohärenztomograph und Laserbearbeitungssystem
KR102106068B1 (ko) * 2018-05-09 2020-05-04 (주)엔피에스 레이저 장치
BE1026484B1 (fr) 2018-07-24 2020-02-25 Laser Eng Applications Méthode et dispositif optique pour fournir deux faisceaux laser décalés
DE112019004004T5 (de) * 2018-08-09 2021-05-20 Corning Incorporated Systeme, verfahren und geräte zum maschinengebundenen profilieren eines laserstrahls
DE102018219129B3 (de) * 2018-11-09 2019-11-07 Trumpf Laser Gmbh Verfahren und Computerprogrammprodukt zur OCT-Messstrahljustierung
CN109483047B (zh) * 2018-11-15 2019-12-31 中国科学院西安光学精密机械研究所 一种激光光束终端指向检测与校正方法及激光加工装置
US11273520B2 (en) * 2019-01-31 2022-03-15 General Electric Company System and method for automated laser ablation
DE102019115554A1 (de) * 2019-06-07 2020-12-10 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
US11305377B2 (en) * 2019-12-23 2022-04-19 Precitec Gmbh & Co. Kg Add-on module for interposing between a control device and a laser machining head of a laser machining system
US20230166359A1 (en) 2020-04-30 2023-06-01 Nikon Corporation Processing system
PT3907317T (pt) * 2020-05-08 2022-05-06 Jeanologia Sl Dispositivo e processo para o tratamento a laser de calças que compreende dois manequins
US20230341679A1 (en) 2020-08-18 2023-10-26 Nikon Corporation Optical apparatus and processing apparatus
DE102020122319B4 (de) * 2020-08-26 2023-12-14 Jenoptik Optical Systems Gmbh Verfahren und Steuergerät zur Kalibrierung einer Laser-Scanner-Vorrichtung zur Materialbearbeitung sowie Computerprogramm und maschinenlesbares Speichermedium
JP7240774B2 (ja) * 2020-10-16 2023-03-16 国立大学法人信州大学 光学ユニット及びレーザー加工装置
JP2022065693A (ja) * 2020-10-16 2022-04-28 国立大学法人信州大学 光学ユニット、並びにレーザー加工装置、レーザー加工方法、及び三次元加工装置
DE102020214566B4 (de) 2020-11-19 2023-08-03 Robert Bosch Gesellschaft mit beschränkter Haftung Bestimmungsvorrichtung zur Bestimmung der Lage und Richtung eines Laserstrahls und System und Verfahren zum Einstellen der Lage und Richtung eines Laserstrahls
CN112846485B (zh) * 2020-12-31 2022-11-04 武汉华工激光工程有限责任公司 激光加工的监测方法、装置及激光加工设备
IL312370A (en) 2021-10-25 2025-01-01 Trumpf Lasersystems Semiconductor Mfg Gmbh Deep ultraviolet light source if beam positioning device
JP2023067484A (ja) * 2021-11-01 2023-05-16 キヤノン株式会社 光軸検出装置、光軸補正装置、加工装置、および、物品の製造方法
DE102021130944A1 (de) 2021-11-25 2023-05-25 Jenoptik Optical Systems Gmbh Vorrichtung und Verfahren zum Bestimmen eines Strahlverlaufs eines Strahls und Laseranlage
KR102728044B1 (ko) * 2022-07-18 2024-11-08 (주)알엔알랩 기판 처리 장치 및 방법
CN119115265B (zh) * 2024-11-14 2025-01-24 西南交通大学 一种激光切割材料板的方法
CN119566543A (zh) * 2024-12-20 2025-03-07 中国科学院西安光学精密机械研究所 一种用于复杂结构的激光三维体制造装置及方法

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Also Published As

Publication number Publication date
JP2018525227A (ja) 2018-09-06
US20180169788A1 (en) 2018-06-21
CN107771112A (zh) 2018-03-06
KR20180020207A (ko) 2018-02-27
DE102015109984A1 (de) 2016-12-22
CN107771112B (zh) 2020-06-05
EP3310519B1 (de) 2019-11-13
WO2016206943A1 (de) 2016-12-29
US10773339B2 (en) 2020-09-15
EP3310519A1 (de) 2018-04-25

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