KR20180020207A - 빔 포지션 센서가 통합된 스캐너 헤드 및 오프라인 조정용 조정 장치 - Google Patents

빔 포지션 센서가 통합된 스캐너 헤드 및 오프라인 조정용 조정 장치 Download PDF

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Publication number
KR20180020207A
KR20180020207A KR1020187000548A KR20187000548A KR20180020207A KR 20180020207 A KR20180020207 A KR 20180020207A KR 1020187000548 A KR1020187000548 A KR 1020187000548A KR 20187000548 A KR20187000548 A KR 20187000548A KR 20180020207 A KR20180020207 A KR 20180020207A
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KR
South Korea
Prior art keywords
laser beam
scanner head
beam position
unit
position sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020187000548A
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English (en)
Korean (ko)
Inventor
손너 크리스티안
라베 마티아스
Original Assignee
스캔랩 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스캔랩 게엠베하 filed Critical 스캔랩 게엠베하
Publication of KR20180020207A publication Critical patent/KR20180020207A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020187000548A 2015-06-22 2016-06-03 빔 포지션 센서가 통합된 스캐너 헤드 및 오프라인 조정용 조정 장치 Withdrawn KR20180020207A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015109984.5A DE102015109984A1 (de) 2015-06-22 2015-06-22 Scannerkopf mit integriertem Strahllagesensor sowie Justageanordnung zur Offline-Justage
DE102015109984.5 2015-06-22
PCT/EP2016/062577 WO2016206943A1 (de) 2015-06-22 2016-06-03 Scannerkopf mit integriertem strahllagesensor sowie justageanordnung zur offline-justage

Publications (1)

Publication Number Publication Date
KR20180020207A true KR20180020207A (ko) 2018-02-27

Family

ID=56097133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187000548A Withdrawn KR20180020207A (ko) 2015-06-22 2016-06-03 빔 포지션 센서가 통합된 스캐너 헤드 및 오프라인 조정용 조정 장치

Country Status (7)

Country Link
US (1) US10773339B2 (enExample)
EP (1) EP3310519B1 (enExample)
JP (1) JP6821606B2 (enExample)
KR (1) KR20180020207A (enExample)
CN (1) CN107771112B (enExample)
DE (1) DE102015109984A1 (enExample)
WO (1) WO2016206943A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210038953A (ko) * 2018-08-09 2021-04-08 코닝 인코포레이티드 기계에서 레이저 빔의 프로파일링을 위한 시스템, 방법, 및 장치
KR20240010932A (ko) * 2022-07-18 2024-01-25 (주)알엔알랩 기판 처리 장치 및 방법

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6487413B2 (ja) * 2016-12-22 2019-03-20 ファナック株式会社 レーザ加工用ヘッドおよびそれを備えたレーザ加工システム
DE102017125120A1 (de) * 2017-10-26 2019-05-02 Scanlab Gmbh Steuerungsverfahren zur Bewegungsführung eines Laserstrahls mit Interpolation der Fokuslage und/oder Strahlrichtung
US10705327B2 (en) 2018-01-02 2020-07-07 Industrial Technology Research Institute Light emitting method and light emitting device
DE102018105877B3 (de) * 2018-03-14 2019-02-28 Precitec Gmbh & Co. Kg Vorrichtung für die Bestimmung einer Ausrichtung einer optischen Vorrichtung eines Kohärenztomographen, Kohärenztomograph und Laserbearbeitungssystem
KR102106068B1 (ko) * 2018-05-09 2020-05-04 (주)엔피에스 레이저 장치
BE1026484B1 (fr) 2018-07-24 2020-02-25 Laser Eng Applications Méthode et dispositif optique pour fournir deux faisceaux laser décalés
DE102018219129B3 (de) * 2018-11-09 2019-11-07 Trumpf Laser Gmbh Verfahren und Computerprogrammprodukt zur OCT-Messstrahljustierung
CN109483047B (zh) * 2018-11-15 2019-12-31 中国科学院西安光学精密机械研究所 一种激光光束终端指向检测与校正方法及激光加工装置
US11273520B2 (en) * 2019-01-31 2022-03-15 General Electric Company System and method for automated laser ablation
DE102019115554A1 (de) * 2019-06-07 2020-12-10 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
US11305377B2 (en) * 2019-12-23 2022-04-19 Precitec Gmbh & Co. Kg Add-on module for interposing between a control device and a laser machining head of a laser machining system
US20230166359A1 (en) 2020-04-30 2023-06-01 Nikon Corporation Processing system
PT3907317T (pt) * 2020-05-08 2022-05-06 Jeanologia Sl Dispositivo e processo para o tratamento a laser de calças que compreende dois manequins
US20230341679A1 (en) 2020-08-18 2023-10-26 Nikon Corporation Optical apparatus and processing apparatus
DE102020122319B4 (de) * 2020-08-26 2023-12-14 Jenoptik Optical Systems Gmbh Verfahren und Steuergerät zur Kalibrierung einer Laser-Scanner-Vorrichtung zur Materialbearbeitung sowie Computerprogramm und maschinenlesbares Speichermedium
JP7240774B2 (ja) * 2020-10-16 2023-03-16 国立大学法人信州大学 光学ユニット及びレーザー加工装置
JP2022065693A (ja) * 2020-10-16 2022-04-28 国立大学法人信州大学 光学ユニット、並びにレーザー加工装置、レーザー加工方法、及び三次元加工装置
DE102020214566B4 (de) 2020-11-19 2023-08-03 Robert Bosch Gesellschaft mit beschränkter Haftung Bestimmungsvorrichtung zur Bestimmung der Lage und Richtung eines Laserstrahls und System und Verfahren zum Einstellen der Lage und Richtung eines Laserstrahls
CN112846485B (zh) * 2020-12-31 2022-11-04 武汉华工激光工程有限责任公司 激光加工的监测方法、装置及激光加工设备
IL312370A (en) 2021-10-25 2025-01-01 Trumpf Lasersystems Semiconductor Mfg Gmbh Deep ultraviolet light source if beam positioning device
JP2023067484A (ja) * 2021-11-01 2023-05-16 キヤノン株式会社 光軸検出装置、光軸補正装置、加工装置、および、物品の製造方法
DE102021130944A1 (de) 2021-11-25 2023-05-25 Jenoptik Optical Systems Gmbh Vorrichtung und Verfahren zum Bestimmen eines Strahlverlaufs eines Strahls und Laseranlage
CN119115265B (zh) * 2024-11-14 2025-01-24 西南交通大学 一种激光切割材料板的方法
CN119566543A (zh) * 2024-12-20 2025-03-07 中国科学院西安光学精密机械研究所 一种用于复杂结构的激光三维体制造装置及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29612073U1 (de) * 1996-07-11 1997-11-06 Sator, Alexander Paul, 20249 Hamburg Vorrichtung zur Überprüfung von Werkstückflächen, die mit Hilfe eines Laserstrahls markiert und/oder bearbeitet werden
JPH10137962A (ja) 1996-11-07 1998-05-26 Matsushita Electric Ind Co Ltd レーザ光学系
US6548796B1 (en) * 1999-06-23 2003-04-15 Regents Of The University Of Minnesota Confocal macroscope
US7358157B2 (en) * 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
US20030222143A1 (en) * 2002-06-04 2003-12-04 Mitchell Phillip V. Precision laser scan head
DE10335501B4 (de) 2002-07-31 2005-01-27 Kuka Schweissanlagen Gmbh Verfahren und Vorrichtung zum Schweißen oder Schneiden mit Laserstrahl
JP2005118815A (ja) 2003-10-16 2005-05-12 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工装置
DE102004053298B4 (de) 2004-08-26 2008-10-09 ARGES Gesellschaft für Industrieplanung und Lasertechnik m.b.H. Scankopf als Teil einer Laser Bohr- und Schneideinrichtung
DE102006047277A1 (de) * 2006-10-04 2008-04-10 Lt Ultra-Precision-Technology Gmbh Verfahren und Vorrichtung zum Laserstrahlbearbeiten
WO2008118365A1 (en) * 2007-03-22 2008-10-02 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US9511448B2 (en) * 2009-12-30 2016-12-06 Resonetics, LLC Laser machining system and method for machining three-dimensional objects from a plurality of directions
DE102010005896A1 (de) * 2010-01-27 2010-10-14 Daimler Ag Laserschweißroboter und -verfahren sowie damit hergestelltes Bauteil
DE102012111090B4 (de) * 2012-11-19 2021-04-29 Scanlab Gmbh Vorrichtung zum Ändern der Länge eines Strahlenganges, Fokussiervorrichtung und Strahllage-und-Strahldivergenz-Änderungsvorrichtung
DE102013222834A1 (de) 2013-11-11 2015-05-13 Robert Bosch Gmbh Vorrichtung und Verfahren zur Führung eines Laserstrahls

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210038953A (ko) * 2018-08-09 2021-04-08 코닝 인코포레이티드 기계에서 레이저 빔의 프로파일링을 위한 시스템, 방법, 및 장치
KR20240010932A (ko) * 2022-07-18 2024-01-25 (주)알엔알랩 기판 처리 장치 및 방법

Also Published As

Publication number Publication date
JP2018525227A (ja) 2018-09-06
US20180169788A1 (en) 2018-06-21
CN107771112A (zh) 2018-03-06
JP6821606B2 (ja) 2021-01-27
DE102015109984A1 (de) 2016-12-22
CN107771112B (zh) 2020-06-05
EP3310519B1 (de) 2019-11-13
WO2016206943A1 (de) 2016-12-29
US10773339B2 (en) 2020-09-15
EP3310519A1 (de) 2018-04-25

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PA0105 International application

Patent event date: 20180108

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination