JP6818009B2 - 保護膜形成用複合シート - Google Patents
保護膜形成用複合シート Download PDFInfo
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- JP6818009B2 JP6818009B2 JP2018503001A JP2018503001A JP6818009B2 JP 6818009 B2 JP6818009 B2 JP 6818009B2 JP 2018503001 A JP2018503001 A JP 2018503001A JP 2018503001 A JP2018503001 A JP 2018503001A JP 6818009 B2 JP6818009 B2 JP 6818009B2
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- Prior art keywords
- protective film
- forming
- meth
- film
- acrylate
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Images
Classifications
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- B32B27/00—Layered products comprising a layer of synthetic resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/406—Bright, glossy, shiny surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
Landscapes
- Chemical & Material Sciences (AREA)
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Adhesive Tapes (AREA)
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- Paints Or Removers (AREA)
Applications Claiming Priority (3)
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| JP2016042690 | 2016-03-04 | ||
| JP2016042690 | 2016-03-04 | ||
| PCT/JP2017/004927 WO2017150145A1 (ja) | 2016-03-04 | 2017-02-10 | 保護膜形成用複合シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2017150145A1 JPWO2017150145A1 (ja) | 2018-12-27 |
| JP6818009B2 true JP6818009B2 (ja) | 2021-01-20 |
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Family Applications (1)
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| JP (1) | JP6818009B2 (zh) |
| KR (1) | KR20180120173A (zh) |
| CN (2) | CN108778722A (zh) |
| SG (1) | SG11201807452UA (zh) |
| TW (1) | TWI764885B (zh) |
| WO (1) | WO2017150145A1 (zh) |
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| KR20210098995A (ko) * | 2018-12-05 | 2021-08-11 | 린텍 가부시키가이샤 | 보호막 형성용 복합 시트, 및 반도체 칩의 제조 방법 |
| CN116323836A (zh) * | 2021-03-31 | 2023-06-23 | 积水保力马科技株式会社 | 覆膜形成组合物、覆膜、电路片材以及传感器片材 |
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| EP1370415B1 (de) * | 2001-02-26 | 2013-08-07 | Treofan Germany GmbH & Co.KG | Lasermarkierbares laminat |
| JP4762671B2 (ja) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | ダイシングテープ、および半導体ウェハダイシング方法 |
| KR101035297B1 (ko) * | 2006-09-27 | 2011-05-19 | 후지쯔 세미컨덕터 가부시키가이샤 | 반도체 장치의 제조 방법 |
| JP5391158B2 (ja) * | 2010-06-30 | 2014-01-15 | 古河電気工業株式会社 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
| JP5432853B2 (ja) * | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法 |
| JP5583724B2 (ja) * | 2012-09-20 | 2014-09-03 | リンテック株式会社 | レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法 |
| KR102103169B1 (ko) * | 2012-10-05 | 2020-04-22 | 린텍 가부시키가이샤 | 보호막 형성층이 형성된 다이싱 시트 및 칩의 제조 방법 |
| JP6059499B2 (ja) * | 2012-10-05 | 2017-01-11 | リンテック株式会社 | 表面保護シート |
| CN105009277B (zh) * | 2013-03-19 | 2017-10-27 | 琳得科株式会社 | 保护膜形成用膜 |
| WO2014155756A1 (ja) * | 2013-03-26 | 2014-10-02 | リンテック株式会社 | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 |
| JP6405556B2 (ja) * | 2013-07-31 | 2018-10-17 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シートおよび検査方法 |
| SG11201607716PA (en) * | 2014-03-24 | 2016-11-29 | Lintec Corp | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
| JP6334223B2 (ja) * | 2014-03-26 | 2018-05-30 | リンテック株式会社 | 粘着シート |
| JP5823591B1 (ja) * | 2014-10-01 | 2015-11-25 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法 |
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- 2017-02-10 KR KR1020187025052A patent/KR20180120173A/ko not_active Application Discontinuation
- 2017-02-10 SG SG11201807452UA patent/SG11201807452UA/en unknown
- 2017-02-10 CN CN201780014253.6A patent/CN108778722A/zh active Pending
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- 2017-02-10 JP JP2018503001A patent/JP6818009B2/ja active Active
- 2017-02-15 TW TW106104893A patent/TWI764885B/zh active
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| Publication number | Publication date |
|---|---|
| CN108778722A (zh) | 2018-11-09 |
| KR20180120173A (ko) | 2018-11-05 |
| JPWO2017150145A1 (ja) | 2018-12-27 |
| CN117656639A (zh) | 2024-03-08 |
| TWI764885B (zh) | 2022-05-21 |
| WO2017150145A1 (ja) | 2017-09-08 |
| TW201801916A (zh) | 2018-01-16 |
| SG11201807452UA (en) | 2018-09-27 |
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