JP6810029B2 - 腐食抑制剤及び関連組成物並びに方法 - Google Patents
腐食抑制剤及び関連組成物並びに方法 Download PDFInfo
- Publication number
- JP6810029B2 JP6810029B2 JP2017519872A JP2017519872A JP6810029B2 JP 6810029 B2 JP6810029 B2 JP 6810029B2 JP 2017519872 A JP2017519872 A JP 2017519872A JP 2017519872 A JP2017519872 A JP 2017519872A JP 6810029 B2 JP6810029 B2 JP 6810029B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- weight
- cobalt
- polishing composition
- chemical mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462066484P | 2014-10-21 | 2014-10-21 | |
| US62/066,484 | 2014-10-21 | ||
| US201562198013P | 2015-07-28 | 2015-07-28 | |
| US62/198,013 | 2015-07-28 | ||
| PCT/US2015/056744 WO2016065057A1 (en) | 2014-10-21 | 2015-10-21 | Corrosion inhibitors and related compositions and methods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018500456A JP2018500456A (ja) | 2018-01-11 |
| JP2018500456A5 JP2018500456A5 (https=) | 2020-04-09 |
| JP6810029B2 true JP6810029B2 (ja) | 2021-01-06 |
Family
ID=55748310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017519872A Active JP6810029B2 (ja) | 2014-10-21 | 2015-10-21 | 腐食抑制剤及び関連組成物並びに方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10124464B2 (https=) |
| EP (1) | EP3209815B1 (https=) |
| JP (1) | JP6810029B2 (https=) |
| KR (1) | KR102477843B1 (https=) |
| CN (2) | CN107148496A (https=) |
| TW (1) | TWI611049B (https=) |
| WO (1) | WO2016065057A1 (https=) |
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| US10077382B1 (en) | 2017-03-06 | 2018-09-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for polishing cobalt-containing substrate |
| CN110431209B (zh) * | 2017-03-14 | 2022-06-28 | 福吉米株式会社 | 研磨用组合物、其制造方法以及使用其的研磨方法及基板的制造方法 |
| JP6901297B2 (ja) | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
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| WO2019050909A1 (en) * | 2017-09-07 | 2019-03-14 | Stepan Company | CORROSION INHIBITORS FOR OIL FIELD APPLICATIONS |
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| DE102019104019A1 (de) * | 2019-02-18 | 2020-08-20 | Johann Wolfgang Goethe-Universität | Gegen Korrosion geschütztes Erzeugnis, Verfahren zur Herstellung und Verwendung einer Aminosäureverbindung zum Korrosionsschutz |
| US10947413B2 (en) * | 2019-03-29 | 2021-03-16 | Rohm And Haas Electronic Materials Cmp Holdings | Chemical mechanical polishing method for cobalt with high cobalt removal rates and reduced cobalt corrosion |
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| JP7607581B2 (ja) * | 2019-04-17 | 2024-12-27 | シーエムシー マテリアルズ リミティド ライアビリティ カンパニー | タングステンバフ用途のための表面被覆された研削粒子 |
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| CN114686110A (zh) * | 2020-12-30 | 2022-07-01 | 安集微电子科技(上海)股份有限公司 | 一种化学机械抛光液 |
| WO2022145654A1 (ko) * | 2020-12-30 | 2022-07-07 | 에스케이씨솔믹스 주식회사 | 반도체 공정용 연마 조성물, 연마 조성물의 제조 방법 및 연마 조성물을 적용한 반도체 소자의 제조 방법 |
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| CN113881347B (zh) * | 2021-10-15 | 2023-01-31 | 深圳市科玺化工有限公司 | 一种硅晶圆用化学机械精抛液 |
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| US8865635B1 (en) * | 2013-04-09 | 2014-10-21 | S.C. Johnson & Son, Inc. | Aqueous-based cleaning composition with a water-insoluble, fatty alcohol-based builder |
| US10358579B2 (en) | 2013-12-03 | 2019-07-23 | Cabot Microelectronics Corporation | CMP compositions and methods for polishing nickel phosphorous surfaces |
| US10059860B2 (en) * | 2014-02-26 | 2018-08-28 | Fujimi Incorporated | Polishing composition |
| US10217645B2 (en) * | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
-
2015
- 2015-10-21 WO PCT/US2015/056744 patent/WO2016065057A1/en not_active Ceased
- 2015-10-21 KR KR1020177013244A patent/KR102477843B1/ko active Active
- 2015-10-21 TW TW104134573A patent/TWI611049B/zh active
- 2015-10-21 JP JP2017519872A patent/JP6810029B2/ja active Active
- 2015-10-21 EP EP15853494.1A patent/EP3209815B1/en active Active
- 2015-10-21 CN CN201580057443.7A patent/CN107148496A/zh active Pending
- 2015-10-21 US US14/919,404 patent/US10124464B2/en active Active
- 2015-10-21 CN CN202310169002.2A patent/CN116288366A/zh active Pending
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|---|---|
| EP3209815B1 (en) | 2021-12-29 |
| CN116288366A (zh) | 2023-06-23 |
| CN107148496A (zh) | 2017-09-08 |
| US20160107289A1 (en) | 2016-04-21 |
| KR20170068584A (ko) | 2017-06-19 |
| TWI611049B (zh) | 2018-01-11 |
| US10124464B2 (en) | 2018-11-13 |
| JP2018500456A (ja) | 2018-01-11 |
| EP3209815A1 (en) | 2017-08-30 |
| EP3209815A4 (en) | 2018-08-01 |
| WO2016065057A1 (en) | 2016-04-28 |
| KR102477843B1 (ko) | 2022-12-16 |
| TW201629269A (zh) | 2016-08-16 |
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