JP6790816B2 - ポリイミド系接着剤 - Google Patents

ポリイミド系接着剤 Download PDF

Info

Publication number
JP6790816B2
JP6790816B2 JP2016253765A JP2016253765A JP6790816B2 JP 6790816 B2 JP6790816 B2 JP 6790816B2 JP 2016253765 A JP2016253765 A JP 2016253765A JP 2016253765 A JP2016253765 A JP 2016253765A JP 6790816 B2 JP6790816 B2 JP 6790816B2
Authority
JP
Japan
Prior art keywords
component
polyimide
bis
adhesive
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016253765A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017119865A (ja
Inventor
崇司 田崎
崇司 田崎
淳 塩谷
淳 塩谷
山口　貴史
貴史 山口
啓輔 ▲杉▼本
啓輔 ▲杉▼本
太陽 中村
太陽 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arakawa Chemical Industries Ltd
Original Assignee
Arakawa Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chemical Industries Ltd filed Critical Arakawa Chemical Industries Ltd
Publication of JP2017119865A publication Critical patent/JP2017119865A/ja
Application granted granted Critical
Publication of JP6790816B2 publication Critical patent/JP6790816B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F240/00—Copolymers of hydrocarbons and mineral oils, e.g. petroleum resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/04—Reduction, e.g. hydrogenation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C08L57/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2016253765A 2015-12-28 2016-12-27 ポリイミド系接着剤 Active JP6790816B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015255860 2015-12-28
JP2015255860 2015-12-28

Publications (2)

Publication Number Publication Date
JP2017119865A JP2017119865A (ja) 2017-07-06
JP6790816B2 true JP6790816B2 (ja) 2020-11-25

Family

ID=59271931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016253765A Active JP6790816B2 (ja) 2015-12-28 2016-12-27 ポリイミド系接着剤

Country Status (4)

Country Link
JP (1) JP6790816B2 (zh)
KR (1) KR102485692B1 (zh)
CN (1) CN106995678B (zh)
TW (1) TWI715700B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE49929E1 (en) 2017-08-08 2024-04-16 Sumitomo Electric Industries, Ltd. Substrate for high-frequency printed wiring board
KR102009417B1 (ko) * 2017-08-18 2019-08-12 율촌화학 주식회사 폴리이미드계 접착제 조성물, 이를 포함하는 본딩 시트, 및 이를 이용한 본딩 시트 제조방법
JP7486279B2 (ja) * 2017-09-29 2024-05-17 日鉄ケミカル＆マテリアル株式会社 ポリイミドの製造方法
CN108058238B (zh) * 2017-12-08 2020-01-17 山东峰泰木业有限公司 一种定向门板专用胶合板及其制备方法
KR102224438B1 (ko) * 2018-12-19 2021-03-09 율촌화학 주식회사 저유전 접착제 조성물 및 이를 포함하는 커버레이 필름
CN109868089A (zh) * 2019-01-28 2019-06-11 东莞市澳中电子材料有限公司 一种pi膜阻燃胶带
CN112980385B (zh) * 2019-12-16 2024-06-18 荒川化学工业株式会社 粘接剂组合物、粘接剂组合物的相关制品及其制备方法
CN111057500B (zh) * 2019-12-26 2020-06-26 中国科学院兰州化学物理研究所 一种胶粘剂及其在粘接复合纤维织物与金属基体中的应用
CN115449335A (zh) * 2022-09-05 2022-12-09 瑞声科技（南京）有限公司 树脂组合物及胶粘剂

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000086888A (ja) * 1998-09-14 2000-03-28 Hitachi Chem Co Ltd 樹脂組成物、接着剤、接着フィルム、これを用いたリードフレーム及び半導体装置
JP2001247819A (ja) * 2000-03-03 2001-09-14 Dow Corning Toray Silicone Co Ltd 電気絶縁性架橋薄膜形成性有機樹脂組成物、および電気絶縁性架橋薄膜の形成方法
JP4169978B2 (ja) * 2002-01-07 2008-10-22 株式会社カネカ 低誘電接着剤及びそれから成るフィルム状接合部材
JP2006117848A (ja) * 2004-10-22 2006-05-11 Kaneka Corp 熱硬化性樹脂組成物およびその利用
JP4577895B2 (ja) * 2005-06-10 2010-11-10 信越化学工業株式会社 接着剤組成物及び接着性フィルム
WO2007076014A2 (en) * 2005-12-23 2007-07-05 World Properties, Inc. Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
JP5338469B2 (ja) 2008-05-14 2013-11-13 三菱瓦斯化学株式会社 ポリイミドおよびポリアミック酸
CN101781544A (zh) * 2009-01-21 2010-07-21 新扬科技股份有限公司 粘合剂的组合物及其应用
AU2010253022B2 (en) * 2009-05-28 2015-04-09 Mitsubishi Chemical Corporation EVOH resin composition, and molded article and multilayer structure both comprising same
JP2013155329A (ja) * 2012-01-31 2013-08-15 T & K Toka Co Ltd 溶剤可溶性ポリイミド樹脂及びその製造方法、並びに前記ポリイミド樹脂を含有するポリイミド組成物、ポリイミドフィルム、及びコーティング物品
TWI493007B (zh) * 2012-02-24 2015-07-21 Arakawa Chem Ind A polyimide-based adhesive composition, a hardened product, an adhesive sheet, a laminate, and a flexible printed substrate
JP5534378B2 (ja) * 2012-02-24 2014-06-25 荒川化学工業株式会社 ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板
JP2013186808A (ja) * 2012-03-09 2013-09-19 Lintec Corp タッチパネル部材貼付用粘着剤、タッチパネル部材貼付用粘着シート、及びタッチパネル装置
TWI484013B (zh) * 2012-03-12 2015-05-11 Showa Denko Kk A polymerizable composition, a polymer, an image display device, and a method for manufacturing the same
JP2013245245A (ja) * 2012-05-23 2013-12-09 Hitachi Chemical Co Ltd 銅張り積層板又はフレキシブル配線板補強用粘着剤、銅張り積層板又はフレキシブル配線板補強用粘着シート、及びそれらの使用方法
JP2014045076A (ja) 2012-08-27 2014-03-13 Nippon Kayaku Co Ltd 高周波回路用基板
JP2015117278A (ja) * 2013-12-17 2015-06-25 株式会社ティ−アンドケイ東華 官能基化ポリイミド樹脂及びそれを含むエポキシ樹脂組成物
JP6267509B2 (ja) * 2013-12-27 2018-01-24 新日鉄住金化学株式会社 ポリアミド酸組成物、ポリイミド、樹脂フィルム及び金属張積層体

Also Published As

Publication number Publication date
CN106995678B (zh) 2021-01-15
JP2017119865A (ja) 2017-07-06
TW201736559A (zh) 2017-10-16
CN106995678A (zh) 2017-08-01
TWI715700B (zh) 2021-01-11
KR102485692B1 (ko) 2023-01-05
KR20170077826A (ko) 2017-07-06

Similar Documents

Publication Publication Date Title
JP6790816B2 (ja) ポリイミド系接着剤
KR102485693B1 (ko) 폴리이미드, 접착제, 필름상 접착재, 접착층, 접착 시트, 수지 부착 동박, 동피복 적층판, 프린트 배선판, 그리고 다층 배선판 및 그 제조 방법
JP7102691B2 (ja) フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板
TWI716524B (zh) 覆銅積層體及印刷線路板
KR102211591B1 (ko) 폴리이미드, 폴리이미드계 접착제, 필름상 접착재, 접착층, 접착 시트, 수지부 동박, 동피복 적층판 및 프린트 배선판, 그리고 다층 배선판 및 그 제조 방법
JP6593649B2 (ja) 接着剤組成物、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、フレキシブル銅張積層板、プリント配線板、フレキシブルプリント配線板、多層配線板、プリント回路板、及びフレキシブルプリント回路板
JP6635403B2 (ja) 樹脂付銅箔、銅張積層板、プリント配線板及び多層配線板
KR102323830B1 (ko) 폴리이미드, 접착제, 필름상 접착재, 접착층, 접착 시트, 수지 부착 동박, 동피복 적층판, 프린트 배선판, 그리고 다층 배선판 및 그 제조 방법
CN108690552B (zh) 胶粘剂、胶粘材料、胶粘层、胶粘片、铜箔、覆铜层叠板、布线板及制造方法
CN106947079B (zh) 改性聚酰亚胺、胶粘剂组合物、带树脂的铜箔、覆铜层叠板、印刷布线板和多层基板
JP6825289B2 (ja) 樹脂組成物、接着剤、フィルム状接着材、接着シート、多層配線板、樹脂付銅箔、銅張積層板、プリント配線板
JP2018168369A (ja) ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP7205335B2 (ja) ポリイミド、接着剤、架橋剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP6759932B2 (ja) 変性ポリイミド、接着剤組成物、樹脂付銅箔、銅張積層板、プリント配線板及び多層基板
JP6881664B1 (ja) ポリイミド樹脂組成物、接着剤組成物、フィルム状接着材、接着シート、樹脂付銅箔、銅張積層板、プリント配線板及びポリイミドフィルム
JP2022132145A (ja) 接着剤組成物、硬化物、接着シート、樹脂付銅箔、銅張積層板、プリント配線板
JP2022125999A (ja) ポリイミド樹脂組成物、接着剤組成物、フィルム状接着材、接着シート、樹脂付銅箔、銅張積層板、プリント配線板及びポリイミドフィルム
KR20170038740A (ko) 수지 조성물, 접착제, 필름형 접착 기재, 접착 시트, 다층 배선판, 수지 부착 동박, 동장 적층판, 프린트 배선판
TWI701272B (zh) 樹脂組成物、黏著劑、薄膜狀黏著材料、黏著薄片、多層線路板、附有樹脂之銅箔、覆銅積層板、印刷線路板
TW201700700A (zh) 聚醯亞胺系黏著劑、薄膜狀黏著材料、黏著層、黏著薄片、覆銅積層板及印刷線路板、以及多層線路板及其製造方法
TWI724033B (zh) 改質聚醯亞胺、黏著劑組成物、附有樹脂之銅箔、覆銅積層板、印刷線路板及多層基板
JP2022091132A (ja) 接着剤組成物、硬化物、接着シート、樹脂付銅箔、銅張積層板、プリント配線板
JP2022188337A (ja) 接着剤組成物、硬化物、接着シート、樹脂付金属箔、金属張積層板、プリント配線板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190805

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200630

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201006

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201019

R150 Certificate of patent or registration of utility model

Ref document number: 6790816

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250