JP6781667B2 - 半導体装置およびその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 176
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 claims description 83
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 79
- 229920005591 polysilicon Polymers 0.000 claims description 79
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- 229910052581 Si3N4 Inorganic materials 0.000 claims description 48
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 37
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 23
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
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Description
実施の形態1に係る半導体装置について説明する。図1および図2に示すように、半導体装置PSDでは、半導体基板SUBの第1主面の側に素子領域EFRとゲート電極パッドGEPとが規定されている。素子領域EFRは、分離領域IRによって他の領域(図示せず)と電気的に分離されている。半導体基板SUBは、n+型の基板BSUBとその基板BSUBの表面に形成されたp型エピタキシャル層PELとを含む。p型エピタキシャル層PELの一部は、分離領域IRのp型の分離層PIRとなる。
上述した半導体装置PSDでは、ゲート電極TGELを覆うシリコン窒化膜NPGを残す場合について説明した(図2参照)。このシリコン窒化膜NPGは、必要に応じて除去するようにしてもよい。ここでは、変形例として、製造工程の途中において、シリコン窒化膜NPGを除去する場合について説明する。なお、図2等に示す半導体装置PSDの構成と同一部材については同一符号を付し、必要である場合を除きその説明を繰り返さないこととする。
実施の形態2に係る半導体装置について説明する。図30に示すように、素子領域EFRにおけるn型ドリフト層NDLには、半導体基板SUBの一方の主面から所定の深さ(第1深さ)に達するディープトレンチDTCが形成されている。そのディープトレンチDTC内に、埋め込み絶縁体ZOFが形成されている。埋め込み絶縁体ZOFは、ディープトレンチDTC内にシリコン窒化膜、シリコン酸化膜およびポリシリコン膜(図示せず)が形成された状態で、熱酸化処理を行うことによって形成されている。
実施の形態3に係る半導体装置について説明する。図37に示すように、素子領域EFRにおけるn型ドリフト層NDLには、半導体基板SUBの一方の主面から所定の深さ(第1深さ)に達するディープトレンチDTCが形成されている。そのディープトレンチDTC内に、埋め込み絶縁体ZOFが形成されている。埋め込み絶縁体ZOFは、ディープトレンチDTC内にシリコン窒化膜、シリコン酸化膜およびポリシリコン膜(図示せず)が形成された状態で、熱酸化処理を行うことによって形成されている。
Claims (20)
- 第1導電型の第1領域と、前記第1領域に接するように形成された第2導電型の第2領域とが交互に配置され、半導体基板における第1主面と第2主面との間において電流の導通を行う半導体素子を備えた半導体装置の製造方法であって、
前記半導体基板における前記第1主面の側に素子領域を規定する工程と、
前記素子領域に、前記第1主面から第1深さに達するトレンチを形成する工程と、
前記トレンチを介して、第1導電型の第1不純物を導入することによって、前記第1主面から前記第1深さよりも深い第2深さにわたり、第1導電型の前記第1領域を形成する工程と、
前記トレンチを介して、第2導電型の第2不純物を導入することによって、前記トレンチの側壁面に沿って、前記第1領域に接するように第2導電型の前記第2領域を形成する工程と、
前記トレンチを埋め込むように、第1膜および第2膜を含む埋め込み体を形成する工程と
を備え、
前記半導体素子を形成する工程は、熱酸化によって、前記素子領域に位置する前記半導体基板における前記第1主面に保護絶縁膜を形成する工程を含み、
前記保護絶縁膜を形成する工程では、前記熱酸化によって、前記第1膜は収縮し、前記第2膜は膨張し、前記埋め込み体は埋め込み絶縁体となり、
前記保護絶縁膜を形成する工程の後では、前記第1膜が収縮した状態が維持されるとともに、前記第2膜が膨張した状態が維持される、半導体装置の製造方法。 - 前記埋め込み体を形成する工程では、
前記第1膜は、前記トレンチの前記側壁面を含む内壁面に接する態様で形成され、
前記第2膜は、前記トレンチを埋め込む態様で、前記第1膜に接するように形成される、請求項1記載の半導体装置の製造方法。 - 前記埋め込み体を形成する工程では、
前記第1膜として、化学気相成長法によってシリコン酸化膜が形成され、
前記第2膜として、ポリシリコン膜が形成される、請求項2記載の半導体装置の製造方法。 - 前記埋め込み体を形成する工程は、
前記トレンチの前記側壁面を含む内壁面に接する態様で、前記熱酸化を阻止する第1酸化阻止膜を形成する工程と、
前記第1酸化阻止膜に接するように前記第1膜を形成する工程と、
前記第1膜に接するように前記第2膜を形成する工程と
を含む、請求項1記載の半導体装置の製造方法。 - 前記埋め込み体を形成する工程では、
前記第1酸化阻止膜として、シリコン窒化膜が形成され、
前記第1膜として、化学気相成長法によってシリコン酸化膜が形成され、
前記第2膜として、ポリシリコン膜が形成される、請求項4記載の半導体装置の製造方法。 - 前記埋め込み体を形成する工程は、
前記トレンチの前記側壁面を含む内壁面に接する態様で、前記熱酸化を阻止する第1酸化阻止膜を形成する工程と、
前記第1酸化阻止膜に接するように前記第2膜を形成する工程と、
前記第2膜に接するように前記第1膜を形成する工程と
を含む、請求項1記載の半導体装置の製造方法。 - 前記埋め込み体を形成する工程では、
前記第1酸化阻止膜として、シリコン窒化膜が形成され、
前記第1膜として、化学気相成長法によってシリコン酸化膜が形成され、
前記第2膜として、ポリシリコン膜が形成される、請求項6記載の半導体装置の製造方法。 - 前記半導体素子を形成する工程は、
前記素子領域における前記第1領域に、前記第1主面から前記第1深さよりも浅い第3深さに達するゲートトレンチを形成する工程と、
前記ゲートトレンチ内にゲート絶縁膜を介在させてゲート電極を形成する工程と、
前記保護絶縁膜を形成した後、前記素子領域における前記第1領域に、第2導電型の不純物を注入することにより、前記第1主面から前記第3深さよりも浅い第4深さにわたり、ベース領域を形成する工程と、
前記ベース領域に、第1導電型の不純物を注入することにより、ソース領域を形成する工程と
を含む、請求項1記載の半導体装置の製造方法。 - 前記ゲート電極を形成した後、前記保護絶縁膜を形成する前に、前記ゲート電極を覆うように、前記熱酸化を阻止する第2酸化阻止膜を形成する工程を含む、請求項8記載の半導体装置の製造方法。
- 前記保護絶縁膜を形成した後、前記第2酸化阻止膜を除去する工程を含む、請求項9記載の半導体装置の製造方法。
- 前記トレンチは、互いに第1ピッチをもってドット状に複数配置され、
前記埋め込み絶縁体は、ドット状に配置された複数の前記トレンチのそれぞれに形成された、請求項1記載の半導体装置の製造方法。 - 前記トレンチは、互いに第2ピッチをもってストライプ状に複数配置され、
前記埋め込み絶縁体は、ストライプ状に配置された複数の前記トレンチのそれぞれに形成された、請求項1記載の半導体装置の製造方法。 - 前記トレンチを形成する工程では、前記トレンチの幅に対する前記トレンチの前記第1深さの比をアスペクト比とすると、
前記アスペクト比は7以上である、請求項1記載の半導体装置の製造方法。 - 前記トレンチを形成する工程では、前記素子領域において前記トレンチが形成される領域の面積の割合を占有率とすると、
前記占有率は10%以上である、請求項1記載の半導体装置の製造方法。 - 第1導電型の第1領域と、前記第1領域に接するように形成された第2導電型の第2領域とが交互に配置され、半導体基板における第1主面と第2主面との間において電流の導通を行う半導体素子を備えた半導体装置であって、
前記半導体基板の前記第1主面の側に規定され、前記第1領域および前記第2領域が配置された素子領域と、
前記素子領域に形成され、前記第2領域に接するように、前記半導体基板の前記第1主面から第1深さにわたり形成された埋め込み絶縁体と
を備え、
前記埋め込み絶縁体は、
前記第2領域に接するように形成され、酸化を阻止する酸化阻止膜と、
前記酸化阻止膜に接するように形成された酸化膜と
を備えた、半導体装置。 - 前記半導体素子は、前記素子領域に形成された電界効果型トランジスタを有し、
前記電界効果型トランジスタは、
前記素子領域における前記第1領域に、前記第1主面から前記第1深さよりも浅い深さに達するゲートトレンチ内にゲート絶縁膜を介在させて形成されたゲート電極を含む、請求項15記載の半導体装置。 - 前記埋め込み絶縁体は、互いに第1ピッチをもってドット状に複数配置された、請求項15記載の半導体装置。
- 前記埋め込み絶縁体は、互いに第2ピッチをもってストライプ状に複数配置された、請求項15記載の半導体装置。
- 前記埋め込み絶縁体の幅に対する前記埋め込み絶縁体の前記第1深さに相当する長さのアスペクト比は7以上である、請求項15記載の半導体装置。
- 前記素子領域において、前記埋め込み絶縁体が配置されている占有面積の割合は10%以上である、請求項15記載の半導体装置。
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