JP6774163B2 - 光電変換装置 - Google Patents
光電変換装置 Download PDFInfo
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- JP6774163B2 JP6774163B2 JP2014245262A JP2014245262A JP6774163B2 JP 6774163 B2 JP6774163 B2 JP 6774163B2 JP 2014245262 A JP2014245262 A JP 2014245262A JP 2014245262 A JP2014245262 A JP 2014245262A JP 6774163 B2 JP6774163 B2 JP 6774163B2
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
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- H01L31/03529—Shape of the potential jump barrier or surface barrier
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Description
図1は、本発明の第1実施形態に係る光電変換装置の平面図を示す模式図である。光電変換装置1は、シリコン基板101、n型非晶質半導体層102n、p型非晶質半導体層102p、電極103を備える。
上述した第1実施形態では、シリコン基板101の裏面の全面に、i型非晶質半導体層102iを形成した後、i型非晶質半導体層102iの上にp型非晶質半導体層102pを形成し、その後、n型非晶質半導体層102nを形成する例を説明したが、p型非晶質半導体層102pとn型非晶質半導体層102nの形成順序はこれに限定されない。
図11Aは、本実施形態における光電変換装置の平面図を表す模式図である。図11Aにおいて、第1実施形態と同様の構成には第1実施形態と同じ符号を付している。
図12Aは、本実施形態における光電変換装置の平面図を表す模式図である。図12Aにおいて、第1実施形態と同様の構成には第1実施形態と同じ符号を付している。
図13Aは、本実施形態における光電変換装置の平面図を表す模式図である。図13Bは、図13Aに示す光電変換装置1Dの一部を拡大した模式図であり、図13Cは、図13Bに示す光電変換装置1Dの一部分をI−I線で切断した断面図である。図13B及び13Cでは、p型非晶質半導体層102p上のp型電極103pが形成された一部分を例示するが、n型非晶質半導体層102n上のn型電極103nが形成された部分も同様である。図13A〜13Cにおいて、第1実施形態と同様の構成には第1実施形態と同じ符号を付している。
図14Aは、本実施形態における光電変換装置の平面図を表す模式図である。図14Bは、図14Aに示す光電変換装置1Eの一部を拡大した模式図であり、図14Cは、図14Bに示す光電変換装置1Dの一部分をII−II線で切断した断面図である。図14B及び14Cでは、p型非晶質半導体層102p上のp型電極103pが形成された一部分を例示するが、n型非晶質半導体層102n上のn型電極103nが形成された部分も同様である。図14A〜14Cにおいて、第1実施形態と同様の構成には第1実施形態と同じ符号を付している。
上述した第1実施形態では、シリコン基板101の受光面にテクスチャが形成されている例を説明したが、シリコン基板101の裏面にテクスチャが形成されていてもよい。
本実施形態では、上述した第1実施形態から第7実施形態の少なくとも1つの光電変換装置を備えた光電変換モジュールについて説明する。図16は、本実施形態に係る光電変換モジュールの構成を示す概略図である。光電変換モジュール1000は、複数の光電変換装置11と、カバー1002と、出力端子1003,1004とを備える。
図17Aは、本実施形態に係る太陽光発電システムの構成を示す概略図である。太陽光発電システム1100は、光電変換モジュールアレイ1101と、接続箱1102と、パワーコンディショナー1103と、分電盤1104と、電力メーター1105とを備える。太陽光発電システム1100には、「ホーム・エネルギー・マネジメント・システム(HEMS:Home Energy Management System)」、「ビルディング・エネルギー・マネジメント・システム(BEMS:Building Energy Management System)」等の機能を付加することができる。これにより、太陽光発電システム1100の発電量の監視、太陽光発電システム1100に接続される各電気機器類の消費電力量の監視・制御等を行うことができ、エネルギー消費量を削減することができる。
図19Aは、本実施形態に係る太陽光発電システムの構成を示す概略図である。太陽光発電システム1200は、サブシステム1201〜120n(nは2以上の整数)と、パワーコンディショナー1211〜121nと、変圧器1221とを備える。太陽光発電システム1200は、図17A、17Bに示す太陽光発電システム1100よりも規模が大きい太陽光発電システムである。
以上、本発明の第1〜第10実施形態にかかる光電変換装置について説明した。本発明の光電変換装置は上述の各実施形態のみに限定されず、発明の範囲内で種々の変更が可能である。また、各実施形態は、適宜組み合わせて実施することが可能である。
Claims (5)
- 半導体基板と、
前記半導体基板の一方の面上に、第1および第2の導電型を有する複数の半導体部が、前記半導体基板の面内における第1の方向に沿って交互に配置されてなる非晶質半導体部と、
前記複数の半導体部の上に形成された複数の電極と、
前記複数の電極の上に形成され、前記複数の電極のうち同じ導電型を有する半導体部の上に形成された電極を互いに電気的に接続する配線材と、を備え、
前記複数の半導体部のそれぞれは、前記第1の方向と交差する第2の方向に沿って連続して設けられ、
前記複数の半導体部の少なくとも一部において、1つの半導体部の上に、前記複数の電極のうち少なくとも2つの電極が、これらの電極に対応する開口部が離間して設けられたシャドーマスクを用いて形成されている、光電変換装置。 - 半導体基板と、
前記半導体基板の一方の面上に櫛歯状に形成された第1導電型を有する第1非晶質半導体層と、
前記半導体基板の前記一方の面上に櫛歯状に形成され、かつ前記半導体基板の面内方向において前記第1非晶質半導体層に隣接して形成され、前記第1導電型と反対の第2導電型を有する第2非晶質半導体層と、
前記第1非晶質半導体層、及び前記第2非晶質半導体層の少なくとも一方の半導体層の上に、櫛歯状に形成された複数の電極と、
前記複数の電極の上に形成され、前記複数の電極のうち同じ導電型を有する半導体部の上に形成された電極を互いに電気的に接続する配線材と、を備え、
前記第1非晶質半導体層と前記第2非晶質半導体層のそれぞれは、前記半導体基板上の第1の方向に沿って連続して設けられた連結部と、前記連結部と接続され、前記第1の方向に互いに離間して配置された複数の櫛歯部とを有し、
前記複数の櫛歯部のそれぞれは前記第1の方向に直交する第2の方向に沿って連続して配置され、
前記複数の電極のそれぞれは、前記第1の方向に略平行な第1の電極部分と、前記第2の方向に略平行であり、前記第1の電極部分の一の辺に接する複数の第2の電極部分とを含み、
前記第1の電極部分は、前記少なくとも一方の半導体層における前記連結部の上に設けられ、前記複数の第2の電極部分のそれぞれは、前記少なくとも一方の半導体層における前記複数の櫛歯部の上に設けられ、
前記複数の電極は、前記第1の電極部分が前記第1の方向において互いに離間するように、前記第1の電極部分のそれぞれに対応する開口部が離間して設けられたシャドーマスクを用いて形成されている、光電変換装置。 - 請求項1又は2に記載の光電変換装置であって、
前記配線材は、金属ペーストからなる導電層を含む、光電変換装置。 - 請求項1から3のいずれか一項に記載の光電変換装置であって、
前記半導体基板の両面の少なくとも一方の面にテクスチャ形状を有する、光電変換装置。 - 請求項1から4のいずれか一項に記載の光電変換装置であって、
前記配線材と前記複数の電極とが接する領域以外の領域に絶縁層が設けられている、光電変換装置。
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