JP6768561B2 - 露光装置、基板処理装置、基板の露光方法および基板処理方法 - Google Patents

露光装置、基板処理装置、基板の露光方法および基板処理方法 Download PDF

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Publication number
JP6768561B2
JP6768561B2 JP2017038236A JP2017038236A JP6768561B2 JP 6768561 B2 JP6768561 B2 JP 6768561B2 JP 2017038236 A JP2017038236 A JP 2017038236A JP 2017038236 A JP2017038236 A JP 2017038236A JP 6768561 B2 JP6768561 B2 JP 6768561B2
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Japan
Prior art keywords
substrate
light
ultraviolet rays
vacuum ultraviolet
unit
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Active
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JP2017038236A
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English (en)
Japanese (ja)
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JP2018147918A (ja
JP2018147918A5 (enExample
Inventor
靖博 福本
靖博 福本
孝文 大木
孝文 大木
友宏 松尾
友宏 松尾
正也 浅井
正也 浅井
将彦 春本
将彦 春本
田中　裕二
裕二 田中
知佐世 中山
知佐世 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017038236A priority Critical patent/JP6768561B2/ja
Priority to CN201780077239.0A priority patent/CN110100301B/zh
Priority to KR1020197023927A priority patent/KR102307596B1/ko
Priority to PCT/JP2017/036074 priority patent/WO2018159005A1/ja
Priority to TW106135708A priority patent/TWI649642B/zh
Publication of JP2018147918A publication Critical patent/JP2018147918A/ja
Publication of JP2018147918A5 publication Critical patent/JP2018147918A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017038236A 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法 Active JP6768561B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017038236A JP6768561B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法
CN201780077239.0A CN110100301B (zh) 2017-03-01 2017-10-04 曝光装置、衬底处理装置、衬底曝光方法及衬底处理方法
KR1020197023927A KR102307596B1 (ko) 2017-03-01 2017-10-04 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법
PCT/JP2017/036074 WO2018159005A1 (ja) 2017-03-01 2017-10-04 露光装置、基板処理装置、基板の露光方法および基板処理方法
TW106135708A TWI649642B (zh) 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017038236A JP6768561B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法

Publications (3)

Publication Number Publication Date
JP2018147918A JP2018147918A (ja) 2018-09-20
JP2018147918A5 JP2018147918A5 (enExample) 2020-04-02
JP6768561B2 true JP6768561B2 (ja) 2020-10-14

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JP2017038236A Active JP6768561B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法

Country Status (5)

Country Link
JP (1) JP6768561B2 (enExample)
KR (1) KR102307596B1 (enExample)
CN (1) CN110100301B (enExample)
TW (1) TWI649642B (enExample)
WO (1) WO2018159005A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018146616A (ja) * 2017-03-01 2018-09-20 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11968772B2 (en) * 2019-05-30 2024-04-23 Kla Corporation Optical etendue matching methods for extreme ultraviolet metrology

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JP3378271B2 (ja) * 1992-06-11 2003-02-17 株式会社ニコン 露光方法及び装置、並びに前記方法を使用するデバイス製造方法
JPH10229038A (ja) * 1997-02-14 1998-08-25 Nikon Corp 露光量制御方法
JPH10284407A (ja) * 1997-04-08 1998-10-23 Nikon Corp 露光装置及び露光装置を用いた半導体デバイスの製造方法
ATE358888T1 (de) * 1997-07-25 2007-04-15 Nikon Corp Belichtungsverfahren und belichtungsapparat
JPH11251220A (ja) * 1998-03-02 1999-09-17 Nikon Corp 露光装置及び露光方法
JP2000100685A (ja) * 1998-09-17 2000-04-07 Nikon Corp 露光装置及び該装置を用いた露光方法
JP2001110710A (ja) * 1999-10-08 2001-04-20 Nikon Corp 露光装置、露光方法、および半導体デバイスの製造方法
US6211942B1 (en) * 2000-03-10 2001-04-03 Howa Machinery Ltd. Double-sided exposure system
EP1788694A4 (en) * 2004-07-15 2014-07-02 Nikon Corp EQUIPMENT FOR PLANAR MOTOR, STAGE EQUIPMENT, EXPOSURE EQUIPMENT AND METHOD OF MANUFACTURING THE DEVICE
JP4485282B2 (ja) * 2004-08-06 2010-06-16 シャープ株式会社 露光装置、露光量制御方法、露光量制御プログラムとその記録媒体
JP4491445B2 (ja) * 2005-11-04 2010-06-30 株式会社オーク製作所 周辺露光装置およびその方法
JP4859660B2 (ja) * 2006-12-27 2012-01-25 東京応化工業株式会社 基板処置装置
JP2013104934A (ja) * 2011-11-11 2013-05-30 Tokyo Electron Ltd 露光装置及び露光方法
JP6535197B2 (ja) * 2014-04-28 2019-06-26 株式会社ブイ・テクノロジー 露光装置及び露光方法
JP6543064B2 (ja) * 2015-03-25 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP6495707B2 (ja) * 2015-03-25 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス 露光装置および基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018146616A (ja) * 2017-03-01 2018-09-20 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法

Also Published As

Publication number Publication date
WO2018159005A1 (ja) 2018-09-07
CN110100301A (zh) 2019-08-06
JP2018147918A (ja) 2018-09-20
TW201833670A (zh) 2018-09-16
TWI649642B (zh) 2019-02-01
CN110100301B (zh) 2023-07-21
KR20190102289A (ko) 2019-09-03
KR102307596B1 (ko) 2021-09-30

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