TWI649642B - 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 - Google Patents

曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 Download PDF

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Publication number
TWI649642B
TWI649642B TW106135708A TW106135708A TWI649642B TW I649642 B TWI649642 B TW I649642B TW 106135708 A TW106135708 A TW 106135708A TW 106135708 A TW106135708 A TW 106135708A TW I649642 B TWI649642 B TW I649642B
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TW
Taiwan
Prior art keywords
substrate
light
vacuum ultraviolet
illuminometer
exposure
Prior art date
Application number
TW106135708A
Other languages
English (en)
Chinese (zh)
Other versions
TW201833670A (zh
Inventor
福本靖博
大木孝文
松尾友宏
淺井正也
春本將彥
田中裕二
中山知佐世
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201833670A publication Critical patent/TW201833670A/zh
Application granted granted Critical
Publication of TWI649642B publication Critical patent/TWI649642B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106135708A 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 TWI649642B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-038236 2017-03-01
JP2017038236A JP6768561B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法

Publications (2)

Publication Number Publication Date
TW201833670A TW201833670A (zh) 2018-09-16
TWI649642B true TWI649642B (zh) 2019-02-01

Family

ID=63370897

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106135708A TWI649642B (zh) 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法

Country Status (5)

Country Link
JP (1) JP6768561B2 (enExample)
KR (1) KR102307596B1 (enExample)
CN (1) CN110100301B (enExample)
TW (1) TWI649642B (enExample)
WO (1) WO2018159005A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811119B2 (ja) * 2017-03-01 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
US11968772B2 (en) * 2019-05-30 2024-04-23 Kla Corporation Optical etendue matching methods for extreme ultraviolet metrology

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166316A (ja) * 2006-12-27 2008-07-17 Tokyo Ohka Kogyo Co Ltd 基板処置装置
TW201703113A (zh) * 2015-03-25 2017-01-16 思可林集團股份有限公司 曝光裝置、基板處理裝置、基板的曝光方法以及基板處理方法
TW201704888A (zh) * 2015-03-25 2017-02-01 思可林集團股份有限公司 曝光裝置及基板處理裝置

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
JP3378271B2 (ja) * 1992-06-11 2003-02-17 株式会社ニコン 露光方法及び装置、並びに前記方法を使用するデバイス製造方法
JPH10229038A (ja) * 1997-02-14 1998-08-25 Nikon Corp 露光量制御方法
JPH10284407A (ja) * 1997-04-08 1998-10-23 Nikon Corp 露光装置及び露光装置を用いた半導体デバイスの製造方法
ATE358888T1 (de) * 1997-07-25 2007-04-15 Nikon Corp Belichtungsverfahren und belichtungsapparat
JPH11251220A (ja) * 1998-03-02 1999-09-17 Nikon Corp 露光装置及び露光方法
JP2000100685A (ja) * 1998-09-17 2000-04-07 Nikon Corp 露光装置及び該装置を用いた露光方法
JP2001110710A (ja) * 1999-10-08 2001-04-20 Nikon Corp 露光装置、露光方法、および半導体デバイスの製造方法
US6211942B1 (en) * 2000-03-10 2001-04-03 Howa Machinery Ltd. Double-sided exposure system
EP1788694A4 (en) * 2004-07-15 2014-07-02 Nikon Corp EQUIPMENT FOR PLANAR MOTOR, STAGE EQUIPMENT, EXPOSURE EQUIPMENT AND METHOD OF MANUFACTURING THE DEVICE
JP4485282B2 (ja) * 2004-08-06 2010-06-16 シャープ株式会社 露光装置、露光量制御方法、露光量制御プログラムとその記録媒体
JP4491445B2 (ja) * 2005-11-04 2010-06-30 株式会社オーク製作所 周辺露光装置およびその方法
JP2013104934A (ja) * 2011-11-11 2013-05-30 Tokyo Electron Ltd 露光装置及び露光方法
JP6535197B2 (ja) * 2014-04-28 2019-06-26 株式会社ブイ・テクノロジー 露光装置及び露光方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166316A (ja) * 2006-12-27 2008-07-17 Tokyo Ohka Kogyo Co Ltd 基板処置装置
TW201703113A (zh) * 2015-03-25 2017-01-16 思可林集團股份有限公司 曝光裝置、基板處理裝置、基板的曝光方法以及基板處理方法
TW201704888A (zh) * 2015-03-25 2017-02-01 思可林集團股份有限公司 曝光裝置及基板處理裝置

Also Published As

Publication number Publication date
WO2018159005A1 (ja) 2018-09-07
CN110100301A (zh) 2019-08-06
JP2018147918A (ja) 2018-09-20
TW201833670A (zh) 2018-09-16
CN110100301B (zh) 2023-07-21
JP6768561B2 (ja) 2020-10-14
KR20190102289A (ko) 2019-09-03
KR102307596B1 (ko) 2021-09-30

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