KR102307596B1 - 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법 - Google Patents

노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법 Download PDF

Info

Publication number
KR102307596B1
KR102307596B1 KR1020197023927A KR20197023927A KR102307596B1 KR 102307596 B1 KR102307596 B1 KR 102307596B1 KR 1020197023927 A KR1020197023927 A KR 1020197023927A KR 20197023927 A KR20197023927 A KR 20197023927A KR 102307596 B1 KR102307596 B1 KR 102307596B1
Authority
KR
South Korea
Prior art keywords
substrate
light
vacuum ultraviolet
unit
ultraviolet rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197023927A
Other languages
English (en)
Korean (ko)
Other versions
KR20190102289A (ko
Inventor
야스히로 후쿠모토
다카후미 오키
도모히로 마쓰오
마사야 아사이
마사히코 하루모토
유지 다나카
지사요 나카야마
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20190102289A publication Critical patent/KR20190102289A/ko
Application granted granted Critical
Publication of KR102307596B1 publication Critical patent/KR102307596B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020197023927A 2017-03-01 2017-10-04 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법 Active KR102307596B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017038236A JP6768561B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法
JPJP-P-2017-038236 2017-03-01
PCT/JP2017/036074 WO2018159005A1 (ja) 2017-03-01 2017-10-04 露光装置、基板処理装置、基板の露光方法および基板処理方法

Publications (2)

Publication Number Publication Date
KR20190102289A KR20190102289A (ko) 2019-09-03
KR102307596B1 true KR102307596B1 (ko) 2021-09-30

Family

ID=63370897

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197023927A Active KR102307596B1 (ko) 2017-03-01 2017-10-04 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP6768561B2 (enExample)
KR (1) KR102307596B1 (enExample)
CN (1) CN110100301B (enExample)
TW (1) TWI649642B (enExample)
WO (1) WO2018159005A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811119B2 (ja) * 2017-03-01 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
US11968772B2 (en) * 2019-05-30 2024-04-23 Kla Corporation Optical etendue matching methods for extreme ultraviolet metrology

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000100685A (ja) * 1998-09-17 2000-04-07 Nikon Corp 露光装置及び該装置を用いた露光方法
JP2006049730A (ja) 2004-08-06 2006-02-16 Sharp Corp 露光装置、露光量制御方法、露光量制御プログラムとその記録媒体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3378271B2 (ja) * 1992-06-11 2003-02-17 株式会社ニコン 露光方法及び装置、並びに前記方法を使用するデバイス製造方法
JPH10229038A (ja) * 1997-02-14 1998-08-25 Nikon Corp 露光量制御方法
JPH10284407A (ja) * 1997-04-08 1998-10-23 Nikon Corp 露光装置及び露光装置を用いた半導体デバイスの製造方法
DE69837483T2 (de) * 1997-07-25 2007-12-20 Nikon Corp. Belichtungsverfahren und Belichtungsapparat
JPH11251220A (ja) * 1998-03-02 1999-09-17 Nikon Corp 露光装置及び露光方法
JP2001110710A (ja) * 1999-10-08 2001-04-20 Nikon Corp 露光装置、露光方法、および半導体デバイスの製造方法
US6211942B1 (en) * 2000-03-10 2001-04-03 Howa Machinery Ltd. Double-sided exposure system
WO2006006730A1 (ja) * 2004-07-15 2006-01-19 Nikon Corporation 平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法
JP4491445B2 (ja) * 2005-11-04 2010-06-30 株式会社オーク製作所 周辺露光装置およびその方法
JP4859660B2 (ja) * 2006-12-27 2012-01-25 東京応化工業株式会社 基板処置装置
JP2013104934A (ja) * 2011-11-11 2013-05-30 Tokyo Electron Ltd 露光装置及び露光方法
JP6535197B2 (ja) * 2014-04-28 2019-06-26 株式会社ブイ・テクノロジー 露光装置及び露光方法
JP6495707B2 (ja) * 2015-03-25 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス 露光装置および基板処理装置
JP6543064B2 (ja) * 2015-03-25 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000100685A (ja) * 1998-09-17 2000-04-07 Nikon Corp 露光装置及び該装置を用いた露光方法
JP2006049730A (ja) 2004-08-06 2006-02-16 Sharp Corp 露光装置、露光量制御方法、露光量制御プログラムとその記録媒体

Also Published As

Publication number Publication date
CN110100301A (zh) 2019-08-06
KR20190102289A (ko) 2019-09-03
CN110100301B (zh) 2023-07-21
WO2018159005A1 (ja) 2018-09-07
JP6768561B2 (ja) 2020-10-14
TWI649642B (zh) 2019-02-01
JP2018147918A (ja) 2018-09-20
TW201833670A (zh) 2018-09-16

Similar Documents

Publication Publication Date Title
KR102153174B1 (ko) 노광 장치, 기판 처리 장치, 노광 방법 및 기판 처리 방법
KR102103632B1 (ko) 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법
KR20160115774A (ko) 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법
CN108535965B (zh) 曝光装置、基板处理装置、曝光方法及基板处理方法
KR102307596B1 (ko) 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법
WO2018173344A1 (ja) 露光装置、基板処理装置、基板の露光方法および基板処理方法
TWI666525B (zh) 曝光裝置及基板處理裝置
TWI682433B (zh) 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法
TWI676868B (zh) 曝光裝置、基板處理裝置、基板之曝光方法及基板處理方法
JP6924661B2 (ja) 露光装置、基板処理装置、露光方法および基板処理方法
JP7002262B2 (ja) 露光装置、基板処理装置、露光方法および基板処理方法
KR20210033913A (ko) 노광 장치

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 5