JP6760493B2 - キャリアフィルムおよび電子部品の製造方法 - Google Patents
キャリアフィルムおよび電子部品の製造方法 Download PDFInfo
- Publication number
- JP6760493B2 JP6760493B2 JP2019513655A JP2019513655A JP6760493B2 JP 6760493 B2 JP6760493 B2 JP 6760493B2 JP 2019513655 A JP2019513655 A JP 2019513655A JP 2019513655 A JP2019513655 A JP 2019513655A JP 6760493 B2 JP6760493 B2 JP 6760493B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier film
- sheet member
- ultraviolet laser
- wavelength
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 238000010521 absorption reaction Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- 238000009826 distribution Methods 0.000 claims description 22
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 22
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 21
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 17
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 17
- -1 polyethylene terephthalate Polymers 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 13
- 239000000843 powder Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 description 1
- DBOSBRHMHBENLP-UHFFFAOYSA-N 4-tert-Butylphenyl Salicylate Chemical compound C1=CC(C(C)(C)C)=CC=C1OC(=O)C1=CC=CC=C1O DBOSBRHMHBENLP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/30—Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Laser Beam Processing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017082613 | 2017-04-19 | ||
| JP2017082613 | 2017-04-19 | ||
| PCT/JP2018/015898 WO2018194066A1 (ja) | 2017-04-19 | 2018-04-17 | キャリアフィルムおよび電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2018194066A1 JPWO2018194066A1 (ja) | 2019-12-19 |
| JP6760493B2 true JP6760493B2 (ja) | 2020-09-23 |
Family
ID=63855809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019513655A Active JP6760493B2 (ja) | 2017-04-19 | 2018-04-17 | キャリアフィルムおよび電子部品の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6760493B2 (zh) |
| KR (1) | KR102193968B1 (zh) |
| CN (1) | CN110521291B (zh) |
| WO (1) | WO2018194066A1 (zh) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06304774A (ja) * | 1993-04-23 | 1994-11-01 | Murata Mfg Co Ltd | 積層型セラミック電子部品の製造方法 |
| JPH107776A (ja) * | 1996-06-20 | 1998-01-13 | Toyobo Co Ltd | ポリエステル共重合樹脂及びそれを用いた多層成形品 |
| JPH10235800A (ja) * | 1997-02-28 | 1998-09-08 | Murata Mfg Co Ltd | キャリアフィルム付きセラミックグリーンシート |
| JPH1158343A (ja) * | 1997-08-20 | 1999-03-02 | Murata Mfg Co Ltd | レーザ加工用セラミック複合材 |
| JP2001323075A (ja) * | 1999-12-16 | 2001-11-20 | Matsushita Electric Ind Co Ltd | 離型性フィルム、フイルム付き基材、離型性フィルムの形成方法および回路基板の製造方法 |
| JP2002322438A (ja) * | 2001-04-23 | 2002-11-08 | Sekisui Chem Co Ltd | マスキングテープ |
| JP2005126559A (ja) * | 2003-10-23 | 2005-05-19 | Teijin Dupont Films Japan Ltd | レーザービア加工用フィルム |
| JP2005153358A (ja) * | 2003-11-26 | 2005-06-16 | Kyocera Corp | 保護フィルム付き絶縁層並びに配線基板の製造方法 |
| JP4781635B2 (ja) * | 2004-03-30 | 2011-09-28 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用保護シート |
| JP2006152138A (ja) * | 2004-11-30 | 2006-06-15 | Mitsubishi Polyester Film Copp | 工程紙用ポリエステルフィルム |
| JP2006173324A (ja) * | 2004-12-15 | 2006-06-29 | Nichia Chem Ind Ltd | 発光装置 |
| JP4435752B2 (ja) * | 2006-04-24 | 2010-03-24 | 帝人化成株式会社 | 光ディスク基板 |
| JP2010030279A (ja) * | 2008-06-23 | 2010-02-12 | Toyo Seikan Kaisha Ltd | 構造体、構造体形成方法及び真贋判定方法 |
| JP2014143221A (ja) * | 2011-05-18 | 2014-08-07 | Panasonic Corp | 回路基板の製造方法、並びに、その製造方法で得られる回路基板 |
| US9156125B2 (en) * | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
| CN103639594B (zh) * | 2013-12-19 | 2015-10-28 | 苏州德龙激光股份有限公司 | 激光钻孔方法 |
-
2018
- 2018-04-17 KR KR1020197030062A patent/KR102193968B1/ko active IP Right Grant
- 2018-04-17 JP JP2019513655A patent/JP6760493B2/ja active Active
- 2018-04-17 WO PCT/JP2018/015898 patent/WO2018194066A1/ja active Application Filing
- 2018-04-17 CN CN201880025656.5A patent/CN110521291B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110521291A (zh) | 2019-11-29 |
| CN110521291B (zh) | 2021-12-28 |
| JPWO2018194066A1 (ja) | 2019-12-19 |
| KR102193968B1 (ko) | 2020-12-22 |
| WO2018194066A1 (ja) | 2018-10-25 |
| KR20190129085A (ko) | 2019-11-19 |
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