JP6755168B2 - インプリントシステム、レプリカ製造装置、管理装置、インプリント装置、および物品製造方法 - Google Patents

インプリントシステム、レプリカ製造装置、管理装置、インプリント装置、および物品製造方法 Download PDF

Info

Publication number
JP6755168B2
JP6755168B2 JP2016239776A JP2016239776A JP6755168B2 JP 6755168 B2 JP6755168 B2 JP 6755168B2 JP 2016239776 A JP2016239776 A JP 2016239776A JP 2016239776 A JP2016239776 A JP 2016239776A JP 6755168 B2 JP6755168 B2 JP 6755168B2
Authority
JP
Japan
Prior art keywords
imprint
replica
mold
substrate
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016239776A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018098306A (ja
JP2018098306A5 (https=
Inventor
磨人 山本
磨人 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016239776A priority Critical patent/JP6755168B2/ja
Priority to KR1020197019699A priority patent/KR102204105B1/ko
Priority to PCT/JP2017/042311 priority patent/WO2018105418A1/ja
Priority to TW106142506A priority patent/TWI641027B/zh
Publication of JP2018098306A publication Critical patent/JP2018098306A/ja
Priority to US16/432,173 priority patent/US11235495B2/en
Publication of JP2018098306A5 publication Critical patent/JP2018098306A5/ja
Application granted granted Critical
Publication of JP6755168B2 publication Critical patent/JP6755168B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016239776A 2016-12-09 2016-12-09 インプリントシステム、レプリカ製造装置、管理装置、インプリント装置、および物品製造方法 Active JP6755168B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016239776A JP6755168B2 (ja) 2016-12-09 2016-12-09 インプリントシステム、レプリカ製造装置、管理装置、インプリント装置、および物品製造方法
KR1020197019699A KR102204105B1 (ko) 2016-12-09 2017-11-27 임프린트 시스템 및 물품 제조 방법
PCT/JP2017/042311 WO2018105418A1 (ja) 2016-12-09 2017-11-27 インプリントシステム、および物品製造方法
TW106142506A TWI641027B (zh) 2016-12-09 2017-12-05 壓印系統及物品製造方法
US16/432,173 US11235495B2 (en) 2016-12-09 2019-06-05 Imprint system and article manufacturing meihod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016239776A JP6755168B2 (ja) 2016-12-09 2016-12-09 インプリントシステム、レプリカ製造装置、管理装置、インプリント装置、および物品製造方法

Publications (3)

Publication Number Publication Date
JP2018098306A JP2018098306A (ja) 2018-06-21
JP2018098306A5 JP2018098306A5 (https=) 2020-01-23
JP6755168B2 true JP6755168B2 (ja) 2020-09-16

Family

ID=62491148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016239776A Active JP6755168B2 (ja) 2016-12-09 2016-12-09 インプリントシステム、レプリカ製造装置、管理装置、インプリント装置、および物品製造方法

Country Status (5)

Country Link
US (1) US11235495B2 (https=)
JP (1) JP6755168B2 (https=)
KR (1) KR102204105B1 (https=)
TW (1) TWI641027B (https=)
WO (1) WO2018105418A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12087604B2 (en) 2021-03-16 2024-09-10 Kioxia Corporation Template, manufacturing method of template, and manufacturing method of semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3650224T3 (pl) * 2018-11-09 2023-09-18 Phoenix Contact Gmbh & Co. Kg Urządzenie i sposób zadrukowywania artykułu
JP7190942B2 (ja) * 2019-03-08 2022-12-16 キヤノン株式会社 インプリントシステム、管理装置、および物品製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US736085A (en) 1902-10-15 1903-08-11 Carroll W Kjelgaard Combination shade and curtain bracket.
US7360851B1 (en) 2006-02-15 2008-04-22 Kla-Tencor Technologies Corporation Automated pattern recognition of imprint technology
JP2010052175A (ja) 2008-08-26 2010-03-11 Fuji Electric Device Technology Co Ltd ナノインプリント用マスターモールドの製造方法およびレプリカモールドの製造方法
EP2256549A1 (en) 2009-05-29 2010-12-01 Obducat AB Fabrication of Metallic Stamps for Replication Technology
JP2012190877A (ja) 2011-03-09 2012-10-04 Fujifilm Corp ナノインプリント方法およびそれに用いられるナノインプリント装置
JP2012234901A (ja) * 2011-04-28 2012-11-29 Toshiba Corp インプリント装置の動作方法及びインプリント用テンプレートの管理装置の動作方法
JP6053266B2 (ja) * 2011-09-01 2016-12-27 キヤノン株式会社 インプリント装置、物品の製造方法及びインプリント方法
JP2013074115A (ja) 2011-09-28 2013-04-22 Fujifilm Corp ナノインプリント装置およびナノインプリント方法、並びに、歪み付与デバイスおよび歪み付与方法
JP5935385B2 (ja) 2012-02-27 2016-06-15 大日本印刷株式会社 ナノインプリント用レプリカテンプレートの製造方法及びレプリカテンプレート
JP5942551B2 (ja) 2012-04-03 2016-06-29 大日本印刷株式会社 ナノインプリント用マスターテンプレート及びレプリカテンプレートの製造方法
JP6478565B2 (ja) * 2014-11-06 2019-03-06 キヤノン株式会社 インプリントシステム及び物品の製造方法
JP6438332B2 (ja) * 2015-03-18 2018-12-12 キヤノン株式会社 インプリントシステム、および物品の製造方法
JP6138189B2 (ja) * 2015-04-08 2017-05-31 キヤノン株式会社 インプリント装置および物品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12087604B2 (en) 2021-03-16 2024-09-10 Kioxia Corporation Template, manufacturing method of template, and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JP2018098306A (ja) 2018-06-21
KR102204105B1 (ko) 2021-01-18
KR20190089213A (ko) 2019-07-30
US20190283281A1 (en) 2019-09-19
WO2018105418A1 (ja) 2018-06-14
TW201822251A (zh) 2018-06-16
TWI641027B (zh) 2018-11-11
US11235495B2 (en) 2022-02-01

Similar Documents

Publication Publication Date Title
CN110083009B (zh) 压印方法、压印装置和器件制造方法
TWI720301B (zh) 壓印裝置及製造物品的方法
KR102898963B1 (ko) 임프린트 장치, 임프린트 방법 및, 물품의 제조 방법
JP7204464B2 (ja) インプリント方法、インプリント装置および物品製造方法
JP7171468B2 (ja) 情報処理装置、プログラム、リソグラフィ装置、物品の製造方法、物品の製造システム、及び出力方法
CN104216219A (zh) 压印设备、压印方法和制造产品的方法
KR20180116747A (ko) 임프린트 장치 및 물품 제조 방법
JP7603395B2 (ja) インプリント装置、および物品の製造方法
JP6755168B2 (ja) インプリントシステム、レプリカ製造装置、管理装置、インプリント装置、および物品製造方法
JP7451141B2 (ja) インプリント装置、インプリント方法、および物品の製造方法
JP2018073989A (ja) インプリント方法、インプリント装置および物品製造方法
KR20210065854A (ko) 임프린트 장치, 임프린트 방법, 물품의 제조 방법, 기판, 및 몰드
KR20200077443A (ko) 임프린트 장치 및 물품 제조 방법
JP6993799B2 (ja) インプリント装置および物品製造方法
JP2021034562A (ja) インプリント装置、インプリント方法、および物品製造方法
JP6866106B2 (ja) インプリント装置、インプリント方法、および物品の製造方法
JP2019021875A (ja) インプリント方法、インプリント装置、および物品の製造方法
TW202226427A (zh) 基板處理方法、基板保持裝置、模製裝置及物品製造方法
JP7431659B2 (ja) インプリント方法、インプリント装置および物品製造方法
JP7604257B2 (ja) インプリント装置、インプリント方法、および物品の製造方法
JP7441037B2 (ja) インプリント装置、情報処理装置、インプリント方法及び物品の製造方法
JP2025089783A (ja) インプリント装置、インプリント方法、物品の製造方法、及びプログラム
JP7341769B2 (ja) インプリント装置、インプリント方法および物品の製造方法
JP2024176404A (ja) インプリント装置、インプリント方法および物品製造方法
KR102211390B1 (ko) 임프린트 장치 및 물품 제조 방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191202

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191202

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200727

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200825

R151 Written notification of patent or utility model registration

Ref document number: 6755168

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151