JP6753364B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6753364B2
JP6753364B2 JP2017121516A JP2017121516A JP6753364B2 JP 6753364 B2 JP6753364 B2 JP 6753364B2 JP 2017121516 A JP2017121516 A JP 2017121516A JP 2017121516 A JP2017121516 A JP 2017121516A JP 6753364 B2 JP6753364 B2 JP 6753364B2
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JP
Japan
Prior art keywords
case
semiconductor device
control board
end portion
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017121516A
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English (en)
Japanese (ja)
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JP2019009183A5 (https=
JP2019009183A (ja
Inventor
佳佑 江口
佳佑 江口
義孝 木村
義孝 木村
秋彦 山下
秋彦 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2017121516A priority Critical patent/JP6753364B2/ja
Priority to US15/857,931 priority patent/US10468372B2/en
Priority to DE102018204473.2A priority patent/DE102018204473B4/de
Priority to CN201810642931.XA priority patent/CN109103146B/zh
Publication of JP2019009183A publication Critical patent/JP2019009183A/ja
Publication of JP2019009183A5 publication Critical patent/JP2019009183A5/ja
Application granted granted Critical
Publication of JP6753364B2 publication Critical patent/JP6753364B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Inverter Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2017121516A 2017-06-21 2017-06-21 半導体装置 Active JP6753364B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017121516A JP6753364B2 (ja) 2017-06-21 2017-06-21 半導体装置
US15/857,931 US10468372B2 (en) 2017-06-21 2017-12-29 Semiconductor apparatus
DE102018204473.2A DE102018204473B4 (de) 2017-06-21 2018-03-23 Halbleitervorrichtung
CN201810642931.XA CN109103146B (zh) 2017-06-21 2018-06-21 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017121516A JP6753364B2 (ja) 2017-06-21 2017-06-21 半導体装置

Publications (3)

Publication Number Publication Date
JP2019009183A JP2019009183A (ja) 2019-01-17
JP2019009183A5 JP2019009183A5 (https=) 2019-06-27
JP6753364B2 true JP6753364B2 (ja) 2020-09-09

Family

ID=64568133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017121516A Active JP6753364B2 (ja) 2017-06-21 2017-06-21 半導体装置

Country Status (4)

Country Link
US (1) US10468372B2 (https=)
JP (1) JP6753364B2 (https=)
CN (1) CN109103146B (https=)
DE (1) DE102018204473B4 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7014012B2 (ja) * 2018-03-30 2022-02-01 三菱電機株式会社 半導体装置、半導体装置の製造方法および電力変換装置
JP7244339B2 (ja) * 2019-04-19 2023-03-22 株式会社三社電機製作所 半導体モジュール用外部端子
DE102020104723B4 (de) * 2020-02-24 2025-03-27 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches Submodul zur Montage auf einer Kühleinrichtung
JP7337027B2 (ja) * 2020-05-20 2023-09-01 三菱電機株式会社 半導体装置
JP2023094275A (ja) * 2021-12-23 2023-07-05 富士電機株式会社 半導体装置及びその製造方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
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US2812A (en) * 1842-10-12 Hydrant
JPS61157290U (https=) * 1985-03-22 1986-09-29
JPS62191174U (https=) * 1986-05-27 1987-12-04
US4729739A (en) * 1986-09-15 1988-03-08 Texas Instruments Incorporated Connector for a chip carrier unit
JPH0612795B2 (ja) * 1989-11-07 1994-02-16 株式会社日立製作所 マルチチップモジュールの冷却構造
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
JPH0982854A (ja) 1995-09-20 1997-03-28 Sumitomo Metal Ind Ltd 電子部品用パッケージ
JP2000183276A (ja) * 1998-12-15 2000-06-30 Mitsubishi Electric Corp 半導体パワーモジュール
JP2000307056A (ja) * 1999-04-22 2000-11-02 Mitsubishi Electric Corp 車載用半導体装置
JP3501685B2 (ja) * 1999-06-04 2004-03-02 三菱電機株式会社 電力変換装置
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6439448B1 (en) * 1999-11-05 2002-08-27 Orthodyne Electronics Corporation Large wire bonder head
JP2001189416A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp パワーモジュール
DE102005016650B4 (de) * 2005-04-12 2009-11-19 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen
DE102007006212B4 (de) 2007-02-08 2012-09-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
JP4523632B2 (ja) 2007-12-11 2010-08-11 三菱電機株式会社 半導体装置
DE102008012570B4 (de) * 2008-03-04 2014-02-13 Infineon Technologies Ag Leistungshalbleitermodul-System, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
KR200473330Y1 (ko) 2010-04-07 2014-07-02 엘에스산전 주식회사 전력용 반도체 모듈
CN102163580B (zh) * 2011-03-15 2014-10-22 上海凯虹电子有限公司 一种薄型封装体及其制作方法
US8772920B2 (en) * 2011-07-13 2014-07-08 Oracle International Corporation Interconnection and assembly of three-dimensional chip packages
JP2013048031A (ja) * 2011-08-29 2013-03-07 Shinko Electric Ind Co Ltd スプリング端子付き基板及びその製造方法
JP6046392B2 (ja) * 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
JP2014049582A (ja) * 2012-08-31 2014-03-17 Mitsubishi Electric Corp 半導体装置
JP6016611B2 (ja) 2012-12-20 2016-10-26 三菱電機株式会社 半導体モジュール、その製造方法およびその接続方法
JP6299120B2 (ja) * 2013-09-05 2018-03-28 富士電機株式会社 半導体モジュール
WO2016163237A1 (ja) * 2015-04-10 2016-10-13 富士電機株式会社 半導体装置
US9979105B2 (en) * 2015-05-15 2018-05-22 Mitsubishi Electric Corporation Power semiconductor device
JP6511979B2 (ja) * 2015-06-18 2019-05-15 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP6513519B2 (ja) * 2015-07-17 2019-05-15 株式会社日立製作所 物理量センサ
CN108352379B (zh) * 2015-12-21 2022-05-17 英特尔公司 系统级封装装置以及用于形成系统级封装装置的方法
DE102016119631B4 (de) * 2016-02-01 2021-11-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Druckeinleitkörper und Anordnung hiermit
JP6500925B2 (ja) 2017-03-03 2019-04-17 サミー株式会社 弾球遊技機

Also Published As

Publication number Publication date
CN109103146A (zh) 2018-12-28
US20180374817A1 (en) 2018-12-27
CN109103146B (zh) 2021-09-21
US10468372B2 (en) 2019-11-05
DE102018204473B4 (de) 2022-06-09
DE102018204473A1 (de) 2018-12-27
JP2019009183A (ja) 2019-01-17

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