CN109103146B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN109103146B
CN109103146B CN201810642931.XA CN201810642931A CN109103146B CN 109103146 B CN109103146 B CN 109103146B CN 201810642931 A CN201810642931 A CN 201810642931A CN 109103146 B CN109103146 B CN 109103146B
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CN
China
Prior art keywords
housing
semiconductor device
end portion
connecting portion
control substrate
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CN201810642931.XA
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English (en)
Chinese (zh)
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CN109103146A (zh
Inventor
江口佳佑
木村义孝
山下秋彦
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN109103146A publication Critical patent/CN109103146A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Inverter Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201810642931.XA 2017-06-21 2018-06-21 半导体装置 Active CN109103146B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017121516A JP6753364B2 (ja) 2017-06-21 2017-06-21 半導体装置
JP2017-121516 2017-06-21

Publications (2)

Publication Number Publication Date
CN109103146A CN109103146A (zh) 2018-12-28
CN109103146B true CN109103146B (zh) 2021-09-21

Family

ID=64568133

Family Applications (1)

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CN201810642931.XA Active CN109103146B (zh) 2017-06-21 2018-06-21 半导体装置

Country Status (4)

Country Link
US (1) US10468372B2 (https=)
JP (1) JP6753364B2 (https=)
CN (1) CN109103146B (https=)
DE (1) DE102018204473B4 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7014012B2 (ja) * 2018-03-30 2022-02-01 三菱電機株式会社 半導体装置、半導体装置の製造方法および電力変換装置
JP7244339B2 (ja) * 2019-04-19 2023-03-22 株式会社三社電機製作所 半導体モジュール用外部端子
DE102020104723B4 (de) * 2020-02-24 2025-03-27 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches Submodul zur Montage auf einer Kühleinrichtung
JP7337027B2 (ja) * 2020-05-20 2023-09-01 三菱電機株式会社 半導体装置
JP2023094275A (ja) * 2021-12-23 2023-07-05 富士電機株式会社 半導体装置及びその製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183276A (ja) * 1998-12-15 2000-06-30 Mitsubishi Electric Corp 半導体パワーモジュール
JP2001189416A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp パワーモジュール
US6791170B1 (en) * 1999-04-22 2004-09-14 Mitsubishi Denki Kabushiki Kaisha Onboard semiconductor device
JP2006295158A (ja) * 2005-04-12 2006-10-26 Semikron Elektronik Gmbh & Co Kg 材料結合式で配設された端子要素を有するパワー半導体モジュール
DE102008012570A1 (de) * 2008-03-04 2009-09-17 Infineon Technologies Ag Leistungshalbleitermodul-System
CN102163580A (zh) * 2011-03-15 2011-08-24 上海凯虹电子有限公司 一种薄型封装体及其制作方法
CN104425399A (zh) * 2013-09-05 2015-03-18 富士电机株式会社 半导体模块
CN106158761A (zh) * 2015-05-15 2016-11-23 三菱电机株式会社 电力用半导体装置
CN106257660A (zh) * 2015-06-18 2016-12-28 富士电机株式会社 半导体装置及半导体装置的制造方法
CN106796934A (zh) * 2015-04-10 2017-05-31 富士电机株式会社 半导体装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2812A (en) * 1842-10-12 Hydrant
JPS61157290U (https=) * 1985-03-22 1986-09-29
JPS62191174U (https=) * 1986-05-27 1987-12-04
US4729739A (en) * 1986-09-15 1988-03-08 Texas Instruments Incorporated Connector for a chip carrier unit
JPH0612795B2 (ja) * 1989-11-07 1994-02-16 株式会社日立製作所 マルチチップモジュールの冷却構造
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
JPH0982854A (ja) 1995-09-20 1997-03-28 Sumitomo Metal Ind Ltd 電子部品用パッケージ
JP3501685B2 (ja) * 1999-06-04 2004-03-02 三菱電機株式会社 電力変換装置
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6439448B1 (en) * 1999-11-05 2002-08-27 Orthodyne Electronics Corporation Large wire bonder head
DE102007006212B4 (de) 2007-02-08 2012-09-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
JP4523632B2 (ja) 2007-12-11 2010-08-11 三菱電機株式会社 半導体装置
KR200473330Y1 (ko) 2010-04-07 2014-07-02 엘에스산전 주식회사 전력용 반도체 모듈
US8772920B2 (en) * 2011-07-13 2014-07-08 Oracle International Corporation Interconnection and assembly of three-dimensional chip packages
JP2013048031A (ja) * 2011-08-29 2013-03-07 Shinko Electric Ind Co Ltd スプリング端子付き基板及びその製造方法
JP6046392B2 (ja) * 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
JP2014049582A (ja) * 2012-08-31 2014-03-17 Mitsubishi Electric Corp 半導体装置
JP6016611B2 (ja) 2012-12-20 2016-10-26 三菱電機株式会社 半導体モジュール、その製造方法およびその接続方法
JP6513519B2 (ja) * 2015-07-17 2019-05-15 株式会社日立製作所 物理量センサ
CN108352379B (zh) * 2015-12-21 2022-05-17 英特尔公司 系统级封装装置以及用于形成系统级封装装置的方法
DE102016119631B4 (de) * 2016-02-01 2021-11-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Druckeinleitkörper und Anordnung hiermit
JP6500925B2 (ja) 2017-03-03 2019-04-17 サミー株式会社 弾球遊技機

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183276A (ja) * 1998-12-15 2000-06-30 Mitsubishi Electric Corp 半導体パワーモジュール
US6791170B1 (en) * 1999-04-22 2004-09-14 Mitsubishi Denki Kabushiki Kaisha Onboard semiconductor device
JP2001189416A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp パワーモジュール
JP2006295158A (ja) * 2005-04-12 2006-10-26 Semikron Elektronik Gmbh & Co Kg 材料結合式で配設された端子要素を有するパワー半導体モジュール
DE102008012570A1 (de) * 2008-03-04 2009-09-17 Infineon Technologies Ag Leistungshalbleitermodul-System
CN101577262A (zh) * 2008-03-04 2009-11-11 英飞凌科技股份有限公司 功率半导体模块系统
CN102163580A (zh) * 2011-03-15 2011-08-24 上海凯虹电子有限公司 一种薄型封装体及其制作方法
CN104425399A (zh) * 2013-09-05 2015-03-18 富士电机株式会社 半导体模块
CN106796934A (zh) * 2015-04-10 2017-05-31 富士电机株式会社 半导体装置
CN106158761A (zh) * 2015-05-15 2016-11-23 三菱电机株式会社 电力用半导体装置
CN106257660A (zh) * 2015-06-18 2016-12-28 富士电机株式会社 半导体装置及半导体装置的制造方法

Also Published As

Publication number Publication date
JP6753364B2 (ja) 2020-09-09
CN109103146A (zh) 2018-12-28
US20180374817A1 (en) 2018-12-27
US10468372B2 (en) 2019-11-05
DE102018204473B4 (de) 2022-06-09
DE102018204473A1 (de) 2018-12-27
JP2019009183A (ja) 2019-01-17

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