CN106257660A - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法 Download PDF

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Publication number
CN106257660A
CN106257660A CN201610301499.9A CN201610301499A CN106257660A CN 106257660 A CN106257660 A CN 106257660A CN 201610301499 A CN201610301499 A CN 201610301499A CN 106257660 A CN106257660 A CN 106257660A
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fixture
plate portion
semiconductor device
connection terminal
terminal
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CN106257660B (zh
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坂本阳
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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Abstract

本发明能够抑制连接端子受损。通过半导体模块制造工序制造的半导体装置(半导体模块(20))具备树脂壳体(21)，该树脂壳体(21)包括在主面上垂直于收纳半导体元件的收纳区域的周边部而设置的导向销(24)、以及在主面上垂直于该周边部而设置的连接端子(25)。而且，安装具备用于插入导向销(24)的定位孔(49)和用于插入连接端子(25)的保护孔(48)的夹具(40)。由此，连接端子(25)被夹具(40)保护，该夹具(40)通过导向销(24)在一个端部与另一个端部与树脂壳体(21)位置对齐并且被固定。

Description

半导体装置及半导体装置的制造方法
技术领域
本发明涉及半导体装置及半导体装置的制造方法。
背景技术
作为一种半导体装置，包含多个IGBT(Insulated Gate Bipolar Transistor-绝缘栅双极晶体管)、FWD(Free Wheeling Diode-续流二极管)等半导体元件的功率逆变装置被广泛使用。
上述的半导体装置的半导体元件被收纳在壳体中，并被并联连接在电路上。在壳体中，设置与半导体元件的主电极电连接的控制端子用的连接端子。通过在上述的连接端子上焊接外部电路的印刷基板，构成半导体装置(例如参照专利文献1)。
现有技术文献
专利文献
专利文献1：日本专利特开2001－053222号公报
发明内容
发明所要解决的技术问题
但是，在上述专利文献1中，根据半导体装置的使用情况，有时手指会与连接端子接触或连接端子从外部受到冲击。在上述情况下，若连接端子上受到外力从而导致弯曲等损伤，则可能会在连接端子的内部产生微裂纹。若在连接端子上产生微裂纹，则在半导体装置动作时，通过振动、冲击、 热变形，裂纹会扩大，从而导致半导体装置的可靠性下降。
本发明是鉴于上述问题而完成的，其目的是提供一种抑制连接端子受损的半导体装置及半导体装置的制造方法。
解决技术问题的技术方案
本发明为了解决上述的技术问题，提供一种半导体装置，该半导体装置包括半导体元件、收纳所述半导体元件的壳体、与所述半导体元件的主电极电连接并设置在所述壳体上的连接端子、以及保持所述连接端子以进行保护并且使所述连接端子的前端突出的夹具。
本发明为了解决上述技术问题，提供一种上述半导体装置的制造方法。
技术效果
采用上述结构的半导体装置及半导体装置的制造方法，能抑制连接端子受损并抑制半导体装置的可靠性下降。
附图说明
图1是第1实施方式的半导体装置的侧面图。
图2是表示第1实施方式的半导体装置的制造方法的流程图。
图3是表示第1实施方式的树脂壳体的图。
图4是表示用于制造第1实施方式的半导体装置的夹具的图。
图5是表示第1实施方式的树脂壳体上夹具的安装方式的图。
图6是表示安装了第1实施方式的夹具的半导体模块的图。
图7是表示第1实施方式的印刷基板的图。
图8是表示安装了第1实施方式的夹具的半导体模块上印刷基板的安装方式的图。
图9是表示第2实施方式的夹具的图。
具体实施方式
以下，对于本发明的实施方式，参照附图进行详细说明。
第1实施方式
首先，对于第1实施方式的半导体装置用图1进行说明。
图1是第1实施方式的半导体装置的侧面图。
半导体装置10包括用树脂将收纳在内部的半导体元件密封的半导体模块20和安装在该半导体模块20上的印刷基板30。
半导体模块20包括树脂壳体21、以及在树脂壳体21的主面上设置的U端子的主端子23a、N端子的主端子23b、P端子的主端子23c。此外，半导体模块20包括垂直地形成在树脂壳体21的主面上的导向销24、栅极端子及感测发射极端子的控制端子用的连接端子25。此外，在金属基座22上层叠基板及半导体元件依次层叠，并收纳在树脂壳体21的内部。此外，层叠基板在陶瓷基板等绝缘基板的表面及背面上具备导电性板。上述的主面是指树脂壳体21的上表面(图中的表面)。此外，金属基座22不一定是必需的结构。
印刷基板30在主面(绝缘基板31的上表面)上具备导电性板，包括形成了引导孔32和通孔33的绝缘基板31和由设置在绝缘基板31的主面上的驱动电路构成的IC(IntegratedCircuit－集成电路)芯片34。此外，图1中，IC芯片34仅设置在印刷基板30的上表面上，然而根据需要也可以设置在印刷基板30的相反侧的主面上(下表面)。
在半导体装置10中，半导体模块20的导向销24插入印刷基板30的引导孔32来对齐位置，此外，在印刷基板30的通孔33中插入半导体模块20的连接端子25来进行电连接。
此外，对于半导体模块20及印刷基板30将在后文中再次阐述。
上述半导体模块20通过作为半导体元件的例如IGBT、FWD构成逆变器电路，并用树脂密封。此外，将外部电源的高电位端子与P端子即主端子23c连接，将外部电源的低电位端子与N端子即主端子23b连接，从而与半导体元件的主端子进行电连接。而且，将负载(省略图示)与输出端子(U端子)即主端子23a进行连接。而且，来自印刷基板30的IC芯片34的规定的控制信号经由栅极端子的连接端子25，施加在半导体元件上。由此，半导体装置10起到作为逆变器的作用。
对于上述半导体装置10的制造方法，使用图2进行说明。
图2是表示第1实施方式的半导体装置的制造方法的流程图。
半导体装置的制造方法分为两个工序：步骤S11～S15的半导体模块制造工序、以及步骤S16～S18的印刷基板安装工序。
【步骤S11】将金属基座、层叠基板、半导体元件层叠，并且分别用焊接等进行接合。
【步骤S12】准备包含导向销、连接端子等并且通过树脂嵌入成形的树脂壳体21。
对于上述的树脂壳体21，使用图3进行说明。
图3是表示第1实施方式的树脂壳体的图。
此外，图3(A)是树脂壳体21的俯视图，图3(B)是树脂壳体21的侧面图。
树脂壳体21呈框型形状，将步骤S11中被设置在金属基座上的层叠基板上的半导体元件收纳在内的矩形的收纳区域26开口。在收纳区域26的四个角的上表面上，分别垂直地设置导向销24。此外，导向销24的直径为5mm～10mm，长度为20mm～25mm。在收纳区域26的(沿着长边方向的边设置的)导向销24之间，与上表面垂直地设置连接端子25。此时，连接端子26相对 于导向销24配置成一列。此外，连接端子25通过例如黄铜构成，直径为2.5mm～3.5mm，长度为15mm～20mm。此外，在上表面上设置U端子的主端子23a、N端子的主端子23b、以及P端子的主端子23c。此外，在收纳区域26的内侧，分别固定与各连接端子25电连接的端子27、与各主端子23a、23b、23c电连接的端子28a、28b、28c。此外，端子27也可以是一部分埋入树脂壳体21的连接端子25的端部露出而得到的端子。
【步骤S13】在步骤S12中准备的树脂壳体21上安装夹具40。
在说明于树脂壳体21上安装夹具之前，对于用于保护连接端子25的夹具40，用图4进行说明。
图4是表示用于制造第1实施方式的半导体装置的夹具的图。
此外，图4(A)是表示构成夹具40的一对板部41(例如第1板部)、45(例如第2板部)的俯视图，图4(B)是表示将重叠后的板部41、45加以固定的固定构件47的立体图。此外，图4(C)是表示将板部41、45重叠构成的夹具40的俯视图，图4(D)是表示上述夹具40的侧面图。
板部41、45具备对应于后述的密封用的树脂的固化温度、焊接的焊接温度的耐热性(耐热温度160℃～350℃)，通过例如金属材料、聚苯硫醚树脂成型材料(PPS)、聚丙烯树脂成型材料(PPT)、酚醛树脂成型材料(PM)构成。此外，在板部41、45中的任意一方上形成保持连接端子25的保持部。作为保持部的一个例子，板部41如图4(A)所示，在一个侧面上形成槽部42、43。此外，板部41、45在另一个侧面上形成槽部44、46。在将半导体模块20与印刷基板30连接的情况下，板部41、45的高度比连接端子25短。即，连接端子25的前端从夹具40突出。在仅保护连接端子25的情况下，板部41、45的高度可以比连接端子25更长。
如图4(B)所示，固定构件47的剖面呈U字形，通过具备与板部41、45相同的耐热性的材料构成。
如图4(C)、(D)所示，通过将板部45与上述板部41重合，用板部45堵住板部41的槽部42、43，在槽部44、46上安装固定构件47，从而组装完成构成了保护孔48和定位孔49的夹具40。此外，用固定构件47等将板部41、45彼此固定的部位称为固定部。保护孔48和定位孔49分别呈对应于设置在树脂壳体21上的连接端子25和导向销24的形状。此外，在保护孔48和定位孔49的(图4(D)中)下侧的入口处形成锥形。此外，固定构件47可以从板部41、45的下侧固定，也可以从上侧固定。此外，也可以从板部41、45的旁边固定。
对于上述夹具40在树脂壳体21上的安装方式，使用图5进行说明。
图5是表示第1实施方式的树脂壳体上的夹具安装方式的图。
此外，图5(A)表示在树脂壳体21上安装夹具40时的俯视图，图5(B)表示在树脂壳体21上安装夹具40时的侧面图。
如图5所示，沿着收纳区域26的一对(长边方向的)边分别设置有夹具40。上述的夹具40分别将树脂壳体21的导向销24插入定位孔49并固定，且将树脂壳体21的连接端子25插入保护孔48。如上所述，夹具40也可以从导向销24的上部插入。此外，优选为通过板部41、45以从侧面夹持导向销24、连接端子25的方式保持，并且用固定构件47固定板部41、45。在该情况下，能防止在插入时连接端子25弯曲或损坏。
【步骤S14】用粘结剂将步骤S11中得到的层叠了半导体元件和层叠基板的金属基座22与在步骤S13中安装了夹具40的树脂壳体21的收纳区域26接合，从而收纳半导体元件。
在树脂壳体21的收纳区域26中收纳的半导体元件的电极间、半导体元件的电极和端子27、28a、28b、28c之间通过引线接合进行电连接从而形成电路。
【步骤S15】在步骤S14中收纳了半导体元件的收纳区域26中注入例如硅胶、环氧树脂等树脂，并加热至该树脂对应的固化温度，使注入的树脂固化来密封收纳区域26。
对于由此形成的安装了夹具40的半导体模块20用图6进行说明。
图6是表示安装了第1实施方式的夹具的半导体模块的图。
此外，图6(A)是表示安装了夹具40的半导体模块20的俯视图，图6(B)是表示安装了夹具40的半导体模块20的侧面图。
半导体模块20如图6所示在树脂壳体21上安装了夹具40的状态下，将层叠了半导体元件及层叠基板的金属基座22与收纳区域26接合，从而在收纳区域26中收纳半导体元件，通过树脂29密封收纳区域26。
经过上述那样的步骤S11～S15的半导体模块制造工序，制造半导体模块20。
【步骤S16】在步骤S15中形成的半导体模块20上安装印刷基板30。
此处，对于印刷基板30，使用图7进行说明。
图7是表示第1实施方式的印刷基板的图。
此外，图7(A)是表示印刷基板30的俯视图、图7(B)是表示印刷基板30的侧面图。
印刷基板30包括在形成了导电性板(省略图示)的绝缘基板31的四个角上形成的导向孔32、沿着绝缘基板31的相对的(长边方向的)的边形成在导向孔32之间并与该导电性板电连接的通孔33。此外，通孔33作为承接部，如后文中阐述那样，承接连接端子25来安装。此外，印刷基板30在绝缘基板31上设置与导电性板电连接的IC芯片34。导电性板使用铜等。
此外，对于上述印刷基板30在半导体模块20上的安装方式，使用图8进行说明。
图8是表示安装了第1实施方式的夹具的半导体模块上的印刷基板安装方式的图。
此外，图8(A)表示在半导体模块20上安装印刷基板30时的侧面图，图8(B)是表示在半导体模块20上安装了印刷基板30后的侧面图。
如图8所示，在印刷基板30的引导孔32和通孔33中分别插入半导体模块20的导向销24和连接端子25，从而在半导体模块20上安装印刷基板30。由此，在连接端子25的突出部分上安装印刷基板30的通孔33。此外，突出部分是指安装了夹具40的连接端子25从夹具40突出的前端部分。
通过上述安装，印刷基板30经由夹具40安装到半导体模块20上。
此外，图8表示固定构件47从板部41、45的下侧固定的情况。固定构件47不局限于该情况，也可以从板部41、45的上侧固定。此外，也可以从板部41、45的旁边固定。
【步骤S17】从安装在半导体模块20上的印刷基板30的通孔33突出的连接端子25和该通孔33利用在规定的焊接温度下加热后的焊料进行焊接。
【步骤S18】从夹具40上取下固定构件47，使板部41、45分离，从安装了印刷基板30的半导体模块20上取下夹具40。此外，也可以不从安装了印刷基板30的半导体模块20上取下夹具40。在该情况下，可提高安装了印刷基板30的半导体模块20的刚性。
经过上述的步骤S16～S18的印刷基板安装工序，得到图1所示的半导体装置10。
由此，通过半导体模块制造工序(步骤S11～S15)制造的半导体装置10(半导体模块20)具备树脂壳体21，该树脂壳体21包括在上表面上与收纳半导体元件的收纳区域26的周边部垂直地设置的导向销24和在上表面上与该周边部垂直地设置的连接端子25。而且，在树脂壳体21上安装具备供导向销24插入的定位孔49和供连接端子25插入的保护孔48的夹具40。由此，连接端子25被夹具40保护，该夹具40通过导向销24使一个端部与另一个端部这两处与树脂壳体21位置对齐而被固定。因此，例如，在步骤S13以后的制造工序中，在要对树脂壳体21进行操作时，可以防止连接端子25被直接接触，此外，可以防止从外部受到冲击，从而可以防止连接端子25发生损坏。特别地，可能会有半导体模块制造工序(步骤S11～S15)和印刷基板安装工序(步骤S16～S18)在不同的场所执行的情况。在该情况下，需要将半导体模块制造工序制造得到的半导体模块20打包搬运到执行印刷基板安装工序的场所。即使在上述的状况下，由于通过夹具40保护连接端子25，因此可以防止在打包时或搬运时连接端子25被直接接触或者受到冲击，从而可以防止连接端子25发生损坏。此外，可以在树脂壳体21上不设置导向销24，仅设置连接端子25，将夹具40安装在连接端子25上。
此外，半导体模块20通过这样安装夹具40，连接端子25不会弯曲地实现与树脂壳体21位置的对齐。由此，在半导体模块20上安装印刷基板30时，夹具40引导导向销24和连接端子25，从而能分别顺利地插入印刷基板30的导向孔32和通孔33。因此，在半导体模块20上安装印刷基板30时，连接端子25容易插入通孔33，因此不需要用手指进行位置对齐等。连接端子25不被直接接触，因此能防止连接端子25发生损坏。
此外，通过安装夹具40，半导体模块20的上表面和印刷基板30的距离能保持一定。
因而，半导体装置10由于连接端子25被夹具40保护，防止连接端子25发生损坏，因此抑制了可靠性下降。
此外，在第1实施方式中，举例说明了树脂壳体21的连接端子25插通印刷基板30的通孔33的情况。不限于该情况，即使在印刷基板30上适用插座连接器的情况下，也可以与第1实施方式相同地使用夹具40。
此外，夹具40也可以用于上述以外的制造方法。例如，与步骤S11相同地，将金属基座、层叠基板、半导体元件层叠，并且分别用焊接等进行接合。接着，将导向销、连接端子、步骤S11中形成的层叠了层叠基板及半导体元件的金属基座等都设置在金属模中，将半导体元件的电极间、半导体元件的电极和端子27、28a、28b、28c之间通过引线接合进行电连接从而形成电路。然后，通过树脂的嵌入成形，半导体模块20整体成型。之后，在由此整体成型的半导体模块20的连接端子25等上，与步骤S13相同地安装夹具40(图6)。然后，进行步骤S16、S17的工序，将安装了夹具40的半导体装置10(图8)向制造厂家等交货。在向制造厂家交货时，将半导体装置10打包并搬运至制造厂家。即使在上述的状况下，安装了夹具40的半导体装置10由于连接端子25被夹具40保护，因此可以防止在打包时或搬运时连接端子25被直接接触，并防止连接端子25受到冲击，从而可以防止连接端子25发生损坏。此外，若制造厂家等收到安装了夹具40的半导体装置10，则进行与步骤S18相同的工序，取下夹具40。
因而，即使在该情况下，半导体装置10通过连接端子25被夹具40保护，防止连接端子25发生损坏，因此抑制了可靠性下降。
第2实施方式
对于第2实施方式中不同于第1实施方式的3种夹具，使用图9进行说明。
图9是表示第2实施方式的夹具的图。
此外，图9(A)是表示另一种夹具(其一)的俯视图。图9(B)是表示另一种夹具(其二)的俯视图，图9(C)是表示另一种夹具(其二)的主要部分的放大俯视图。而且，图9(D)是表示另一种夹具(其三)的俯 视图，图9(D)是表示另一种夹具(其三)的主要部分的放大俯视图。
图9(A)中表示的夹具50具有板部51、55，在板部51上形成与第1实施方式的夹具40的板部41的槽部42、43相同的槽部52、53。此外，在夹具50的板部51、55的一个端部上，与第1实施方式相同地分别形成安装固定构件47的槽部54、56。另一方面，板部51、55的另一个端部通过铰链58连接。即，铰链58成为一个固定部。板部51、55将铰链58作为轴可以打开关闭。夹具50将铰链58作为轴使板部51、55重合从而关闭，在槽部54、56上安装固定构件47，并且与第1实施方式的夹具40相同地构成定位孔与保护孔。上述的夹具50与第1实施方式的夹具40相同，半导体模块20的导向销24和连接端子25分别插通定位孔和保护孔，从而安装在半导体模块20上。此外，在将印刷基板30安装到半导体模块20后，可以通过从夹具50上取下固定构件47，以铰链58为轴打开板部51、55，将夹具50从半导体模块20(半导体装置10)上取下。
上述的夹具50用铰链58连接板部51、55的另一个端部，因此通过将安装在槽部54、56上的固定构件47取下，并使板部51、55的一个端部打开，从而将夹具50从半导体装置10上取下。夹具50不用完全地分离成两个，在以铰链58连接的状态下被从半导体装置10上取下，因此操作变得容易。
接着，图9(B)所示的夹具60具备板部61、65，板部61、65在相对的面的外侧的面上分别形成槽部63、67。而且，在将板部61、65重合的相对的面上形成槽部62、66，并构成(截面形状呈山状的)凹凸。夹具60将树脂壳体21的导向销24和连接端子25如图9(C)所示地夹持在板部61的槽部62的凹部(或凸部)和板部65的槽部66的凸部(或凹部)之间，并且在槽部63、67上安装固定构件47，从而安装在树脂壳体21上。此外，在将印刷基板30安装到半导体模块20上安装后，可以通过从夹具60上取下固定构件47，使板部61、65分离，从而将夹具60从半导体模块20(半导体装置10)上取下。此外，夹具60中，板部61、65重合时板部61的凸部和板部65的凸 部的间隔优选为比连接端子25的直径更大。
上述的夹具60将导向销24和连接端子25用板部61、65的槽部62、66的凹凸夹持，因此特别是能进一步维持垂直地设置在上表面上的连接端子25的垂直度。此外，不需要设置对应于连接端子25的位置的槽部，可以通过板部61、65的槽部62、66的凹凸固定连接端子25。因而，上述的夹具60可以适用于各种类型的树脂壳体21。
接着，图9(D)所示的夹具70具备板部71、75，板部71、75在相对的侧面的外侧的面上分别形成槽部72、76。此外，板部71、75具备对应于密封用的树脂的固化温度、焊料的焊接温度的耐热性，由例如硅橡胶，聚氨酯橡胶等的弹性体构成。这些弹性体的肖氏硬度最好是例如20以上且90以下左右，优选为30以上且90以下左右。若弹性体过于柔软，则耐久性也更差，不能充分地保持连接端子25。此外，若弹性体过硬，则弹性变形不充分，不能保持连接端子25。此外，肖氏硬度是表示弹性体硬度的值，通过在被测定物(弹性体)的表面上压入压头(探针或压头)来使其变形，测定该变形量(压入深度)并将其数值化而得到。肖氏硬度基于JISK6253-3《硫化橡胶和热塑性橡胶-硬度的测定方法-第3部分肖氏硬度》，使用A型硬度计(弹簧式橡胶硬度计)测定
上述的夹具70将树脂壳体21的导向销24和连接端子25如图9(E)所示地用弹性体的板部71和板部75夹住，弹性体起到保持部的作用，并且在槽部72、76上安装固定构件47，从而安装在树脂壳体21上。此外，在半导体模块20上安装印刷基板30后，可以通过从夹具70上取下固定构件47，使板部71、75分离，从而将夹具70从半导体模块20(半导体装置10)上取下。
上述的夹具70不必将导向销24和连接端子25排列成直线状，即使在例如图9(E)的上下方向上配置产生偏离的情况下，也能可靠地夹住并保护连接端子25。此外，夹具70无需设置对应于连接端子25的位置的槽部就能 固定连接端子25。因而，可以适用于各种类型的树脂壳体21。
即使在将上述的第2实施方式的夹具50、60、70代替第1实施方式的夹具40安装在树脂壳体21上的情况下，也能得到与第1实施方式相同的效果。
此外，夹具60、70不限于上述的能分割的情况，可以与夹具50相同地通过铰链连接一个端部，并使另一个端部能打开关闭。
符号说明
10 半导体装置
20 半导体模块
21 树脂壳体
22 金属基座
23a,23b,23c 主端子
24 导向销
25 连接端子
26 收纳区域
27,28a,28b,28c 端子
29 树脂
30 印刷基板
31 绝缘板
32 引导孔
33 通孔
34 IC芯片
40,50,60,70 夹具
41,45,51,55,61,65,71,75 板部
42,43,44,46,52,53,54,56,62,63,66,67,72,76 槽部
47 固定构件
48 保护孔
49 定位孔
58 铰链。

Claims (15)

1.一种半导体装置，其特征在于，包括：半导体元件、收纳所述半导体元件的壳体、与所述半导体元件的主电极电连接并设置在所述壳体上的连接端子、以及保持所述连接端子以进行保护并且使所述连接端子的前端突出的夹具。
2.如权利要求1所述的半导体装置，其特征在于，所述夹具具备第一板部、第二板部、以及固定部，在所述第一板部和所述第二板部中的任意一个上具有保持所述连接端子的保持部，所述固定部固定所述第一板部和所述第二板部使得所述连接端子被保持在所述保持部上。
3.如权利要求1或2所述的半导体装置，其特征在于，所述的保持部为槽。
4.如权利要求1或2所述的半导体装置，其特征在于，所述的保持部由弹性构件构成。
5.如权利要求1至4中任意一项所述的半导体装置，其特征在于，包括印刷基板，该印刷基板具备承接所述连接端子进行安装的承接部，在所述保持部的高度位置处，所述连接端子的从所述夹具突出的所述前端安装在所述承接部上。
6.如权利要求1至5中任意一项所述的半导体装置，其特征在于，包括设置在收纳所述半导体元件的所述壳体的周边部上的导向销。
7.如权利要求6所述的半导体装置，其特征在于，所述连接端子相对于所述导向销配置成一列。
8.一种半导体装置的制造方法，其特征在于，包括准备具有连接端子的壳体的工序、以及安装用于保护所述连接端子的夹具以使所述连接端子的前端突出的夹具安装工序。
9.如权利要求8所述的半导体装置的制造方法，其特征在于，包括在所述连接端子的突出部分上安装印刷电路板的工序。
10.如权利要求8或9所述的半导体装置的制造方法，其特征在于，所述夹具具备第一板部、第二板部、以及在所述第一板部和所述第二板部中的任意一个上设置的保持部，所述夹具安装工序是固定所述第一板部和所述第二板部使得所述连接端子被保持在所述保持部上的工序。
11.如权利要求9所述的半导体装置的制造方法，其特征在于，包括在安装了所述印刷电路板后从所述连接端子上取下所述夹具的夹具取下工序。
12.如权利要求11所述的半导体装置的制造方法，其特征在于，所述夹具具备第一板部、第二板部、以及在所述第一板部和所述第二板部中的任意一个上设置的保持部，所述夹具安装工序是固定所述第一板部和所述第二板部使得所述连接端子被保持在所述保持部上的工序。
13.如权利要求12所述的半导体装置的制造方法，其特征在于，所述夹具取下工序是将保持着所述连接端子的所述第一板部和所述第二板部分离从而取下的工序。
14.如权利要求8所述的半导体装置的制造方法，其特征在于，包括在所述夹具安装工序后将半导体元件收纳在所述壳体中并且连接所述连接端子和所述半导体元件的工序。
15.如权利要求8所述的半导体装置的制造方法，其特征在于，包括在所述夹具安装工序前将半导体元件收纳在所述壳体中并且连接所述连接端子和所述半导体元件的工序。
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