CN107170718B - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN107170718B
CN107170718B CN201710135758.XA CN201710135758A CN107170718B CN 107170718 B CN107170718 B CN 107170718B CN 201710135758 A CN201710135758 A CN 201710135758A CN 107170718 B CN107170718 B CN 107170718B
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Prior art keywords
circuit board
substrate
semiconductor module
semiconductor device
encapsulation
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CN201710135758.XA
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CN107170718A (zh
Inventor
F.莫恩
J.舒德雷
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ABB Grid Switzerland AG
Audi AG
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Hitachi Energy Switzerland AG
Audi AG
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Publication of CN107170718A publication Critical patent/CN107170718A/zh
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    • H05K1/115—Via connections; Lands around holes or via connections
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Abstract

半导体模块（10）包括：半导体器件（14）；衬底（12），半导体器件（14）在其上附连；模塑包封（42），半导体器件（14）和衬底（12）模塑到其内；至少一个功率端子（24），其部分模塑到包封（42）内并且从包封（42）突出，该功率端子（24）与半导体器件（14）电连接；和包封的电路板（30），其至少部分模塑到包封（42）内并且在衬底（12）的延伸方向（E）上在衬底（12）上突出，其中包封的电路板（30）包括用于销（40）的至少一个插座（38），该插座（38）经由包封的电路板（30）而与半导体器件（14）的控制输入（36）电连接（图1）。

Description

半导体模块
技术领域
本公开涉及功率半导体封装的领域。特别地，本公开涉及半导体模块。
背景技术
包含例如IGBT或功率MOSFET等固态开关器件的功率半导体模块在各种功率电子应用中使用来开关电流或对电流整流。重要且增长快速的应用是电动或混合电动车辆的转换器系统。对于这样的应用的典型的六组模块（包含具有两个半导体开关的三个半桥）可能具有多至1200V的额定电压和几百A的额定电流。
除功率半导体模块连接到AC（例如马达）和DC（例如电池）侧所凭借的高电流功率端子外，六组或半桥功率半导体模块通常还具有若干辅助端子用于连接到栅极驱动器板，其包含控制功率半导体模块中的不同半导体器件和/或可检测故障情形的驱动器电路。典型的六组功率半导体模块可具有每半桥多至十个这样的辅助连接，对于全六组逆变器模块是30个连接。
常用于辅助端子连接的技术是螺纹连接、焊销连接（solder pin connection）和压配合连接。
尤其用于汽车功率模块的另一个优选技术方案是环氧树脂模塑封装，其可以在高温能力、耐湿性、成本和高容量可制造性方面有益。
遗憾地是，用于这样的半导体封装的常见环氧树脂模塑工艺（转移和环氧树脂模塑）与如在基于外壳的功率半导体模块中的从功率半导体模块垂直伸出的销不兼容。
转移模塑功率模块（在模块的侧面具有用于功率和辅助连接的引线架端子）通常具有相当长的辅助连接，其可能隐含了较大电感和不太有利的开关行为。此外，如果单个引线架要用于功率和辅助端子（其关于功率模块的制造有优势）两者，则昂贵的压配合材料（例如CuNiSi）必须也用于功率端子，而否则功率端子可以由较便宜的铜材料制成。
WO 2014 166692 A1和US 2009 146272 A1示出对于模塑到模塑包封的顶侧内的压配合销具有插座的半导体模块。
发明内容
本公开的目的是提供简单且经济地制造半导体模块。
该目的由独立权利要求的主旨实现。另外的示范性实施例从从属权利要求和下列描述显而易见。
本公开涉及（功率）半导体模块。半导体模块可以视为器件，其包括一个或多个（功率）半导体器件（例如二极管、晶体管、晶闸管）连同机械支承且电互连这些一个或多个半导体器件的另外的构件。功率半导体模块以及功率半导体器件可以适于处理超过10A和/或超过100V的电流。
半导体模块可以在汽车应用中使用，例如客车、摩托车、公共汽车、卡车和/或充电站。此外，半导体模块可以在所有其他种类的车辆中使用，例如（越野）工程车辆。
根据本公开的实施例，半导体模块包括：半导体器件；衬底，在其上附连半导体器件；模塑包封，半导体器件和衬底模塑到该模塑包封内；至少一个功率端子，其部分模塑到包封内并且从包封突出，该功率端子与半导体器件电连接；和包封的电路板，其至少部分模塑到包封内并且在衬底的延伸方向上在衬底上突出，其中电路板包括用于销的至少一个插座，该插座经由电路板而与半导体器件的控制输入电连接。
半导体器件可以是或可以包括一个或多个半导体开关（例如晶闸管或晶体管），其可以在一个或多个芯片上提供。通常，半导体器件/芯片具有平面主体和/或其中一侧接合（例如焊接或烧结）到衬底。
功率半导体器件可以包括平坦主体，其在顶侧上或在相对的顶和底侧上提供电接触区域或电接触输入。必须注意，术语“底侧”和“顶侧”并未规定相对于地球表面的方向，而仅仅描述相对侧。
衬底可以包括半导体器件附连到的金属化层（即，导电层），和隔离层（例如塑料层或陶瓷层），金属化层在该隔离层上支承。衬底的金属化层可以构造成提供从半导体器件以及到半导体器件的电路径。衬底可以是大致平面的并且衬底在对应平面中的延伸可以定义衬底的延伸方向。
衬底可以具有与第一金属化层相对的另外的金属化层，其例如可以附连或接合到基板用于耗散热。
至少一个功率端子可以由引线架或其他金属带提供，其可以附连（例如接合）到衬底。至少一个功率端子可以电连接到半导体器件的区域/输入，由半导体器件开关的电流流过这些区域/输入。这样的区域可以是集电极和发射极区域/输入或源极和漏极区域/输入。
一般，功率端子可以提供半导体模块的AC和DC输入。
用于提供至少一个插座的电路板可以是印刷电路板。电路板可以包括一个或多个（可选地，构造的）金属化层和隔离层，其叠置在一起。电路板也可以附连（例如接合）到衬底。电路板并且特别是它的金属化层中的一个可以电连接到半导体器件的控制区域/输入，其可以是基极区域/输入或栅极区域/输入。
一般，电路板可以提供一个以上插座，其提供半导体模块的另外的辅助连接。
模塑包封可以是例如在压制中用两个压制工具来环氧树脂模塑，在该模塑包封中放置衬底、附连的半导体器件、已经电连接的功率端子和已经电连接的电路板并且在压力下用环氧树脂环绕它们。必须注意，功率端子和/或电路板在模塑之前也可以机械连接到衬底。然而，电路板（仅仅）经由模塑包封而机械连接到衬底，这也是可以的。
通常，模塑包封以及半导体模块可以具有带顶面和底面的大致平面主体，该顶面和底面被大致平面主体的侧面所环绕。功率端子和电路板可以从侧面从该主体突出。采用这样的方式，功率端子和电路板的突出部分可以设置在上文提到的压制工具之间而不进一步需要固定从顶面或底面突出的电连接。
在电路板的突出部分上，提供一个或多个插座，其适于收容销以用于使另外的电路与半导体器件电连接。插座可以是孔（直通孔或具有底部的孔），其可以至少部分用金属覆盖，与电路板的金属化层电连接。销可以由外部（控制）电路板提供，该外部电路板附连到半导体模块的顶侧。控制电路板可以是栅极驱动器板。必须理解，栅极驱动器板也可以用于控制双极晶体管的基极。
在使半导体模块电连接到另外的器件时半导体模块提供容易将电和机械部件环氧树脂模塑到包封内而不产生问题的方式。
另外，因为转移模塑封装是批量生产的成本有效工艺，不需要昂贵的塑料-金属复合框架部件，并且半导体模块与外部电路板的组装被简化，该半导体模块提供成本有效的技术方案。
根据本公开的实施例，半导体模块包括附连到包封的外部电路板，该外部电路板承载用于半导体器件的控制电路。外部电路板（其可以是模塑包封内部的半导体器件的控制电路板）可以设置在模塑包封外部。例如，外部电路板可以附连到半导体模块的顶面并且由外部电路板提供的一个或多个销可以放置到一个或多个插座内。
此外，外部电路板与包封的电路板（经由销）之间的短电流路径
以及通过外部电路板和包封的电路板（经由两个电路板的金属化层）的并联电流路径可以实现低电感栅极或基极连接，这对于实现半导体器件与控制电路之间的快速开关和/或使半导体器件与控制电路之间的感应耦合最小化可以是重要的。
根据本公开的实施例，外部电路板包括压入插座内的压配合销。压配合销可以是具有末端的销，在被压入插座内时，该末端可以可逆或者不可逆地压缩。例如，该销可以具有这样的末端，其中在将销的该末端插入插座时至少两个指状部朝彼此压缩。
销与外部电路板互连所在的另一端也可以是适于压配合连接、例如到外部电路板中的另外的插座内的末端。然而，压配合销焊接到外部电路板或其内，这也是可能的。
半导体模块内环氧树脂模塑封装和压配合互连的组合实现在需求的温度、高负载循环和/或高变化情况操作半导体模块。从而，半导体模块非常适合容置（混合）电动车辆的电逆变器或成为其一部分。
根据本公开的实施例，插座是通过电路板的孔，该孔至少部分用金属化层涂覆。该孔可以在模塑包封外部提供。
根据本公开的实施例，插座适于收容压配合销。压配合连接可以提供高可靠性、高温能力和易于组装。压配合连接可以包括具有用力插入电路板中的镀层直通孔（插座）来形成密封和永久电连接的可变形顶端的销。销和/或插座可以镀Sn。
根据本公开的实施例，插座在大致与衬底取向的方向垂直的方向上取向。衬底可以包括多个层，其中的每个可以具有平面延伸。插座或对应的孔可以大致与衬底的层所限定的平面垂直地取向，即可以指向模塑包封的底侧到顶侧的方向。
这可以促使在模塑包封旁边从半导体模块垂直伸出的压配合销，其可以在模塑工艺后组装。半导体模块可不需要塑料框架并且可以使用转移模塑工艺来封装。
根据本公开的实施例，包封包括凸起，其适于安装外部电路板。这些凸起（其可以看作塑料销）可以是与包封的主体成一体，和/或可以在包封模塑期间形成。一般，模塑封装可以以用于将外部电路板安装到功率半导体模块的导引结构为特征。
凸起可以用于在半导体模块上连同由一个或多个销和一个或多个插座提供的压配合连接来安装外部电路板。外部电路板可以包括用于收容凸起的孔。塑料凸起可以在组装外部电路板和模塑包封期间压配合到这些孔内。外部电路板与半导体模块侧电路板之间的高对准精度采用简单的方式实现。
根据本公开的实施例，凸起和至少一个插座在相同方向上取向。凸起可以在与一个或多个插座和/或对应销相同的方向上从包封的顶面突出。
根据本公开的实施例，包封的电路板是多层电路板，其包括至少两个导电层，这些层可以经由隔离层而彼此隔离。通过其不同层，可以传导一个或多个栅极或基极信号以及一个或多个辅助信号，例如其可以由一个或多个传感器（例如温度传感器、电流传感器和/或电压传感器）提供。这些一个或多个传感器还可以封装到模塑包封内并且与包封的电路板电连接。
这样，如果相应栅极和辅助信号在多层电路板中的平行平面层中路由，可以提供具有非常低电感的栅极或基极连接。这可以实现增加的开关速度以及功率与辅助信号之间减少的耦合，这对于宽带隙功率半导体器件尤为重要。
根据本公开的实施例，包封的电路板包括电连接到包封的电路板的不同导电层的至少两个插座。不同导电层经由通孔而互连，这可以是可能的。半导体模块的辅助连接中的每个可以由高可靠性压配合连接提供，该高可靠性压配合连接可以使半导体模块与外部电路板连接和/或与转移模塑封装工艺兼容。
这还可以基于通过包封的电路板的多层信号路由而实现减少的衬底和半导体模块占用空间。例如，包封的电路板可以在衬底上的功率信号承载岛上附连。通过到包封的电路板的金属化层的直接导线接合连接，对于辅助信号在衬底金属化层中可不需要单独的垫（pad）。
此外，包封的电路板部分可以淘汰额外陶瓷衬底，否则可能需要额外陶瓷衬底以在半导体模块中提供低电感栅极信号分布。
根据本公开的实施例，半导体器件包括半导体开关，其适于开关通过功率端子的电流并且适于由控制输入来控制。如已经提到的，半导体器件可以包括一个或多个晶闸管和/或晶体管。例如，半导体器件可以包括半桥。
根据本公开的实施例，包封包括从包封的主体突出的模塑结构，包封的电路板机械支承在该包封的主体中。模塑结构可以机械支承电路板结构。模塑结构可以具有倾斜侧，其从半导体模块的顶侧和/或底侧朝包封的电路板延伸。
根据本公开的实施例，包封的电路板包封在从包封主体突出的模塑结构中，该模塑结构包括与插座对准的孔。也就是说，包封并且特别是模塑结构可以完全覆盖包封的电路板并且可以仅仅具有孔，使得压配合销可以压配合到包封的电路板内。
然而，电路板仅部分被包封并且从模塑包封突出，这也可以是可能的。
根据本公开的实施例，衬底是被绝缘的金属衬底，其包括通过电隔离层而绝缘的两个金属化层。半导体器件或至少它的部分可以接合到衬底并且特别地接合到金属化层中的一个。
根据本公开的实施例，包封的电路板附连（例如接合）到衬底。包封的电路板可以由衬底机械支承，其可以例如凭借焊接、烧结、胶合直接或利用之间的间隔件而附连到衬底。
根据本公开的实施例，至少一个功率端子附连（例如接合）到衬底。至少一个功率端子和/或提供至少一个功率端子的引线架可以由衬底机械支承，其可以例如凭借焊接、烧结、胶合直接或利用之间的间隔件而附连到衬底。
根据本公开的实施例，至少一个功率端子和包封的电路板在衬底取向的侧向方向上从半导体模块突出。至少一个功率端子和包封的电路板可以从包封的主体的侧边突出。衬底、包封的电路板和/或至少功率端子在相同方向上取向。
根据本公开的实施例，包封的电路板与模塑到包封内的至少一个导线接合连接。例如，至少一个导线接合连接到半导体器件和/或到衬底的金属化层。包封的电路板可以通过导线接合而互连到半导体模块中的半导体器件的一个或多个半导体芯片或到衬底上的接触垫。这些导线接合可以在模塑之前接合到它们的接触面并且然后完全模塑到包封内。
根据本公开的实施例，半导体模块进一步包括基板，与半导体器件热接触、部分模塑到包封内并且从包封突出。基板可以是比衬底的一个或多个金属化层要厚的金属板和/或可以与半导体器件电隔离。基板可以接合到衬底，即在模塑之前机械连接到衬底。
本公开的这些和其他方面从下文描述的实施例将是明显的并且将参考它们来阐明。
附图说明
本公开的主旨将在下列正文中参考在附图中图示的示范性实施例更详细地解释，其中：
图1示意地示出根据本公开的实施例通过半导体模块的横截面图。
图2示意示出根据本公开的另外的实施例通过半导体模块的横截面图。
在图中使用的标号和它们的含义采用简要描述形式在参考符号列表中列出。原则上，相同的部件在图中提供有相同的参考符号。
具体实施方式
图1示出半导体模块10，其包括衬底12，半导体器件14附连到其上。
衬底12可以是被绝缘的金属衬底，其包括两个金属化层16、18，这两个金属化层16、18附连到隔离层20，其可以是陶瓷层。半导体器件14（其可以是具有晶体管或晶闸管的半导体芯片）可以在底侧接合到金属化层16。
在半导体器件14的该底侧处，可以提供半导体器件14的功率输入19，其可以是漏极区域或集电极区域。
衬底12的顶部金属化层16可以构造成对半导体器件14提供导电路径。
基板22可以例如通过接合附连到衬底12的底部金属化层18。该基板22（其可以是比金属化层16、18要厚的金属板）可以与半导体器件14电隔离但与半导体器件14热接触以用于冷却半导体器件14。
半导体模块10此外包括功率端子24，其由附连（例如接合）到衬底12的顶部金属化层16的引线架26提供。功率端子24可以由金属带提供。如在图1中示出的，接合到功率端子24的顶部金属化层16的部分经由导线接合28与在半导体器件14的顶侧上提供的半导体器件14的另外的功率输入29连接。该功率输入29可以是源极区或发射极区域。接合到半导体器件14的顶部金属化层16的部分可以与引线架26提供的另外的功率端子24电连接（直接或经由另外的导线接合而间接）。
关于半导体模块10的延伸方向E，电路板30附连（例如接合）到顶部金属化层16的另外的部分。电路板30的金属化层32经由导线接合34与在半导体器件14的顶侧上提供的半导体器件14的控制输入36电连接。该控制输入36可以是基极区域或栅极区域。
电路板30包括一个或多个插座38，其是通过电路板30突出并且适于收容压配合销40的孔。每个插座38可以用金属层涂覆和/或可以是镀层的孔，其电连接到电路板30的金属化层32。
关于延伸方向E，电路板30并且特别是具有插座38的部分在衬底12上突出。
半导体模块10包括模塑包封42，衬底12、半导体器件14和导线接合完全包封在其中。功率端子24和引线架26可以采用侧向方式从包封42突出。
电路板30还可以采用侧向方式从包封42突出或可以由包封42覆盖。尽管功率端子24从其中突出的包封42的侧可以是大致平面的，电路板30所在的包封的侧可以具有模塑结构44，其从包封42的主体46突出，电路板30至少部分收容在该模塑结构44中。
用于机械支承电路板30的该模塑结构44可以完全或至少部分覆盖电路板30。模塑结构44可以具有与插座38对准的孔，压配合销40可以延伸穿过该插座38。
基板22可以从包封42的主体46的底侧从包封42突出。
在顶侧上，包封42可以具有销48，其可以从主体46、大致与方向E垂直地突出。
完整的包封42（即主体46、模塑结构44和凸起）可以在一个模塑工艺期间形成。例如，完整组装的部件12、14、22、26、28、30、34可以定位在两部件模塑工具中并且可以在压力下包封到环氧树脂材料内。
销48用于使外部电路板50附连到半导体模块10的包封42。外部电路板50可以具有孔52以用于收容销48，在孔52中可以通过摩擦配合来支承销48。
外部电路板50（其也可以在方向E上取向，即大致平行于衬底12），引线架26和内部包封的电路板30可以承载半导体器件14的控制电路，例如栅极驱动器。图1示出该控制电路的一些电子部件54，其可以接合到外部电路板50的金属化层56。
压配合销40可以焊接到外部电路板50并且可以大致垂直地从外部电路板50突出。当外部电路板50安装到包封42时，压配合销40可以压入插座38。在它的末端处，压配合销40可以包括与针眼（其在安装期间可以被压缩）相似的结构，使得压配合销40在安装后在插座38中具有良好的机械和电接触。必须注意，压配合销40在包封42的主体46旁边延伸。
与其中销钉（male pin）从半导体模块垂直出来以连接到电路板中的凹形部的常规压配合连接方法相比，压配合销40可以在外部电路板50中集成并且可以连接到半导体模块10中的凹形部（插座38）。内部电路板30（其提供一个或多个插座38）集成到模塑包封42内。插座38可以是用于压配合销40的暴露孔。
内部电路板30可以机械接合到衬底12（例如凭借焊接、烧结或胶合）和/或通过导线接合34直接互连到半导体器件14上的接触区域36和/或到衬底12上的接触垫。
备选地，内部电路板30的接触垫还可以直接电连接到衬底12的接触垫。例如，导电垂直通孔可以使电信号在电路板30中分布。
如何在半导体模块10中集成电路板30的备选技术方案包括内部电路板30到基板22的附连、通过在衬底12与电路板30之间使用某种的间隔件而使电路板30从衬底12垂直移位或甚至使电路板30部分“自由浮置”并且仅仅通过模塑包封42来固定（可以在模塑期间对导线接合使用临时固定来实现）。
因为没有引线或销从半导体模块10垂直伸出，模塑包封42（其可以看作封装）可以利用转移模塑工艺来环氧树脂模塑。模塑工具可以直接对准到电路板30的边缘，通过这可以实现外部电路板50的对准特征48（例如形成为模塑封装中的凸起或孔，或额外部件）与电路板30中的压配合插座38之间的高的相对位置精度。
压配合销40可以已经集成在外部电路板50中。这可以通过任何常用连接方法（例如在直通孔中焊接）或还通过额外的压配合连接来实现。具有集成压配合销40的外部电路板50可以使用对准特征48以及可选地一些螺纹连接而压配合安装到半导体模块10。一般，外部电路板50可以直接安装到半导体模块10或到环绕半导体模块10的额外框架结构。
图2示出从功率半导体模块10（例如来自图1的）从另一侧的视图。图2示出两个电路板30、50可以是多层电路板。
包封的电路板30可以具有若干插座，其连接到电路板30的不同金属化层32。采用这样的方式，多个电信号可以在多个传导金属化层中路由。例如，这些信号包括来自外部电路板50的控制信号和来自可以包封到模塑包封42内的传感器的传感器信号。
另一方面，外部电路板50可以提供若干压配合销40，其连接到电路板50的不同金属化层56。
尽管本公开已经在附图和前述描述中详细地图示和描述，这样的图示和描述要认为是说明性或示范性的而不是限制性的；本公开不限于公开的实施例。公开的实施例的其他变化形式可以被本领域内技术人员在从对附图、公开和附上的权利要求的学习来实践要求保护的本公开中所理解和实施。在权利要求中，单词“包括”不排除其他元件或步骤，并且不定冠词“一”不排除多数。单个处理器或控制器或其他单元可以完成在权利要求中记载的若干项目的功能。某些措施在互相不同的从属权利要求中陈述的仅有的事实不指示这些措施的组合无法被有利地使用。在权利要求中的任何标号不应该解释为限制该范围。
参考符号列表
10 半导体模块 12 衬底
14 半导体器件 16 顶部金属化层
18 底部金属化层 19 接触区域
20 隔离层 22 基板
24 功率端子 26 引线架
28 导线接合 29 接触区域
30 电路板 32 金属化层
34 导线接合 36 接触区域
38 插座 40 压配合销
42 模塑包封 44 突出的模塑结构
46 主体 48 销
50 外部电路板 52 孔
54 电子部件 56 金属化层

Claims (15)

1.一种半导体模块(10)，其包括：
半导体器件(14)；
衬底(12)，在其上附连所述半导体器件(14)；
模塑包封(42)，所述半导体器件(14)和所述衬底(12)模塑到其内；
至少一个功率端子(24)，其部分模塑到所述包封(42)内并且从所述包封(42)突出，该功率端子(24)与所述半导体器件(14)电连接；和
包封的电路板(30)，其至少部分模塑到所述包封(42)内并且在所述衬底(12)的延伸方向(E)上在所述衬底(12)上突出，其中所述包封的电路板(30)包括用于压配合销(40)的至少一个插座(38)，所述插座(38)经由所述包封的电路板(30)而与所述半导体器件(14)的控制输入(36)电连接。
2.如权利要求1所述的半导体模块(10)，其进一步包括：
外部电路板(50)，其附连到所述包封(42)，所述外部电路板(50)承载用于所述半导体器件(14)的控制电路(54)；
其中所述外部电路板(50)包括压入所述插座(38)内的压配合销(40)。
3.如权利要求1或2所述的半导体模块(10)，
其中所述插座(38)是通过包封的电路板(30)的至少部分用金属化层涂覆的孔；和/或
其中所述插座(38)适于收容压配合销(40)；和/或
其中所述插座(38)在与所述衬底取向的方向垂直的方向上取向。
4.如权利要求1或2所述的半导体模块(10)，
其中所述包封(42)包括凸起(48)，其适于安装外部电路板(50)。
5.如权利要求4所述的半导体模块(10)，
其中所述凸起(48)和所述至少一个插座(38)在相同方向上取向。
6.如权利要求1或2所述的半导体模块(10)，
其中所述包封的电路板(30)是多层电路板，其包括至少两个导电层(32)；和/或
其中所述包封的电路板(30)包括电连接到所述包封的电路板(30)的不同导电层(32)的至少两个插座(38)。
7.如权利要求1或2所述的半导体模块(10)，
其中所述半导体器件(14)包括半导体开关，其适于开关通过所述功率端子(24)的电流并且适于由所述控制输入(36)控制。
8.如权利要求1或2所述的半导体模块(10)，
其中所述包封(42)包括从所述包封(42)的主体(46)突出的模塑结构(44)，所述包封的电路板(30)机械支承在所述包封(42)的主体(46)中；和/或
其中所述包封的电路板(30)包封在从所述包封(42)的主体(46)突出的模塑结构(44)中，所述模塑结构(44)包括与所述插座(38)对准的孔。
9.如权利要求1或2所述的半导体模块(10)，
其中所述衬底(12)是被绝缘的金属衬底，其包括通过电隔离层(20)绝缘的两个金属化层(16，18)。
10.如权利要求1或2所述的半导体模块(10)，
其中所述半导体器件(14)接合到所述衬底(12)。
11.如权利要求1或2所述的半导体模块(10)，
其中所述包封的电路板(30)附连到所述衬底(12)。
12.如权利要求1或2所述的半导体模块(10)，
其中所述至少一个功率端子(24)附连到所述衬底(12)。
13.如权利要求1或2所述的半导体模块(10)，
其中所述至少一个功率端子(24)和所述包封的电路板(30)在所述衬底(12)取向的侧向方向(E)上从所述半导体模块(10)突出；和/或
其中所述衬底(12)、所述包封的电路板(30)和/或所述至少一个功率端子(24)在相同方向(E)上取向。
14.如权利要求1或2所述的半导体模块(10)，
其中所述包封的电路板(30)与模塑到所述包封(42)内的至少一个导线接合(34)连接；
和/或
其中所述至少一个导线接合(34)连接到所述半导体器件(14)和/或到所述衬底(12)的金属化层(16)。
15.如权利要求1或2所述的半导体模块(10)，其进一步包括：
基板(22)，其与所述半导体器件(14)热接触、部分模塑到所述包封(42)内并且从所述包封(42)突出，和/或
其中所述基板(22)接合到所述衬底(12)。
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