DK177868B1 - Contact mechansim for electrical substrates - Google Patents

Contact mechansim for electrical substrates Download PDF

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Publication number
DK177868B1
DK177868B1 DK201300205A DKPA201300205A DK177868B1 DK 177868 B1 DK177868 B1 DK 177868B1 DK 201300205 A DK201300205 A DK 201300205A DK PA201300205 A DKPA201300205 A DK PA201300205A DK 177868 B1 DK177868 B1 DK 177868B1
Authority
DK
Denmark
Prior art keywords
circuit
encapsulating material
connector
blocks
substrate
Prior art date
Application number
DK201300205A
Other languages
Danish (da)
Inventor
Liebsch Andreas
Paulsen Lars
Ulrich Holger
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Priority to DK201300205A priority Critical patent/DK177868B1/en
Priority to DK201300205 priority
Application granted granted Critical
Publication of DK177868B1 publication Critical patent/DK177868B1/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

Abstract

A method of providing a contact mechanism is described. The method comprising encapsulating a circuit formed on an electrical substrate (the circuit including one or more connector blocks) and machining a hole into the connector blocks through the encapsulating material (typically by drilling) such that external connections can be made to each of said connector blocks through the encapsulating material.

Description

1 DK 177868 B1

CONTACT MECHANSIM FOR ELECTRICAL SUBSTRATES FIELD OF THE INVENTION

The present invention relates to the provision of a mechanism to allow 5 contact to circuit elements mounted on an encapsulated electrical substrate.

BACKGROUND OF THE INVENTION

Encapsulation of semiconductor devices into integrated circuit packages 10 prior to mounting the devices onto printed circuit boards is well known.

Such encapsulation might be provided, for example, to provide protection against vibration and moisture ingress. A problem with encapsulation is the need to provide electrical connections. This can readily be achieved, but a problem with some existing techniques is that multiple process 15 steps are required. A simple and reliable solution to this problem would be advantageous.

SUMMARY OF THE INVENTION

The present invention provides a method comprising machining one or 20 more holes into one or more connector blocks of a circuit formed on an electrical substrate, wherein an encapsulating material (sometimes referred to as an encapsulant) covers the connector blocks and wherein the or each hole is machined through the encapsulating material into the respective connector block such that external connections can be made to 25 one or more of said connector blocks through the encapsulating material.

The method may include the step of encapsulating the circuit (prior to the machining of the holes through the encapsulating material).

The present invention also provides a circuit (such as a power module) 30 comprising: one or more connector blocks mounted on a substrate (such as a DCB substrate); an encapsulating material (e.g. a resin/mold) 2 DK 177868 B1 encapsulating the circuit and covering the connector blocks; and one or more holes machined into one or more of the connector blocks through the encapsulating material such that external connections can be made to one or more of said connector blocks through the encapsulating material.

5

In one form of the invention, the holes are machined by drilling.

However, many alternatives to drilling exist, such as cutting, punching, pressing, milling, vertical eroding, and the use of cutting screws or lasers.

10 In many forms of the invention, one or more connectors are inserted into one or more of the connector blocks through the encapsulant, such that each connector is in electrical contact with a connector block and has a terminal end exposed above the encapsulant. In one form of the invention, the connectors are press-fit connectors, although alternative 15 connector technologies that could be used exist. When inserted, the connectors may be perpendicular to the plane of the substrate.

The invention may further comprise connecting the exposed terminal end of one or more of the connectors to one or more external connections 20 (such as power inputs or signal inputs and/or outputs). The exposed terminal ends may be press-fit connectors, but this is not essential. For example, the end of the connector that is inserted into the connector block that may be a press-fit connector, whilst the exposed end may be connected is some other way (e.g. by soldering).

25

The invention may include forming the circuit on the electrical substrate.

In some forms of the invention, the connector blocks have a non-circular cross-section (e.g. hexagonal or octagonal). This provides resistance to 30 rotation, which is particularly advantageous if the holes in the connector 3 DK 177868 B1 block are machined by drilling or by some other method in which the connector blocks could be rotated.

In some forms of the invention, the connector blocks have a smaller 5 cross-sectional area at a base (substrate end) than a top (external connection end) of the connector block. A smaller footprint at the base may be advantageous in order to reduce the space taken up by the connector block on the substrate.

10 The present invention also provides a method comprising: encapsulating a circuit formed on an electrical substrate, wherein the circuit includes one or more connector blocks and wherein an encapsulating material (e.g. a resin/mold) used for encapsulating the circuit covers the connector blocks; and machining (e.g. cutting/drilling) one or more holes into one or 15 more of the connector blocks through the encapsulating material such that external connections can be made to one or more of said connector blocks through the encapsulating material.

BRIEF DESCRIPTION OF THE DRAWINGS 20 The invention will now be described in further detail with reference to the following schematic drawings, in which:

Figure 1 is a flow chart showing an algorithm in accordance with an aspect of the present invention; 25 Figure 2 is a cross-section of a partially assembled circuit in accordance with an aspect of the present invention;

Figure 3 is a cross-section of a partially assembled circuit in accordance with an aspect of the present invention;

Figure 4 is a cross-section of a partially assembled circuit in 30 accordance with an aspect of the present invention; 4 DK 177868 B1

Figure 5 is a cross-section of a circuit assembled in accordance with an aspect of the present invention;

Figure 6 shows a press-fit connector used in some embodiments of the present invention; 5 Figure 7 shows a plurality of press-fit connectors suitable for use in some embodiments of the present invention;

Figure 8 is a side view a connector module used in some embodiments of the present invention; and

Figure 9 is a plan view of a connector module used in some 10 embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION Figure 5 is a highly schematic cross-section of a circuit, indicated generally by the reference numeral 1, in accordance with the principles of 15 the present invention. The circuit 1 may be a power module, but this is not essential to the present invention.

The circuit 1 includes a substrate comprising a lower conducting layer 2, an insulating layer 4 and an upper conducting layer 6. Connector blocks 20 10 and circuit elements 12 are built on top of the conducting layer 6. The substrate (consisting of the layers 2 to 6) may be a direct copper bonded (DCB) substrate (sometimes also referred to as a direct bonded copper (DBC) substrate).

25 The insulating layer 4 of the DCB substrate electrically isolates the upper and lower conducting layers. By way of example, the conducting layers 2 and 6 may be copper layers, although alternatives (such as aluminium) are possible. The insulating later may be a ceramic layer. Possible materials for the insulating layer are alumina (Al203), aluminium nitride 30 (AIN) and beryllium oxide (BeO). The skilled person will be aware of many alternative materials that could be used.

5 DK 177868 B1

Power modules often include DCB substrates. The present invention is well suited for use with such power modules. Nevertheless, the invention is widely applicable and is not limited either to power modules or to use 5 with DCB substrates.

Wire bonding 14 is used to connect at least some of the circuit elements 12 and the connector blocks 10 to provide a circuit. Of course, although only one wire bond 14 is shown in Figure 5 for clarity, a real circuit will 10 include many such wire bonds.

The connector blocks 10, the circuit elements 12 and the wire bonds 14 are all encapsulated using an encapsulant 8 (sometimes referred to herein as an encapsulating material). The encapsulant 8 provides a 15 degree of physical protection for the circuit elements 12, the connector blocks 10 and the wire bonds 14. When the substrate is a DCB substrate, the provision of an encapsulant may also improve mechanical stability.

The circuit includes electrical connectors 18 that enable connections to be 20 made to the encapsulated connector blocks 10. The electrical connectors 18 pass through the encapsulant 8 and into the connector blocks 10. The connector blocks are electrically connected to circuit elements 12, as is well known in the art.

25 Figure 1 is a flow chart showing an algorithm, indicated generally by the reference numeral 100, in accordance with an aspect of the present invention. The circuit 1 may be produced using the algorithm 100, as described further below.

6 DK 177868 B1

The algorithm 100 starts at step 102, where solder is printed onto the substrate. The solder layer defines connections that will be used in the circuit that will be built on the substrate.

5 At step 104, connector blocks 10 and circuit elements 12 are mounted onto the substrate. This is typically an automated process in which connector blocks and circuit elements are picked up by a machine and secured on the substrate in defined positions. Such processes are well known (and the particular method of assembling the connector blocks and 10 circuit elements is not essential to this invention).

With the connector blocks 10 and circuit elements 12 placed on the substrate, the wire bond connections 14 can be made (step 106 of the algorithm 100).

15

Figure 2 is a cross-section of a partially assembled circuit in accordance with steps 102 to 106 of the algorithm 100. The circuit shown in Figure 2 shows to the connector blocks 10, circuit elements 12 and wire bonds 14 located on the substrate formed by the conducting layers 2 and 6 and the 20 insulating layer 4.

Next, the circuit is encapsulated (step 108 of the algorithm 100). The encapsulated circuit is shown in Figure 3.

25 With the circuit encapsulated using an encapsulant 8, the algorithm 100 moves to step 110 where holes are machined into the connector blocks 10 through the encapsulant 8. As shown in Figure 4, holes 16 pass through the encapsulant and into the connector blocks 10. The holes 16 can be accurately placed and in combination with the placement of the 30 connector blocks 12, ensure that connections can be made to the circuit in exactly the position required.

7 DK 177868 B1

The holes 16 may be machined by drilling. Drilling through the encapsulant 8 is a simple process compared, for example, with etching, can be performed accurately and is flexible. The skilled person will be 5 aware of many alternatives to drilling, such as punching, pressing, milling, vertical eroding, and the use of cutting screws or lasers.

Finally, at step 112, connectors are mounted in the holes 16. As shown in Figure 5, the connectors 18 enable connections to be made to the 10 connector blocks 10 from outside the circuit. The connectors 18 may be used to provide power to the circuit. The connectors may be used to provide signal inputs to the circuit and/or to receive signal outputs from the circuit. In this way, a simple method is provided for providing connections to the circuit, whilst maintaining the advantages of 15 encapsulating that circuit. As shown in Figure 5, the connectors 18 may extend beyond the encapsulant 8.

Figure 6 shows a press-fit connector that is used as the connectors 18 in some embodiments of the present invention. Press-fit connectors 20 (sometimes referred to a "compliant pin connectors") have been used for many years to make connections to printed circuit boards without requiring solder connections. The press-fit connector shown in Figure 6 is indicated by the reference numeral 30. The connector 30 is often referred to as an "eye-of-the-needle" type of connector and includes an 25 end 32 that looks like the eye of a needle. In use, the end 32 is inserted into the hole 16 and makes contact with the connector block 10. The end 32 is slightly larger than the hole 16, such that the connector end is deformed when inserted into the hole. The deformation creates a reliable connection.

30 8 DK 177868 B1

Other forms of compliant connectors are known and could be used in the present invention. For example, a solid press-fit connector having a diameter slightly larger than the hole 16 could be used. As with the eye-of-the-needle connector 30, when the solid press-fit connector is inserted 5 into the hole 16, the connector 30 is deformed to create a reliable connection.

The press-fit connectors are described above by way of example only.

The skilled person will be aware of many alternative connector 10 technologies (such as spring contact connectors) that could be used in alternative embodiments of the invention.

Figure 7 shows a plurality of press-fit connectors, indicated generally by the reference numeral 40, suitable for use in some embodiments of the 15 present invention. In use, each of the plurality of press-fit connectors is inserted into a connector block 10. The press-fit connectors of the plurality 40 are double-ended connectors, having an "eye" at each end.

It should be noted that the use of double-ended press-fit connectors is not essential to the present invention. For example, a press-fit 20 connection could be used for connecting to the connector block whilst an alternative connection technology (such as soldering) could be used to connect the exposed terminal end of the connector to another circuit element. Thus, the present invention provides significant freedom.

25 Figure 8 is a side view a connector module 10 used in some embodiments of the present invention. Figure 9 is a plan view of the connector module 10 of Figure 8.

As shown in Figures 8 and 9, in one embodiment of the invention, the 30 connector block 10 has a circular hole 16 drilled (or otherwise machined) therethrough, but the connector module is not itself circular. In the 9 DK 177868 B1 examples of Figures 8 and 9, the connector module is hexagonal, although other shapes (such as octagonal) are possible. Providing a noncircular connector block increases the resistance of the connector module to rotation. This is advantageous as it reduces the likelihood of the 5 connector block 10 rotating when the hole 16 is drilled.

Figure 8 shows that the diameter of the connector block 10 is larger at the top than at the bottom of the connector block. The connector block needs to be relatively large at the top since a mechanical contact to one 10 of the connectors 18 must be made. In one embodiment of the invention, a diameter of 2.5mm to 3mm is used. At the bottom of the connector block, a smaller footprint is advantageous in order to reduce the space taken up by the connector block on the substrate.

15 The embodiments of the invention described above are provided by way of example only. The skilled person will be aware of many modifications, changes and substitutions that could be made without departing from the scope of the present invention. The claims of the present invention are intended to cover all such modifications, changes and substitutions as fall 20 within the spirit and scope of the invention.

Claims (13)

  1. A method which comprises processing one or more holes in one or more connecting blocks in a circuit formed on an electrical substrate, wherein an encapsulating material covers the connecting blocks and wherein the hole, or each hole, is processed through the encapsulating material. material into the respective connection block so that external connections can be formed to one or more of the connection blocks through the encapsulating material.
  2. The method of claim 1, further comprising the step of encapsulating the circuit.
  3. The method of claim 1 or 2, wherein the holes are processed by drilling.
  4. A method according to any one of claims 1 to 3, further comprising introducing one or more plugs into one or more of the connecting blocks, through the encapsulating material, such that each plugging is in electrical contact with a connecting block and has a terminal end which is exposed over the encapsulating material. 20
  5. The method of claim 4, wherein the plug connectors are plug connectors which are pressed firmly.
  6. The method of claim 4 or 5, further comprising connecting the exposed terminal end of one or more of the connector to one or more external connections.
  7. A method according to any of the preceding claims, further comprising forming the circuit on the electrical substrate.
  8. A circuit comprising: one or more connecting blocks mounted on a substrate; an encapsulating material which encapsulates the circuit and covers the connection blocks; and one or more holes processed in one or more of the connecting blocks 35 through the encapsulating material so that external connections can be formed to one or more of the connecting blocks through the encapsulating material.
  9. A circuit according to claim 8, further comprising one or more plug connections provided in electrical contact with one or more of the connecting blocks through the encapsulating material, each plug connection having a terminal end exposed over the encapsulating material. material.
  10. The circuit of claim 9, wherein the plug connections are plugged connectors. 5
  11. A circuit according to claim 9 or 10, wherein the terminal ends of one or more of the connector connections are connected to one or more external connections.
  12. A circuit according to any one of claims 9 to 11, wherein the plug connections 10 are provided substantially perpendicular to the substrate.
  13. A circuit according to any one of claims 8 to 12, wherein the connecting blocks have a non-circular cross-section.
DK201300205A 2013-04-08 2013-04-08 Contact mechansim for electrical substrates DK177868B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DK201300205A DK177868B1 (en) 2013-04-08 2013-04-08 Contact mechansim for electrical substrates
DK201300205 2013-04-08

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK201300205A DK177868B1 (en) 2013-04-08 2013-04-08 Contact mechansim for electrical substrates
PCT/EP2014/054865 WO2014166692A1 (en) 2013-04-08 2014-03-12 Contact mechanism for electrical substrates

Publications (1)

Publication Number Publication Date
DK177868B1 true DK177868B1 (en) 2014-10-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
DK201300205A DK177868B1 (en) 2013-04-08 2013-04-08 Contact mechansim for electrical substrates

Country Status (2)

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DK (1) DK177868B1 (en)
WO (1) WO2014166692A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3217774B1 (en) 2016-03-08 2018-06-13 ABB Schweiz AG Semiconductor module
US10137789B2 (en) 2016-07-20 2018-11-27 Ford Global Technologies, Llc Signal pin arrangement for multi-device power module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791177B2 (en) * 2007-12-10 2010-09-07 Infineon Technologies Ag Electronic device
JP4634497B2 (en) * 2008-11-25 2011-02-23 三菱電機株式会社 Power semiconductor module

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WO2014166692A1 (en) 2014-10-16

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Effective date: 20160430