JP5818102B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP5818102B2 JP5818102B2 JP2012157578A JP2012157578A JP5818102B2 JP 5818102 B2 JP5818102 B2 JP 5818102B2 JP 2012157578 A JP2012157578 A JP 2012157578A JP 2012157578 A JP2012157578 A JP 2012157578A JP 5818102 B2 JP5818102 B2 JP 5818102B2
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- JP
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- Prior art keywords
- lead frame
- mold
- control board
- lower mold
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
図1−1は、本発明の実施の形態にかかる電力用半導体装置100の概略構成を模式的に示す斜視図である。図1−2は、本発明の実施の形態にかかる電力用半導体装置100の概略構成を模式的に示す断面図であり、図1−1のA−A線に沿った断面図である。図1−3は、本発明の実施の形態にかかる電力用半導体装置100の概略構成を模式的に示す断面図であり、図1−2のB−B線に沿った断面図である。図1−4は、本発明の実施の形態にかかる電力用半導体装置100の概略構成を模式的に示す断面図であり、図1−2のC−C線に沿った断面図である。
1a リードフレームの外部端子(外部端子)
1b リードフレームの外部端子(外部端子)
2 絶縁放熱シート
3 金属ベース
4 パワー素子
5 制御基板
5a 突出部
6a 金属ワイヤ
6b 金属ワイヤ
6c 金属ワイヤ
7 モールド樹脂
7a モールド金型分割面の形状が転写された線
21 下モールド金型
21a 合わせ面
21b 合わせ面
22a 金型突起部
22b 金型突起部
23a 金型突起部
23b 金型突起部
24 外部端子配置溝
25 外部端子配置溝
31 上モールド金型
31a 合わせ面
31b 合わせ面
32a 凹部
32b 凹部
33a 凹部
33b 凹部
100 電力用半導体装置
Claims (2)
- リードフレームの一面側に半導体素子を実装する第1工程と、
前記半導体素子を制御する部品を搭載した制御基板を、前記リードフレームと前記制御基板とを固定する上モールド型および下モールド型における既定の挟持位置に前記リードフレームを配置した際に前記制御基板の面方向における4つの角部のそれぞれから前記制御基板の辺方向に延在する突出部が前記上モールド型および前記下モールド型における既定の挟持位置に配置される相対位置で、ワイヤボンディングにより電気的且つ機械的に前記リードフレームに接続して前記制御基板を前記リードフレームにおける前記半導体素子が配置された領域の上方に保持する第2工程と、
前記下モールド型の中空部に絶縁放熱樹脂層を配置する第3工程と、
前記絶縁放熱樹脂層上に前記リードフレームの他面側を接触させ、前記下モールド型における前記上モールド型との合わせ面に前記突出部の幅に対応して設けられた突起部により構成されて前記合わせ面における前記リードフレームの挟持位置よりも高い位置に位置する既定の挟持位置に前記4つの角部の前記突出部が保持された状態で、前記リードフレームと前記制御基板とを前記下モールド型に配置する第4工程と、
前記下モールド型に前記上モールド型を型閉めして前記下モールド型と前記上モールド型との内部に封止樹脂を注入する第5工程と、
を含み、
前記第2工程では、前記4つの角部の前記突出部をクランプした状態で前記制御基板をワイヤボンディングにより前記リードフレームに接続し、
前記第5工程では、前記4つの角部の前記突出部を前記下モールド型と前記上モールド型との合わせ面で挟持することにより所定の正しい相対位置に前記制御基板を固定すること、
を特徴とする半導体装置の製造方法。 - 前記第4工程では、前記リードフレームの端部に設けられた外部端子部の一部を前記下モールド型の前記合わせ面に設けられた溝部に配置して外部に突出させること、
を特徴とする請求項1に記載の半導体装置の製造方法。
Priority Applications (2)
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---|---|---|---|
JP2012157578A JP5818102B2 (ja) | 2012-07-13 | 2012-07-13 | 半導体装置の製造方法 |
CN201210450893.0A CN103545265B (zh) | 2012-07-13 | 2012-11-12 | 半导体装置及其制造方法 |
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JP2012157578A JP5818102B2 (ja) | 2012-07-13 | 2012-07-13 | 半導体装置の製造方法 |
Publications (2)
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JP2014022444A JP2014022444A (ja) | 2014-02-03 |
JP5818102B2 true JP5818102B2 (ja) | 2015-11-18 |
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JP (1) | JP5818102B2 (ja) |
CN (1) | CN103545265B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016018979A (ja) | 2014-07-11 | 2016-02-01 | 株式会社デンソー | モールドパッケージ |
CN104201164B (zh) * | 2014-08-27 | 2019-01-15 | 佳禾智能科技股份有限公司 | 一种三维集成电路组件及其制备方法 |
JP6385258B2 (ja) * | 2014-11-28 | 2018-09-05 | 三菱電機株式会社 | 樹脂ばり除去装置および樹脂封止型半導体装置の製造方法 |
JP7030844B2 (ja) * | 2017-05-02 | 2022-03-07 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 露出した端子領域を有する樹脂封止パワー半導体モジュール |
JP6943051B2 (ja) * | 2017-07-19 | 2021-09-29 | 株式会社デンソー | 半導体装置の製造方法 |
JP7298177B2 (ja) * | 2019-02-15 | 2023-06-27 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
CN117242569A (zh) * | 2021-05-11 | 2023-12-15 | 三菱电机株式会社 | 半导体装置及电力转换装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2006054245A (ja) * | 2004-08-10 | 2006-02-23 | Mitsubishi Electric Corp | 半導体装置 |
JP2011096695A (ja) * | 2009-10-27 | 2011-05-12 | Mitsubishi Electric Corp | 半導体装置 |
JP5200037B2 (ja) * | 2010-01-21 | 2013-05-15 | 三菱電機株式会社 | パワーモジュール |
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2012
- 2012-07-13 JP JP2012157578A patent/JP5818102B2/ja active Active
- 2012-11-12 CN CN201210450893.0A patent/CN103545265B/zh active Active
Also Published As
Publication number | Publication date |
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CN103545265A (zh) | 2014-01-29 |
JP2014022444A (ja) | 2014-02-03 |
CN103545265B (zh) | 2016-08-03 |
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