JP6743967B2 - 天井搬送車システム及びティーチングユニット - Google Patents
天井搬送車システム及びティーチングユニット Download PDFInfo
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Automation & Control Theory (AREA)
- Transportation (AREA)
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Description
Claims (6)
- 被搬送物を搬送する天井搬送車と、
前記被搬送物が載置される移載部へ前記天井搬送車により前記被搬送物を移載する際のティーチングに用いられるティーチングユニットと、を備え、
前記ティーチングユニットは、
前記移載部に設置された位置決め部材に接触することで当該位置決め部材の位置を検出する検出部を有するユニット本体部と、
前記ユニット本体部に対して昇降自在に設けられ、前記天井搬送車の昇降部で昇降される保持部に保持されるフランジ部と、を有する天井搬送車システム。 - 前記保持部により前記フランジ部が保持されている状態において、前記保持部に対する前記ユニット本体部の相対的な上昇動作を検出する動作検出部と、
前記動作検出部の検出結果に基づいて、前記ティーチングユニットが前記位置決め部材に載置され且つ前記位置決め部材が前記ティーチングユニットの重量を受け持つ状態であることを認識する認識部と、を備える、請求項1に記載の天井搬送車システム。 - 前記動作検出部は、
前記保持部に昇降自在に設けられ、前記ユニット本体部に接触すると共に、当該ユニット本体部の上昇に連動して前記保持部に対して相対的に上昇する被検出部材と、
前記保持部に対する前記被検出部材の相対的な上昇を検出するセンサと、を有する、請求項2に記載の天井搬送車システム。 - 前記フランジ部は、前記ユニット本体部に対して可動機構を介して一定範囲内で昇降自在に設けられている、請求項1〜3の何れか一項に記載の天井搬送車システム。
- 被搬送物を搬送する天井搬送車を備える天井搬送車システムにおいて、前記被搬送物が載置される移載部へ前記天井搬送車により前記被搬送物を移載する際のティーチングに用いられるティーチングユニットであって、
前記移載部に設置された位置決め部材に接触することで当該位置決め部材の位置を検出する検出部を有するユニット本体部と、
前記ユニット本体部に対して昇降自在に設けられ、前記天井搬送車の昇降部により昇降される保持部に保持されるフランジ部と、を有するティーチングユニット。 - 前記天井搬送車システムは、前記保持部により前記フランジ部が保持されている状態において前記保持部に対する前記ユニット本体部の相対的な上昇動作を検出する動作検出部を備え、
前記動作検出部は、
前記保持部に昇降自在に設けられ、前記ユニット本体部に接触すると共に、当該ユニット本体部の上昇に連動して前記保持部に対して相対的に上昇する被検出部材と、
前記保持部に対する前記被検出部材の相対的な上昇を検出するセンサと、を有し、
前記ユニット本体部には、前記動作検出部の前記被検出部材と接触する接触部材が立設されている、請求項5に記載のティーチングユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2017076207 | 2017-04-06 | ||
JP2017076207 | 2017-04-06 | ||
PCT/JP2018/005067 WO2018186021A1 (ja) | 2017-04-06 | 2018-02-14 | 天井搬送車システム及びティーチングユニット |
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JPWO2018186021A1 JPWO2018186021A1 (ja) | 2019-11-21 |
JP6743967B2 true JP6743967B2 (ja) | 2020-08-19 |
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Country Status (5)
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US (1) | US10714368B2 (ja) |
JP (1) | JP6743967B2 (ja) |
CN (1) | CN110235235B (ja) |
TW (1) | TWI748074B (ja) |
WO (1) | WO2018186021A1 (ja) |
Families Citing this family (4)
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CN113165807B (zh) * | 2018-12-14 | 2022-07-26 | 村田机械株式会社 | 输送车 |
JP7063277B2 (ja) * | 2019-01-10 | 2022-05-09 | 株式会社ダイフク | 天井搬送車 |
JP7310716B2 (ja) * | 2020-05-26 | 2023-07-19 | 株式会社ダイフク | 天井搬送車、ティーチングユニット及び天井搬送車における移載位置学習方法 |
CN116190294B (zh) * | 2023-04-24 | 2023-07-25 | 上海果纳半导体技术有限公司 | 一种天车示教方法 |
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JPH11349280A (ja) * | 1998-06-05 | 1999-12-21 | Shinko Electric Co Ltd | 懸垂式搬送装置 |
JP3479969B2 (ja) | 1999-09-06 | 2003-12-15 | 村田機械株式会社 | 搬送システムのティーチング方法とその装置 |
US7591624B2 (en) * | 2006-01-09 | 2009-09-22 | International Business Machines Corporation | Reticle storage pod (RSP) transport system utilizing FOUP adapter plate |
JP4911045B2 (ja) * | 2008-01-21 | 2012-04-04 | ムラテックオートメーション株式会社 | 被搬送物及び防振機構 |
WO2009145082A1 (ja) * | 2008-05-27 | 2009-12-03 | ローツェ株式会社 | 搬送装置、位置教示方法及びセンサ治具 |
JP5636849B2 (ja) * | 2010-09-30 | 2014-12-10 | 村田機械株式会社 | 移載システム |
US9287150B2 (en) * | 2012-10-09 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle transfer system and method |
WO2015166738A1 (ja) * | 2014-05-01 | 2015-11-05 | 村田機械株式会社 | ティーチングユニット及びティーチング方法 |
EP3159923B1 (en) * | 2014-06-19 | 2021-06-16 | Murata Machinery, Ltd. | Carrier buffering device and buffering method |
JP6206747B2 (ja) * | 2014-06-19 | 2017-10-04 | 村田機械株式会社 | キャリアの一時保管装置と保管方法 |
JP6260697B2 (ja) * | 2014-06-19 | 2018-01-17 | 村田機械株式会社 | キャリアの一時保管装置と一時保管方法 |
JP6119699B2 (ja) * | 2014-08-27 | 2017-04-26 | 村田機械株式会社 | 移載位置決定方法 |
WO2017038268A1 (ja) * | 2015-08-28 | 2017-03-09 | 村田機械株式会社 | ティーチング装置、搬送システム、及び位置決めピンの測定方法 |
US10509420B2 (en) * | 2016-07-12 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle purging system and method thereof |
CN110326097B (zh) * | 2017-03-28 | 2023-03-03 | 村田机械株式会社 | 桥式输送车 |
DE102018113786A1 (de) * | 2018-06-08 | 2019-12-12 | Vat Holding Ag | Waferübergabeeinheit und Waferübergabesystem |
JP6969512B2 (ja) * | 2018-07-05 | 2021-11-24 | 株式会社ダイフク | 物品搬送装置 |
-
2018
- 2018-02-14 WO PCT/JP2018/005067 patent/WO2018186021A1/ja active Application Filing
- 2018-02-14 CN CN201880008753.3A patent/CN110235235B/zh active Active
- 2018-02-14 JP JP2019511077A patent/JP6743967B2/ja active Active
- 2018-02-14 US US16/491,595 patent/US10714368B2/en active Active
- 2018-03-29 TW TW107110845A patent/TWI748074B/zh active
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Publication number | Publication date |
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CN110235235B (zh) | 2023-01-06 |
CN110235235A (zh) | 2019-09-13 |
TW201841815A (zh) | 2018-12-01 |
TWI748074B (zh) | 2021-12-01 |
US20200020559A1 (en) | 2020-01-16 |
WO2018186021A1 (ja) | 2018-10-11 |
JPWO2018186021A1 (ja) | 2019-11-21 |
US10714368B2 (en) | 2020-07-14 |
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