JP6736902B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6736902B2 JP6736902B2 JP2016024804A JP2016024804A JP6736902B2 JP 6736902 B2 JP6736902 B2 JP 6736902B2 JP 2016024804 A JP2016024804 A JP 2016024804A JP 2016024804 A JP2016024804 A JP 2016024804A JP 6736902 B2 JP6736902 B2 JP 6736902B2
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- 239000004065 semiconductor Substances 0.000 title claims description 74
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 94
- 239000002184 metal Substances 0.000 claims description 94
- 238000000605 extraction Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 19
- 239000012535 impurity Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 28
- 230000004888 barrier function Effects 0.000 description 22
- 230000007547 defect Effects 0.000 description 12
- 239000003963 antioxidant agent Substances 0.000 description 9
- 230000003078 antioxidant effect Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910016570 AlCu Inorganic materials 0.000 description 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
Description
図1は、本発明の実施の形態に係る半導体装置の製造方法で製造された半導体装置の断面図である。この半導体装置はIGBTチップである。この半導体装置は例えばシリコンを材料とする半導体基板10を備えている。半導体基板10にはトレンチゲート電極12が形成されている。具体的に言えば、半導体基板10の上面側には、半導体基板10にストライプ状に彫られた溝を埋めるトレンチゲート電極12が設けられている。トレンチゲート電極12の材料は例えばポリシリコンである。トレンチゲート電極12と半導体基板10の間にはゲート酸化膜14が設けられている。
Claims (4)
- 半導体基板の上面側に不純物層を形成する工程と、
前記半導体基板の上面に開口を有する絶縁膜を形成する工程と、
前記絶縁膜の開口を埋める埋め込み金属と、前記埋め込み金属とつながり、前記絶縁膜の上に位置する保護金属と、を有することで前記絶縁膜を覆うプラグ金属をCVD法で形成する工程と、
前記プラグ金属の上に、スパッタリング法又はPVD法により引出電極を形成する工程と、
前記引出電極の上に、めっき法により接合電極を形成する工程と、を備え、
前記プラグ金属は、前記半導体基板を下に凸に反らせる厚みを有することを特徴とする半導体装置の製造方法。 - 前記半導体基板の下面にスパッタ法で下面電極を形成する工程と、
前記下面電極を外部構成にはんだ付けすることを特徴とする請求項1に記載の半導体装置の製造方法。 - 前記半導体基板はワイドバンドギャップ半導体によって形成されたことを特徴とする請求項1又は2に記載の半導体装置の製造方法。
- 前記ワイドバンドギャップ半導体は、炭化珪素、窒化ガリウム系材料又はダイヤモンドであることを特徴とする請求項3に記載の半導体装置の製造方法。
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JP2016024804A JP6736902B2 (ja) | 2016-02-12 | 2016-02-12 | 半導体装置の製造方法 |
DE102017200452.5A DE102017200452B4 (de) | 2016-02-12 | 2017-01-12 | Verfahren zur Fertigung einer Halbleitervorrichtung |
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JP2016024804A JP6736902B2 (ja) | 2016-02-12 | 2016-02-12 | 半導体装置の製造方法 |
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JP2017143214A JP2017143214A (ja) | 2017-08-17 |
JP6736902B2 true JP6736902B2 (ja) | 2020-08-05 |
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DE (1) | DE102017200452B4 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7013735B2 (ja) | 2017-09-05 | 2022-02-01 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
JP7132198B2 (ja) * | 2019-09-27 | 2022-09-06 | 芝浦メカトロニクス株式会社 | 成膜装置及び埋込処理装置 |
JP2022167237A (ja) * | 2021-04-22 | 2022-11-04 | 有限会社Mtec | 半導体素子の製造方法及び縦型mosfet素子 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3179065B2 (ja) * | 1999-02-02 | 2001-06-25 | 宮崎沖電気株式会社 | 半導体素子の製造方法 |
JP2002158233A (ja) | 2000-11-17 | 2002-05-31 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置の製造方法 |
JP4906184B2 (ja) * | 2000-11-17 | 2012-03-28 | オンセミコンダクター・トレーディング・リミテッド | 絶縁ゲート型半導体装置の製造方法 |
JP5487601B2 (ja) * | 2008-11-27 | 2014-05-07 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JP5707709B2 (ja) | 2009-03-23 | 2015-04-30 | 富士電機株式会社 | 半導体装置の製造方法 |
JP2011171551A (ja) * | 2010-02-19 | 2011-09-01 | Toyota Motor Corp | 半導体装置の製造方法 |
CN102201409A (zh) * | 2010-03-24 | 2011-09-28 | 万国半导体(开曼)股份有限公司 | 具有钨间隔层的功率mosfet器件及其制造方法 |
JP5605095B2 (ja) * | 2010-08-31 | 2014-10-15 | 三菱電機株式会社 | 半導体装置 |
JP5893471B2 (ja) * | 2012-03-30 | 2016-03-23 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN105009295B (zh) | 2013-03-29 | 2017-10-10 | 富士电机株式会社 | 半导体装置及半导体装置的制造方法 |
DE102013222816A1 (de) | 2013-11-11 | 2015-05-13 | Robert Bosch Gmbh | Verbindungsanordnung mit einem Halbleiterbaustein und einem ultraschallverschweißten Draht |
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DE102017200452B4 (de) | 2022-05-05 |
JP2017143214A (ja) | 2017-08-17 |
DE102017200452A1 (de) | 2017-08-17 |
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