JP6732848B2 - 非対称な形状の発光装置、当該発光装置を用いたバックライトモジュール、当該発光装置の製造方法 - Google Patents

非対称な形状の発光装置、当該発光装置を用いたバックライトモジュール、当該発光装置の製造方法 Download PDF

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JP6732848B2
JP6732848B2 JP2018136401A JP2018136401A JP6732848B2 JP 6732848 B2 JP6732848 B2 JP 6732848B2 JP 2018136401 A JP2018136401 A JP 2018136401A JP 2018136401 A JP2018136401 A JP 2018136401A JP 6732848 B2 JP6732848 B2 JP 6732848B2
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Prior art keywords
light emitting
horizontal direction
light
emitting device
optical member
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JP2018136401A
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Japanese (ja)
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JP2019033251A (ja
Inventor
チェン、チェー
チャン、チャシェン
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Maven Optronics Co Ltd
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Maven Optronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065—Manufacturing aspects; Material aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
JP2018136401A 2017-07-21 2018-07-20 非対称な形状の発光装置、当該発光装置を用いたバックライトモジュール、当該発光装置の製造方法 Active JP6732848B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW106124542A TWI644056B (zh) 2017-07-21 2017-07-21 具非對稱結構的發光裝置、包含該發光裝置之背光模組及該發光裝置之製造方法
TW106124542 2017-07-21

Publications (2)

Publication Number Publication Date
JP2019033251A JP2019033251A (ja) 2019-02-28
JP6732848B2 true JP6732848B2 (ja) 2020-07-29

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JP2018136401A Active JP6732848B2 (ja) 2017-07-21 2018-07-20 非対称な形状の発光装置、当該発光装置を用いたバックライトモジュール、当該発光装置の製造方法

Country Status (3)

Country Link
JP (1) JP6732848B2 (ko)
KR (1) KR102129002B1 (ko)
TW (1) TWI644056B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
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CN111276596B (zh) 2018-12-05 2024-02-06 光宝光电(常州)有限公司 发光单元
TWI676768B (zh) * 2018-12-05 2019-11-11 大陸商光寶光電（常州）有限公司 發光單元
KR102325808B1 (ko) * 2019-07-17 2021-11-12 주식회사 에스엘바이오닉스 반도체 발광소자 및 이의 제조방법
JP7066964B2 (ja) * 2020-01-31 2022-05-16 日亜化学工業株式会社 面状光源
CN116598410A (zh) * 2023-06-29 2023-08-15 惠州市弘正光电有限公司 Led光源、led显示屏及制备工艺

Family Cites Families (17)

* Cited by examiner, † Cited by third party
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JP4640188B2 (ja) * 2006-01-18 2011-03-02 三菱電機株式会社 面状光源装置
US20080049445A1 (en) * 2006-08-25 2008-02-28 Philips Lumileds Lighting Company, Llc Backlight Using High-Powered Corner LED
EP2221885A4 (en) * 2007-11-19 2013-09-25 Panasonic Corp SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
KR20130007036A (ko) * 2011-06-28 2013-01-18 (주)세미머티리얼즈 발광소자 패키지 및 그 제조 방법
KR101262520B1 (ko) * 2011-07-18 2013-05-08 엘지이노텍 주식회사 광학 부재 및 이를 포함하는 표시장치
JP2013072905A (ja) * 2011-09-26 2013-04-22 Toshiba Corp 液晶表示装置用バックライト
JP5860289B2 (ja) * 2012-01-05 2016-02-16 シチズン電子株式会社 Ｌｅｄ装置の製造方法
JP5995695B2 (ja) * 2012-12-03 2016-09-21 シチズンホールディングス株式会社 Ｌｅｄ装置の製造方法
JP6153327B2 (ja) * 2013-01-22 2017-06-28 シチズン電子株式会社 Ｌｅｄモジュール
KR20140133765A (ko) * 2013-05-09 2014-11-20 서울반도체 주식회사 광원 모듈 및 이를 구비한 백라이트 유닛
KR20150044307A (ko) * 2013-10-16 2015-04-24 주식회사 루멘스 측면 발광형 발광 소자 패키지와, 백라이트 유닛 및 측면 발광형 발광 소자 패키지의 제작 방법
JP6438648B2 (ja) * 2013-11-15 2018-12-19 日亜化学工業株式会社 半導体発光装置およびその製造方法
KR101691818B1 (ko) * 2014-06-19 2017-01-03 삼성디스플레이 주식회사 광원모듈 및 이를 포함하는 백라이트 유닛
KR102398384B1 (ko) * 2015-06-29 2022-05-16 엘지디스플레이 주식회사 발광 다이오드 패키지와 그의 제조 방법, 이를 이용한 백라이트 유닛과 액정 표시 장치
CN108431972B (zh) * 2015-10-07 2022-02-11 亮锐控股有限公司 具有可变数目的发射表面的倒装芯片smt led
KR102464320B1 (ko) * 2015-10-26 2022-11-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
JP6567576B2 (ja) * 2017-02-09 2019-08-28 サターン ライセンシング エルエルシーＳａｔｕｒｎ Ｌｉｃｅｎｓｉｎｇ ＬＬＣ 表示装置

Also Published As

Publication number Publication date
KR20200068006A (ko) 2020-06-15
JP2019033251A (ja) 2019-02-28
TWI644056B (zh) 2018-12-11
TW201908652A (zh) 2019-03-01
KR102129002B1 (ko) 2020-07-02

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