TWI644056B - 具非對稱結構的發光裝置、包含該發光裝置之背光模組及該發光裝置之製造方法 - Google Patents

具非對稱結構的發光裝置、包含該發光裝置之背光模組及該發光裝置之製造方法 Download PDF

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Publication number
TWI644056B
TWI644056B TW106124542A TW106124542A TWI644056B TW I644056 B TWI644056 B TW I644056B TW 106124542 A TW106124542 A TW 106124542A TW 106124542 A TW106124542 A TW 106124542A TW I644056 B TWI644056 B TW I644056B
Authority
TW
Taiwan
Prior art keywords
light
led chip
covered
reflective
horizontal direction
Prior art date
Application number
TW106124542A
Other languages
English (en)
Chinese (zh)
Other versions
TW201908652A (zh
Inventor
傑 陳
張嘉顯
Original Assignee
行家光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 行家光電股份有限公司 filed Critical 行家光電股份有限公司
Priority to TW106124542A priority Critical patent/TWI644056B/zh
Priority to EP18184426.7A priority patent/EP3454386B1/en
Priority to US16/040,492 priority patent/US10749086B2/en
Priority to KR1020180084023A priority patent/KR102129002B1/ko
Priority to JP2018136401A priority patent/JP6732848B2/ja
Application granted granted Critical
Publication of TWI644056B publication Critical patent/TWI644056B/zh
Publication of TW201908652A publication Critical patent/TW201908652A/zh
Priority to US16/921,748 priority patent/US11081631B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065—Manufacturing aspects; Material aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
TW106124542A 2017-07-21 2017-07-21 具非對稱結構的發光裝置、包含該發光裝置之背光模組及該發光裝置之製造方法 TWI644056B (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW106124542A TWI644056B (zh) 2017-07-21 2017-07-21 具非對稱結構的發光裝置、包含該發光裝置之背光模組及該發光裝置之製造方法
EP18184426.7A EP3454386B1 (en) 2017-07-21 2018-07-19 Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same
US16/040,492 US10749086B2 (en) 2017-07-21 2018-07-19 Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same
KR1020180084023A KR102129002B1 (ko) 2017-07-21 2018-07-19 비대칭 형상화된 발광 디바이스, 이를 사용하는 백라이트 모듈 및 이를 제조하기 위한 방법
JP2018136401A JP6732848B2 (ja) 2017-07-21 2018-07-20 非対称な形状の発光装置、当該発光装置を用いたバックライトモジュール、当該発光装置の製造方法
US16/921,748 US11081631B2 (en) 2017-07-21 2020-07-06 Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106124542A TWI644056B (zh) 2017-07-21 2017-07-21 具非對稱結構的發光裝置、包含該發光裝置之背光模組及該發光裝置之製造方法

Publications (2)

Publication Number Publication Date
TWI644056B true TWI644056B (zh) 2018-12-11
TW201908652A TW201908652A (zh) 2019-03-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106124542A TWI644056B (zh) 2017-07-21 2017-07-21 具非對稱結構的發光裝置、包含該發光裝置之背光模組及該發光裝置之製造方法

Country Status (3)

Country Link
JP (1) JP6732848B2 (ko)
KR (1) KR102129002B1 (ko)
TW (1) TWI644056B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676768B (zh) * 2018-12-05 2019-11-11 大陸商光寶光電（常州）有限公司 發光單元
US11309466B2 (en) 2018-12-05 2022-04-19 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting unit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102325808B1 (ko) * 2019-07-17 2021-11-12 주식회사 에스엘바이오닉스 반도체 발광소자 및 이의 제조방법
JP7066964B2 (ja) * 2020-01-31 2022-05-16 日亜化学工業株式会社 面状光源
CN116598410A (zh) * 2023-06-29 2023-08-15 惠州市弘正光电有限公司 Led光源、led显示屏及制备工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7441938B2 (en) * 2006-01-18 2008-10-28 Mitsubishi Electric Corporation Planar light source device
US8061884B2 (en) * 2006-08-25 2011-11-22 Philips Lumileds Lighting Company, Llc Backlight using LED parallel to light guide surface
TW201305685A (zh) * 2011-07-18 2013-02-01 Ｌｇ伊諾特股份有限公司 光學構件及具有其之顯示裝置
TW201329577A (zh) * 2011-09-26 2013-07-16 Toshiba Kk 液晶顯示裝置用背光
JP2017092043A (ja) * 2017-02-09 2017-05-25 サターン ライセンシング エルエルシーＳａｔｕｒｎ Ｌｉｃｅｎｓｉｎｇ ＬＬＣ 表示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2221885A4 (en) * 2007-11-19 2013-09-25 Panasonic Corp SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
KR20130007036A (ko) * 2011-06-28 2013-01-18 (주)세미머티리얼즈 발광소자 패키지 및 그 제조 방법
JP5860289B2 (ja) * 2012-01-05 2016-02-16 シチズン電子株式会社 Ｌｅｄ装置の製造方法
JP5995695B2 (ja) * 2012-12-03 2016-09-21 シチズンホールディングス株式会社 Ｌｅｄ装置の製造方法
JP6153327B2 (ja) * 2013-01-22 2017-06-28 シチズン電子株式会社 Ｌｅｄモジュール
KR20140133765A (ko) * 2013-05-09 2014-11-20 서울반도체 주식회사 광원 모듈 및 이를 구비한 백라이트 유닛
KR20150044307A (ko) * 2013-10-16 2015-04-24 주식회사 루멘스 측면 발광형 발광 소자 패키지와, 백라이트 유닛 및 측면 발광형 발광 소자 패키지의 제작 방법
JP6438648B2 (ja) * 2013-11-15 2018-12-19 日亜化学工業株式会社 半導体発光装置およびその製造方法
KR101691818B1 (ko) * 2014-06-19 2017-01-03 삼성디스플레이 주식회사 광원모듈 및 이를 포함하는 백라이트 유닛
KR102398384B1 (ko) * 2015-06-29 2022-05-16 엘지디스플레이 주식회사 발광 다이오드 패키지와 그의 제조 방법, 이를 이용한 백라이트 유닛과 액정 표시 장치
CN108431972B (zh) * 2015-10-07 2022-02-11 亮锐控股有限公司 具有可变数目的发射表面的倒装芯片smt led
KR102464320B1 (ko) * 2015-10-26 2022-11-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7441938B2 (en) * 2006-01-18 2008-10-28 Mitsubishi Electric Corporation Planar light source device
US8061884B2 (en) * 2006-08-25 2011-11-22 Philips Lumileds Lighting Company, Llc Backlight using LED parallel to light guide surface
TW201305685A (zh) * 2011-07-18 2013-02-01 Ｌｇ伊諾特股份有限公司 光學構件及具有其之顯示裝置
TW201329577A (zh) * 2011-09-26 2013-07-16 Toshiba Kk 液晶顯示裝置用背光
JP2017092043A (ja) * 2017-02-09 2017-05-25 サターン ライセンシング エルエルシーＳａｔｕｒｎ Ｌｉｃｅｎｓｉｎｇ ＬＬＣ 表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676768B (zh) * 2018-12-05 2019-11-11 大陸商光寶光電（常州）有限公司 發光單元
US11309466B2 (en) 2018-12-05 2022-04-19 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting unit

Also Published As

Publication number Publication date
KR20200068006A (ko) 2020-06-15
JP2019033251A (ja) 2019-02-28
TW201908652A (zh) 2019-03-01
KR102129002B1 (ko) 2020-07-02
JP6732848B2 (ja) 2020-07-29

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