JP6693947B2 - 埋め込まれたトレース - Google Patents
埋め込まれたトレース Download PDFInfo
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- JP6693947B2 JP6693947B2 JP2017514257A JP2017514257A JP6693947B2 JP 6693947 B2 JP6693947 B2 JP 6693947B2 JP 2017514257 A JP2017514257 A JP 2017514257A JP 2017514257 A JP2017514257 A JP 2017514257A JP 6693947 B2 JP6693947 B2 JP 6693947B2
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- catalytic
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- channels
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- 230000003197 catalytic effect Effects 0.000 claims description 92
- 239000000758 substrate Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 42
- 239000011162 core material Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 239000011888 foil Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000003054 catalyst Substances 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 7
- 238000000608 laser ablation Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 238000001020 plasma etching Methods 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical group O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 150000002940 palladium Chemical class 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims 3
- 230000008021 deposition Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Laser Beam Processing (AREA)
- Chemically Coating (AREA)
Description
本願は、「埋め込まれたトレース」とのタイトルで2014年5月19日に出願された米国特許出願第14/281,631号の一部継続出願である、「埋め込まれたトレース」とのタイトルで2014年6月5日に出願された米国特許出願第14/297,516号に関連し、その利益及び優先権を主張し、これにより参照によって各々の全体が本願に組み込まれる。
11 チャネル
12 PCBトレース
13 触媒性プリプレグ材料
14、15、16 ビア
Claims (18)
- プリント回路基板を形成するための方法であって、
ラミネート基材にトレースチャネルを形成するステップであって、触媒性コア材料が曝露された所以外は前記ラミネート基材が金属メッキを阻止するように、前記ラミネート基材は非触媒性材料で表面を覆われた触媒性コア材料を含み、前記チャネルは前記非触媒性材料を貫いてアブレーションされて前記触媒性コア材料を曝露し、前記触媒性コア材料は樹脂及び触媒粉末に含浸されたガラス布から形成され、前記触媒粉末は、無機充填材の表面で塩パラジウムと接触させることによって生成された無機充填材から形成される、ステップ;
前記トレースチャネル内を金属がメッキし、しかし前記ラミネート基材の表面のアブレーションされていない部分では金属がメッキしないように、前記ラミネート基材を金属バスに浸漬するステップ;及び
前記トレースチャネル内にメッキされた金属が前記ラミネート基材の表面と同一平面であるように、前記ラミネート基材を平坦化するステップ、
を備える、方法。 - 前記金属バスが無電解銅バスである、請求項1に記載の方法。
- 前記トレースチャネルがレーザーアブレーションを用いて形成される、請求項1に記載の方法。
- 前記ラミネート基材の上にレジストを適用するステップ;
前記チャネルの位置を描くために前記レジストを露光及び現像するステップ;及び
前記チャネルを形成するためにプラズマエッチングを実行するステップ、
によって前記トレースチャネルが形成される、請求項1に記載の方法。 - 前記ラミネート基材の上にホイルを適用するステップ;
前記ホイルの上にレジストを適用するステップ;
前記レジストを露光及び現像して、前記チャネルの位置を描く前記ホイルの部分を曝露するステップ;
前記ホイルの曝露された部分をエッチングするステップ;及び
前記チャネルを形成するためにプラズマエッチングを実行するステップ、
によって前記トレースチャネルが形成される、請求項1に記載の方法。 - 前記ラミネート基材上に樹脂リッチな触媒性プリプレグ材料をラミネートするステップ;
ビアを形成するステップ;及び
前記ビア内にトレースを形成することを含む、前記樹脂リッチな触媒性プリプレグ材料の表面に追加的なトレースを形成するステップ、
を追加的に備える、請求項1に記載の方法。 - 前記ラミネート基材にトレースチャネルを形成するステップが、前記ラミネート基材の両側にトレースチャネルを形成するステップを含む、請求項1に記載の方法。
- 前記触媒性コア材料がパラジウム触媒粒子を含む、請求項1に記載の方法。
- 前記触媒性コア材料がエポキシ樹脂のウェル内に分散された触媒粉末を含む、請求項1に記載の方法。
- 前記非触媒性材料がガラス強化プリプレグを備え、それにより、前記ラミネート基材の表面は樹脂リッチであり、チャネルが形成された所以外での無電解メッキを阻止する、請求項1に記載の方法。
- 前記トレースチャネルが以下の一つによって形成される、請求項1に記載の方法:
高圧水切断;
穴あけ;
ルーティング。 - ラミネート基材にトレースチャネルを形成するステップであって、触媒性コア材料が曝露された所以外は前記ラミネート基材が金属メッキを阻止するように、前記ラミネート基材は非触媒性材料で表面を覆われた触媒性コア材料を含み、前記チャネルは前記触媒性コア材料の表面の下をアブレーションし、前記触媒性コア材料は樹脂及び触媒粉末に含浸されたガラス布から形成され、前記触媒粉末は、無機充填材の表面で塩パラジウムと接触させることによって生成された無機充填材から形成される、ステップ;
前記トレースチャネル内に銅トレースを配置するために無電解銅バスプロセスを実行するステップ;及び
前記銅トレースが前記ラミネート基材の表面と同一平面であるように前記ラミネート基材を平坦化するステップ、
を備える、プリント回路基板のトレースを形成するための方法。 - 前記ラミネート基材の上にレジストを適用するステップ;
前記チャネルの位置を描くために前記レジストを露光及び現像するステップ;及び
前記チャネルを形成するためにプラズマエッチングを実行するステップ、
によって前記トレースチャネルが形成される、請求項12に記載の方法。 - 前記ラミネート基材の上にホイルを適用するステップ;
前記ホイルの上にレジストを適用するステップ;
前記チャネルの位置を描く前記ホイルの部分を曝露するために前記レジストを露光及び現像するステップ;
前記ホイルの曝露された部分をエッチングするステップ;及び
前記チャネルを形成するためにプラズマエッチングを実行するステップ
によって前記トレースチャネルが形成される、請求項12に記載の方法。 - 前記トレースチャネルが以下の一つによって形成される、請求項12に記載の方法:
レーザーアブレーション;
高圧水切断;
穴あけ;
ルーティング。 - 樹脂リッチな表面を有する触媒性ラミネート基材であって、前記触媒性ラミネート基材は樹脂及び触媒粉末に含浸されたガラス布から形成され、前記触媒性ラミネート基材は、前記樹脂リッチな表面の下に延在するチャネルが形成された所以外での無電解メッキを阻止し、前記触媒粉末は、金属塩と接触させた無機充填材から形成される、触媒性ラミネート基材;
前記樹脂リッチな表面を除去し、前記樹脂リッチな表面の下の触媒粒子を曝露することによって前記触媒性ラミネート基材内へと形成されたチャネル;
を備え、前記チャネルは、無電解メッキによって形成されたトレースを含有する、プリント回路基板。 - 前記金属塩がパラジウム塩であり、前記無機充填材がカオリンである、請求項16に記載のプリント回路基板。
- 前記トレースが無電解銅析出から形成される、請求項16に記載のプリント回路基板。
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US14/297,516 US9631279B2 (en) | 2014-05-19 | 2014-06-05 | Methods for forming embedded traces |
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KR20170007402A (ko) | 2017-01-18 |
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US9631279B2 (en) | 2017-04-25 |
WO2015178972A1 (en) | 2015-11-26 |
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JP2020074453A (ja) | 2020-05-14 |
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