JP6690709B2 - 搬送システム - Google Patents
搬送システム Download PDFInfo
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- JP6690709B2 JP6690709B2 JP2018524928A JP2018524928A JP6690709B2 JP 6690709 B2 JP6690709 B2 JP 6690709B2 JP 2018524928 A JP2018524928 A JP 2018524928A JP 2018524928 A JP2018524928 A JP 2018524928A JP 6690709 B2 JP6690709 B2 JP 6690709B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0407—Storage devices mechanical using stacker cranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0457—Storage devices mechanical with suspended load carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Description
第1実施形態について説明する。図1は、本実施形態に係る搬送システムを示す図である。図1(A)は、+Z側から見た上面図であり、図1(B)は−Y側から見た側面図である。搬送システム1Aは、例えば、半導体デバイスの製造工場に設置され、処理装置2と物品を保管するストッカ(図示せず)との間、あるいは処理装置2と他の処理装置との間などで物品3(後に図2にも示す)を搬送する。処理装置2は、例えば、露光装置、コータディベロッパ、製膜装置、あるいはエッチング装置などである。処理装置2は、例えばインターベイなどに複数配列される。
第2実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図7は、本実施形態に係る搬送システムを示す図である。搬送システム1Bは、処理装置2のロードポート4と第1軌道11との位置関係、第1バッファ16と第1軌道11との位置関係が第1実施形態と異なる。第1軌道11は、ロードポート4の直上からX方向にずれた位置に敷設されている。第1軌道11は、ロードポート4に対して、第2軌道14と同じ側に配置されている。第1軌道11は、第1バッファ16の直上を通るように敷設されている。第1バッファ16、第2バッファ17は、例えばUTB(アンダートラックバッファ)である。第1バッファ16は、第1軌道11における天井搬送車12の走行を妨げないように、設けられる。第1バッファ16は、図7(B)に示すように、天井搬送車12に対してX方向の外側の部分で天井18に取り付けられているが、床面43に支持されるフレームなどに設けられてもよい。
第3実施形態について説明する。本実施形態において、上述の実施形態と同様の構成については、同じ符号を付してその説明を省略あるいは簡略化する。図8は、本実施形態に係る搬送システムを示す図である。搬送システム1Cは、処理装置2のロードポート4と第1軌道11との位置関係、第1バッファ16とクレーン15との位置関係が第1実施形態、第2実施形態と異なる。第1軌道11は、ロードポート4の直上からX方向にずれた位置に敷設されている。第1軌道11は、ロードポート4に対して、第2軌道14と反対側に配置されている。第1軌道11は、処理装置2の上方に、第1軌道11上の天井搬送車12が横出し機構28によってロードポート4と物品3の受け渡しが可能なように、敷設されている。第1バッファ16は、例えばUTB(アンダートラックバッファ)であり、第1軌道11の直下に配置されている。このような、搬送システム1Cは、処理装置2の上方のスペースを利用するので、X方向において省スペースにすることができる。なお、搬送システム1Cは、天井搬送車12が横出し機構28を用いて物品3の受け渡しが可能なSTBを備えてもよい。
2・・・処理装置
3・・・物品
4・・・ロードポート
11・・・第1軌道
12・・・天井搬送車
13・・・収納棚
14・・・第2軌道
15・・・クレーン
16・・・第1バッファ
17・・・第2バッファ
Claims (7)
- 第1軌道を走行し、処理装置のロードポートと物品の受け渡しが可能な天井搬送車と、
前記物品を収納する複数の棚が鉛直方向に配列された収納棚と、
前記第1軌道と平行な第2軌道を走行し、前記ロードポート、及び前記収納棚のそれぞれと前記物品の受け渡しが可能なクレーンと、
前記ロードポートと前記物品の受け渡しを行う位置で走行停止した前記クレーンが前記物品の受け渡しが可能な位置に配置される第1バッファと、を備える搬送システム。 - 前記天井搬送車は、前記物品を水平方向に移動させる横出し機構を備え、
前記第1バッファは、前記天井搬送車が前記横出し機構を用いて前記物品の受け渡しが可能な位置に配置される、請求項1に記載の搬送システム。 - 前記第1バッファは、前記ロードポートと前記物品の受け渡しを行う位置で走行停止した前記天井搬送車が前記横出し機構を用いて前記物品の受け渡しが可能な位置に配置される、請求項2に記載の搬送システム。
- 前記第1バッファに隣接し、前記クレーンが前記物品の受け渡しが可能な第2バッファを備える、請求項1から請求項3のいずれか一項に記載の搬送システム。
- 前記天井搬送車は、前記物品を水平方向に移動させる横出し機構を備え、
前記第2バッファは、前記天井搬送車が前記横出し機構を用いて前記物品の受け渡しが可能な位置に配置される、請求項4に記載の搬送システム。 - 前記収納棚は、前記処理装置に隣接して配置され、
前記天井搬送車は、前記収納棚の複数の棚のうち最上段の棚と前記物品の受け渡しが可能である、請求項1から請求項5のいずれか一項に記載の搬送システム。 - 前記第1軌道は、前記ロードポートの直上に設けられる、請求項1から請求項6のいずれか一項に記載の搬送システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016126180 | 2016-06-27 | ||
JP2016126180 | 2016-06-27 | ||
PCT/JP2017/017242 WO2018003287A1 (ja) | 2016-06-27 | 2017-05-02 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
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JPWO2018003287A1 JPWO2018003287A1 (ja) | 2019-04-04 |
JP6690709B2 true JP6690709B2 (ja) | 2020-04-28 |
Family
ID=60786034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018524928A Active JP6690709B2 (ja) | 2016-06-27 | 2017-05-02 | 搬送システム |
Country Status (8)
Country | Link |
---|---|
US (1) | US10699928B2 (ja) |
EP (1) | EP3476772B1 (ja) |
JP (1) | JP6690709B2 (ja) |
KR (2) | KR20190009371A (ja) |
CN (1) | CN109415163B (ja) |
SG (1) | SG11201811443PA (ja) |
TW (1) | TWI722208B (ja) |
WO (1) | WO2018003287A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107720066A (zh) * | 2017-09-30 | 2018-02-23 | 山东兰剑物流科技股份有限公司 | 蜂巢系统及料箱存储拣选系统 |
EP3770082B1 (en) * | 2018-03-22 | 2023-09-06 | Murata Machinery, Ltd. | Stocker system |
CN108792472A (zh) * | 2018-06-27 | 2018-11-13 | 上海新创达智能科技有限公司 | 一种新型的架空运输系统 |
CN114269668B (zh) * | 2019-08-29 | 2023-04-18 | 村田机械株式会社 | 行驶车系统 |
JP7458760B2 (ja) | 2019-12-03 | 2024-04-01 | 株式会社ディスコ | 加工装置 |
KR20230102113A (ko) | 2021-12-30 | 2023-07-07 | 세메스 주식회사 | 이송 장치 |
KR20230157595A (ko) | 2022-05-10 | 2023-11-17 | 세메스 주식회사 | 다단식 용기보관장치 및 기판이송설비 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005150129A (ja) * | 2003-11-11 | 2005-06-09 | Asyst Shinko Inc | 移載装置及び移載システム |
JP4539124B2 (ja) * | 2004-03-04 | 2010-09-08 | 凸版印刷株式会社 | パターン形成方法及びパターン形成装置 |
JP4296601B2 (ja) * | 2005-01-20 | 2009-07-15 | 村田機械株式会社 | 搬送台車システム |
JP4221603B2 (ja) * | 2005-03-31 | 2009-02-12 | 村田機械株式会社 | 天井走行車システム |
JP2006298566A (ja) * | 2005-04-20 | 2006-11-02 | Murata Mach Ltd | 天井走行車とそのシステム |
JP4666213B2 (ja) | 2005-07-05 | 2011-04-06 | 株式会社ダイフク | 物品収納設備 |
JP2007331906A (ja) * | 2006-06-16 | 2007-12-27 | Murata Mach Ltd | 天井走行車システム |
US7762573B2 (en) | 2006-07-07 | 2010-07-27 | The Burton Corporation | Footbed for gliding board binding |
JP2008172062A (ja) * | 2007-01-12 | 2008-07-24 | Murata Mach Ltd | 物品供給装置 |
US20080240892A1 (en) * | 2007-03-28 | 2008-10-02 | International Business Machines Corporation | Storage buffer device for automated material handling systems |
JP5234328B2 (ja) * | 2008-04-11 | 2013-07-10 | 株式会社ダイフク | 物品収納設備 |
JP5282971B2 (ja) | 2009-07-14 | 2013-09-04 | 株式会社ダイフク | 物品保管設備 |
JP5321913B2 (ja) * | 2009-12-07 | 2013-10-23 | 株式会社ダイフク | 物品保管設備 |
JP5318005B2 (ja) * | 2010-03-10 | 2013-10-16 | 株式会社Sokudo | 基板処理装置、ストッカー装置および基板収納容器の搬送方法 |
JP5674041B2 (ja) * | 2011-08-11 | 2015-02-18 | 株式会社ダイフク | 物品搬送設備 |
KR101661633B1 (ko) | 2012-04-05 | 2016-09-30 | 무라다기카이가부시끼가이샤 | 반송 시스템 |
JP2015117073A (ja) * | 2012-04-05 | 2015-06-25 | 村田機械株式会社 | 搬送システム |
JP6252676B2 (ja) * | 2014-06-19 | 2017-12-27 | 村田機械株式会社 | キャリアの一時保管装置及び一時保管方法 |
JP2016126180A (ja) | 2015-01-05 | 2016-07-11 | 株式会社リコー | 画像形成装置、画像形成方法及び画像形成プログラム |
EP3336018B1 (en) * | 2015-08-14 | 2021-12-15 | Murata Machinery, Ltd. | Conveyance system |
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2017
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EP3476772B1 (en) | 2022-04-27 |
JPWO2018003287A1 (ja) | 2019-04-04 |
EP3476772A1 (en) | 2019-05-01 |
TW201810496A (zh) | 2018-03-16 |
EP3476772A4 (en) | 2020-03-04 |
SG11201811443PA (en) | 2019-01-30 |
CN109415163B (zh) | 2020-12-29 |
TWI722208B (zh) | 2021-03-21 |
US10699928B2 (en) | 2020-06-30 |
US20190164795A1 (en) | 2019-05-30 |
WO2018003287A1 (ja) | 2018-01-04 |
KR20200128179A (ko) | 2020-11-11 |
CN109415163A (zh) | 2019-03-01 |
KR20190009371A (ko) | 2019-01-28 |
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