JP6677674B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP6677674B2
JP6677674B2 JP2017099956A JP2017099956A JP6677674B2 JP 6677674 B2 JP6677674 B2 JP 6677674B2 JP 2017099956 A JP2017099956 A JP 2017099956A JP 2017099956 A JP2017099956 A JP 2017099956A JP 6677674 B2 JP6677674 B2 JP 6677674B2
Authority
JP
Japan
Prior art keywords
fpc
wiring member
flexible wiring
housing
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017099956A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018195367A (ja
JP2018195367A5 (https=
Inventor
展大 山本
展大 山本
孝太 徳田
孝太 徳田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Original Assignee
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Electronic Devices and Storage Corp filed Critical Toshiba Corp
Priority to JP2017099956A priority Critical patent/JP6677674B2/ja
Priority to CN201810087313.3A priority patent/CN108962300B/zh
Priority to US15/915,707 priority patent/US10374345B2/en
Publication of JP2018195367A publication Critical patent/JP2018195367A/ja
Priority to US16/451,158 priority patent/US10680368B2/en
Publication of JP2018195367A5 publication Critical patent/JP2018195367A5/ja
Priority to JP2020031622A priority patent/JP6989638B2/ja
Application granted granted Critical
Publication of JP6677674B2 publication Critical patent/JP6677674B2/ja
Priority to US16/859,385 priority patent/US10903595B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B25/00—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus
    • G11B25/04—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus using flat record carriers, e.g. disc, card
    • G11B25/043—Apparatus characterised by the shape of record carrier employed but not specific to the method of recording or reproducing, e.g. dictating apparatus; Combinations of such apparatus using flat record carriers, e.g. disc, card using rotating discs
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
    • G11B33/022—Cases
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
    • G11B33/122—Arrangements for providing electrical connections, e.g. connectors, cables, switches
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1446—Reducing contamination, e.g. by dust, debris
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/78—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2017099956A 2017-05-19 2017-05-19 電子機器 Active JP6677674B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017099956A JP6677674B2 (ja) 2017-05-19 2017-05-19 電子機器
CN201810087313.3A CN108962300B (zh) 2017-05-19 2018-01-30 电子设备
US15/915,707 US10374345B2 (en) 2017-05-19 2018-03-08 Electronic device
US16/451,158 US10680368B2 (en) 2017-05-19 2019-06-25 Electronic device
JP2020031622A JP6989638B2 (ja) 2017-05-19 2020-02-27 ハードディスクドライブ
US16/859,385 US10903595B2 (en) 2017-05-19 2020-04-27 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017099956A JP6677674B2 (ja) 2017-05-19 2017-05-19 電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020031622A Division JP6989638B2 (ja) 2017-05-19 2020-02-27 ハードディスクドライブ

Publications (3)

Publication Number Publication Date
JP2018195367A JP2018195367A (ja) 2018-12-06
JP2018195367A5 JP2018195367A5 (https=) 2019-10-03
JP6677674B2 true JP6677674B2 (ja) 2020-04-08

Family

ID=64272465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017099956A Active JP6677674B2 (ja) 2017-05-19 2017-05-19 電子機器

Country Status (3)

Country Link
US (3) US10374345B2 (https=)
JP (1) JP6677674B2 (https=)
CN (1) CN108962300B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7145707B2 (ja) 2018-09-19 2022-10-03 株式会社東芝 電子機器
US10650864B1 (en) * 2018-11-30 2020-05-12 Seagate Technology Llc Hard disk drive with cover and cover support
JP7224982B2 (ja) * 2019-03-15 2023-02-20 株式会社東芝 磁気ディスク装置
JP7199397B2 (ja) 2020-03-18 2023-01-05 株式会社東芝 ディスク装置
CN111123292B (zh) * 2020-03-31 2020-06-26 深圳市汇顶科技股份有限公司 飞行时间发射模组、飞行时间检测装置和电子设备
JP7330143B2 (ja) 2020-06-25 2023-08-21 株式会社東芝 ディスク装置
JP7286594B2 (ja) 2020-07-30 2023-06-05 株式会社東芝 ディスク装置
JP7487132B2 (ja) * 2021-03-18 2024-05-20 株式会社東芝 ディスク装置及び電子機器
CN115938408B (zh) 2021-08-26 2025-06-03 株式会社东芝 盘装置
JP7731826B6 (ja) 2022-03-07 2025-09-19 株式会社東芝 電子機器及び電子部品
JP2024135584A (ja) 2023-03-23 2024-10-04 株式会社東芝 ストレージ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0656714B2 (ja) * 1991-09-12 1994-07-27 インターナショナル・ビジネス・マシーンズ・コーポレイション デイスク記憶装置
JP2744889B2 (ja) 1994-09-29 1998-04-28 インターナショナル・ビジネス・マシーンズ・コーポレイション 磁気ディスク装置のフレキシブルケーブル構造
US6168459B1 (en) * 1998-06-15 2001-01-02 Seagate Technology Llc Flex support and seal apparatus for a disc drive
JP2000331471A (ja) * 1999-05-18 2000-11-30 Fujitsu Ltd ディスク装置
CN1215630C (zh) * 2001-01-25 2005-08-17 株式会社三协精机制作所 电动机
JP4251129B2 (ja) * 2004-10-25 2009-04-08 セイコーエプソン株式会社 実装構造体、電気光学装置及び電子機器
JP4384606B2 (ja) * 2005-01-18 2009-12-16 株式会社日立メディアエレクトロニクス 光ディスクドライブ装置
WO2008111176A1 (ja) * 2007-03-13 2008-09-18 Fujitsu Limited 記憶媒体駆動装置およびプリント基板ユニット
JP2008287809A (ja) * 2007-05-18 2008-11-27 Fujitsu Ltd 記憶装置およびフレキシブルプリント基板ユニット
JP2009176904A (ja) 2008-01-24 2009-08-06 Funai Electric Co Ltd フレキシブルプリント配線板
JP2010021173A (ja) 2008-07-08 2010-01-28 Sumitomo Electric Ind Ltd 配線体，接続構造および電子機器
JP4880018B2 (ja) * 2009-09-28 2012-02-22 ソニー・エリクソン・モバイルコミュニケーションズ株式会社 携帯端末装置および筐体防水構造
JP2012246376A (ja) 2011-05-26 2012-12-13 Sumitomo Electric Printed Circuit Inc 粘着シート、該粘着シートを備えるプリント配線板及び該プリント配線板の製造方法
JP2013078249A (ja) * 2011-09-30 2013-04-25 Alphana Technology Co Ltd 回転機器
US9196303B2 (en) * 2014-03-06 2015-11-24 HGST Netherlands, B.V. Feedthrough connector for hermetically sealed electronic devices
US9721619B2 (en) 2015-12-09 2017-08-01 Western Digital Technologies, Inc. Hermetic sealing of hard disk drive using laminated film seal
US9704539B2 (en) 2015-12-09 2017-07-11 Western Digital Technologies, Inc. Hermetic sealing of hard disk drive using laminated film seal
US10741223B2 (en) * 2016-06-06 2020-08-11 Western Digital Technologies, Inc. Sealed bulkhead electrical feed-through positioning control

Also Published As

Publication number Publication date
US20180337477A1 (en) 2018-11-22
US20190312369A1 (en) 2019-10-10
CN108962300A (zh) 2018-12-07
US10374345B2 (en) 2019-08-06
JP2018195367A (ja) 2018-12-06
US10680368B2 (en) 2020-06-09
US10903595B2 (en) 2021-01-26
US20200259283A1 (en) 2020-08-13
CN108962300B (zh) 2020-11-03

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