WO2008111176A1 - 記憶媒体駆動装置およびプリント基板ユニット - Google Patents
記憶媒体駆動装置およびプリント基板ユニット Download PDFInfo
- Publication number
- WO2008111176A1 WO2008111176A1 PCT/JP2007/054971 JP2007054971W WO2008111176A1 WO 2008111176 A1 WO2008111176 A1 WO 2008111176A1 JP 2007054971 W JP2007054971 W JP 2007054971W WO 2008111176 A1 WO2008111176 A1 WO 2008111176A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- opening
- piece
- printed board
- storage medium
- board unit
- Prior art date
Links
- 238000006073 displacement reaction Methods 0.000 abstract 3
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4846—Constructional details of the electrical connection between arm and support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Moving Of Heads (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
フレキシブルプリント基板(32)の取り付けにあたって、ねじ(35)は第1開口(61)および第2開口(62)を通ってベース(13)にねじ込まれる。第1開口(61)は第2開口(62)の第2径よりも大きい第1径を有することから、上側片(42)に対して下側片(41)の相対変位は許容される。コネクタ(53)が開口(54)内で規定の位置からずれて配置されても、コネクタ(53)のずれは下側片(41)の変位で吸収される。しかも、下側片(41)の相対変位にも拘わらず、ねじ(35)および第2開口(62)の働きで上側片(42)はベース(13)の規定の位置に正確に固定される。上側片(42)に接続される可動片(33)のテンションは設計通りに設定される。可動片(33)の突っ張りや弛みは阻止される。可動片(33)に連結されるキャリッジブロック(22)は設計通りに回転することができる。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009503817A JPWO2008111176A1 (ja) | 2007-03-13 | 2007-03-13 | 記憶媒体駆動装置およびプリント基板ユニット |
PCT/JP2007/054971 WO2008111176A1 (ja) | 2007-03-13 | 2007-03-13 | 記憶媒体駆動装置およびプリント基板ユニット |
US12/500,858 US20090268417A1 (en) | 2007-03-13 | 2009-07-10 | Storage apparatus and printed wiring board unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/054971 WO2008111176A1 (ja) | 2007-03-13 | 2007-03-13 | 記憶媒体駆動装置およびプリント基板ユニット |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/500,858 Continuation US20090268417A1 (en) | 2007-03-13 | 2009-07-10 | Storage apparatus and printed wiring board unit |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008111176A1 true WO2008111176A1 (ja) | 2008-09-18 |
Family
ID=39759127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/054971 WO2008111176A1 (ja) | 2007-03-13 | 2007-03-13 | 記憶媒体駆動装置およびプリント基板ユニット |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090268417A1 (ja) |
JP (1) | JPWO2008111176A1 (ja) |
WO (1) | WO2008111176A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8526141B2 (en) | 2009-12-14 | 2013-09-03 | HGST Netherlands B.V. | Magnetic disk device and guide member for guiding a flexible wiring board |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6677674B2 (ja) | 2017-05-19 | 2020-04-08 | 株式会社東芝 | 電子機器 |
JPWO2021002387A1 (ja) * | 2019-07-04 | 2021-01-07 | ||
US11074943B2 (en) * | 2019-11-11 | 2021-07-27 | Seagate Technology Llc | Methods and devices for alleviating thermal boil off in immersion-cooled electronic devices |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000252650A (ja) * | 1999-02-25 | 2000-09-14 | Fujitsu Ltd | プリント配線基板ユニットおよび基板用矯正部品 |
JP2004095055A (ja) * | 2002-08-30 | 2004-03-25 | Toshiba Corp | フレキシブル基板アッセンブリおよびディスク装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2100157A1 (en) * | 1991-11-22 | 1993-05-23 | Yoshifumi Mizoshita | Disk drive |
JP2744889B2 (ja) * | 1994-09-29 | 1998-04-28 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 磁気ディスク装置のフレキシブルケーブル構造 |
US5923501A (en) * | 1995-11-02 | 1999-07-13 | Fujitsu Limited | Carriage structure for disk device |
JP2006049751A (ja) * | 2004-08-09 | 2006-02-16 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ディスク装置と、その配線接続構造及び端子構造 |
US20070169136A1 (en) * | 2005-12-08 | 2007-07-19 | Hiromichi Hiramatsu | Optical disc drive apparatus, flexible printed circuit board joint structure, and joint structure of flexible printed circuit boards for optical pickup |
JP2008287809A (ja) * | 2007-05-18 | 2008-11-27 | Fujitsu Ltd | 記憶装置およびフレキシブルプリント基板ユニット |
JP2009238271A (ja) * | 2008-03-26 | 2009-10-15 | Fujitsu Ltd | ディスク装置 |
-
2007
- 2007-03-13 JP JP2009503817A patent/JPWO2008111176A1/ja not_active Withdrawn
- 2007-03-13 WO PCT/JP2007/054971 patent/WO2008111176A1/ja active Application Filing
-
2009
- 2009-07-10 US US12/500,858 patent/US20090268417A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000252650A (ja) * | 1999-02-25 | 2000-09-14 | Fujitsu Ltd | プリント配線基板ユニットおよび基板用矯正部品 |
JP2004095055A (ja) * | 2002-08-30 | 2004-03-25 | Toshiba Corp | フレキシブル基板アッセンブリおよびディスク装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8526141B2 (en) | 2009-12-14 | 2013-09-03 | HGST Netherlands B.V. | Magnetic disk device and guide member for guiding a flexible wiring board |
Also Published As
Publication number | Publication date |
---|---|
US20090268417A1 (en) | 2009-10-29 |
JPWO2008111176A1 (ja) | 2010-06-24 |
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