JP6676748B2 - ワイヤボンディング装置、ワイヤボンディング装置用回路並びに半導体装置の製造方法 - Google Patents
ワイヤボンディング装置、ワイヤボンディング装置用回路並びに半導体装置の製造方法 Download PDFInfo
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- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
Claims (5)
- ワイヤボンディング装置であって、
スプールと、
前記スプールから繰り出されたワイヤを把持するクランパと、
放電によって前記ワイヤの先端にフリーエアボールを形成するトーチ電極と、
前記トーチ電極に電力を供給する高圧電源回路と、
前記ワイヤとデバイスまたは基板との不着検出を行う不着検出回路と、
前記スプールと前記高圧電源回路または前記不着検出回路との接続を切換える第1切換えスイッチと、
前記クランパと前記第1切換えスイッチのスプール側との接続をオン/オフするリレーと、
前記第1切換えスイッチを高圧電源回路側とするとともに前記リレーをオフとして前記放電を発生させ、前記第1切換えスイッチを不着検出回路側とするとともに前記リレーをオンとして前記不着検出をさせる制御部と、を備えるワイヤボンディング装置。 - 請求項1に記載のワイヤボンディング装置であって、
前記第1切換えスイッチの前記スプール側と前記スプールとの間に配置され、前記第1切換えスイッチの前記スプール側と接地線との接続を切換える第2切換えスイッチと、を備え、
前記制御部は、前記第1切換えスイッチを前記不着検出回路側とするとともに前記リレーをオンとし、且つ、前記クランパを閉とするとともに前記第2切換えスイッチを接地線側として前記スプールの導通確認を行うワイヤボンディング装置。 - 請求項1に記載のワイヤボンディング装置であって、
前記第1切換えスイッチの前記スプール側と前記スプールとの間に配置され、前記第1切換えスイッチの前記スプール側と接地線との接続を切換える第2切換えスイッチと、
前記スプールと前記クランパとの間に配置され、前記ワイヤの少なくとも一部が接触する貫通孔を有するワイヤガイドと、
前記ワイヤガイドと前記第1切換えスイッチの前記スプール側とを接続する接続線と、を備え、
前記制御部は、前記第1切換えスイッチを前記不着検出回路側とするとともに前記リレーをオンとし、且つ、前記第2切換えスイッチを接地線側として前記スプールの導通確認を行うワイヤボンディング装置。 - ワイヤボンディング装置用回路であって、
放電によってワイヤの先端にフリーエアボールを形成するトーチ電極に電力を供給する高圧電源回路と、
前記ワイヤとデバイスまたは基板との不着検出を行う不着検出回路と、
前記ワイヤを繰り出すスプールと前記高圧電源回路または前記不着検出回路との接続を切換える第1切換えスイッチと、
前記スプールから繰り出された前記ワイヤを把持するクランパと前記第1切換えスイッチのスプール側との接続をオン/オフするリレーと、
前記第1切換えスイッチを高圧電源回路側とするとともに前記リレーをオフとして前記放電を発生させるとともに、前記第1切換えスイッチを不着検出回路側とするとともに前記リレーをオンとして前記不着検出を行う制御部と、を備えるワイヤボンディング装置用回路。 - 半導体装置の製造方法であって、
スプールと、前記スプールから繰り出されたワイヤを把持するクランパと、放電によって前記ワイヤの先端にフリーエアボールを形成するトーチ電極と、前記トーチ電極に電力を供給する高圧電源回路と、前記ワイヤとデバイスまたは基板との不着検出を行う不着検出回路と、前記スプールと前記高圧電源回路または前記不着検出回路との接続を切換える第1切換えスイッチと、前記クランパと前記第1切換えスイッチのスプール側との接続をオン/オフするリレーとを備えるワイヤボンディング装置を準備する工程と、
前記第1切換えスイッチを高圧電源回路側とするとともに前記リレーをオフとして前記高圧電源回路が前記トーチ電極に電力を供給してフリーエアボールを形成する工程と、
前記フリーエアボールが形成された前記ワイヤをデバイス又は基板にボンディングする工程と、
前記第1切換えスイッチを不着検出回路側とするとともに前記リレーをオンとして、前記ワイヤと前記デバイス又は基板との前記不着検出をする工程とを含む、
半導体装置の製造方法。
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JP2016061147 | 2016-03-25 | ||
JP2016061147 | 2016-03-25 | ||
PCT/JP2017/012080 WO2017164386A1 (ja) | 2016-03-25 | 2017-03-24 | ワイヤボンディング装置、ワイヤボンディング装置用回路並びに半導体装置の製造方法 |
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JP6676748B2 true JP6676748B2 (ja) | 2020-04-08 |
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US (1) | US10964661B2 (ja) |
JP (1) | JP6676748B2 (ja) |
KR (1) | KR102069565B1 (ja) |
CN (1) | CN109155260B (ja) |
SG (1) | SG11201811528TA (ja) |
TW (1) | TWI639202B (ja) |
WO (1) | WO2017164386A1 (ja) |
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JP3041812B2 (ja) * | 1993-09-21 | 2000-05-15 | 株式会社新川 | ワイヤボンデイング装置 |
JP3041812U (ja) | 1997-01-16 | 1997-10-03 | 義一 花本 | 開閉式拡大レンズ付き腕時計 |
JPH11243119A (ja) * | 1998-02-26 | 1999-09-07 | Power:Kk | ワイヤボンディング方法および装置 |
JP2000306940A (ja) * | 1999-04-21 | 2000-11-02 | Shinkawa Ltd | バンプボンディングにおける不着検査方法及び装置 |
JP3908640B2 (ja) * | 2002-09-26 | 2007-04-25 | 株式会社新川 | ワイヤボンディング方法及び装置 |
JP3786281B2 (ja) * | 2004-11-05 | 2006-06-14 | 株式会社カイジョー | ワイヤボンディング装置 |
JP4397326B2 (ja) * | 2004-12-27 | 2010-01-13 | 株式会社新川 | ボンディング装置 |
JP4547330B2 (ja) * | 2005-12-28 | 2010-09-22 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
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- 2017-03-24 TW TW106109850A patent/TWI639202B/zh active
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CN109155260A (zh) | 2019-01-04 |
US10964661B2 (en) | 2021-03-30 |
SG11201811528TA (en) | 2019-01-30 |
TWI639202B (zh) | 2018-10-21 |
KR20180125557A (ko) | 2018-11-23 |
CN109155260B (zh) | 2021-10-29 |
WO2017164386A1 (ja) | 2017-09-28 |
US20200294957A1 (en) | 2020-09-17 |
KR102069565B1 (ko) | 2020-01-23 |
TW201801207A (zh) | 2018-01-01 |
JPWO2017164386A1 (ja) | 2019-01-31 |
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