JP6672207B2 - 基板の表面を研磨する装置および方法 - Google Patents

基板の表面を研磨する装置および方法 Download PDF

Info

Publication number
JP6672207B2
JP6672207B2 JP2017051673A JP2017051673A JP6672207B2 JP 6672207 B2 JP6672207 B2 JP 6672207B2 JP 2017051673 A JP2017051673 A JP 2017051673A JP 2017051673 A JP2017051673 A JP 2017051673A JP 6672207 B2 JP6672207 B2 JP 6672207B2
Authority
JP
Japan
Prior art keywords
polishing
substrate
axis
wafer
rollers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017051673A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018015890A (ja
JP2018015890A5 (zh
Inventor
遊 石井
遊 石井
正行 中西
正行 中西
圭介 内山
圭介 内山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US15/647,829 priority Critical patent/US10376929B2/en
Priority to CN201710570004.7A priority patent/CN107627201B/zh
Priority to KR1020170088951A priority patent/KR102074269B1/ko
Priority to TW106123468A priority patent/TWI703644B/zh
Priority to EP17181177.1A priority patent/EP3272459B1/en
Publication of JP2018015890A publication Critical patent/JP2018015890A/ja
Publication of JP2018015890A5 publication Critical patent/JP2018015890A5/ja
Application granted granted Critical
Publication of JP6672207B2 publication Critical patent/JP6672207B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2017051673A 2016-07-14 2017-03-16 基板の表面を研磨する装置および方法 Active JP6672207B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US15/647,829 US10376929B2 (en) 2016-07-14 2017-07-12 Apparatus and method for polishing a surface of a substrate
CN201710570004.7A CN107627201B (zh) 2016-07-14 2017-07-13 研磨基板的表面的装置和方法
KR1020170088951A KR102074269B1 (ko) 2016-07-14 2017-07-13 기판의 표면을 연마하는 장치 및 방법
TW106123468A TWI703644B (zh) 2016-07-14 2017-07-13 研磨基板表面的裝置及方法
EP17181177.1A EP3272459B1 (en) 2016-07-14 2017-07-13 Apparatus and method for polishing a surface of a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016139777 2016-07-14
JP2016139777 2016-07-14

Publications (3)

Publication Number Publication Date
JP2018015890A JP2018015890A (ja) 2018-02-01
JP2018015890A5 JP2018015890A5 (zh) 2019-07-11
JP6672207B2 true JP6672207B2 (ja) 2020-03-25

Family

ID=61076625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017051673A Active JP6672207B2 (ja) 2016-07-14 2017-03-16 基板の表面を研磨する装置および方法

Country Status (3)

Country Link
JP (1) JP6672207B2 (zh)
CN (1) CN107627201B (zh)
TW (1) TWI703644B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020031181A (ja) 2018-08-24 2020-02-27 株式会社荏原製作所 基板処理装置、基板処理方法、及び基板処理装置を制御する方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
CN109530845B (zh) * 2018-10-29 2021-03-26 陕西航空电气有限责任公司 一种去除整流管芯片表面焊料氧化层的工具
CN109333337A (zh) * 2018-11-19 2019-02-15 深圳市华星光电技术有限公司 研磨装置及研磨方法
JP7149344B2 (ja) * 2018-12-20 2022-10-06 東京エレクトロン株式会社 基板処理装置
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR20220090581A (ko) * 2019-11-15 2022-06-29 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
JP7442314B2 (ja) * 2019-12-24 2024-03-04 東京エレクトロン株式会社 基板処理装置、および基板処理方法
CN111451869A (zh) * 2020-05-08 2020-07-28 吴学彪 一种卡芯片加工设备
CN115723035A (zh) * 2022-09-08 2023-03-03 西安奕斯伟材料科技有限公司 用于监控研磨装置的加工状态的系统、方法及双面研磨装置
CN116872067B (zh) * 2023-09-07 2023-12-15 西安鸿磊科技有限公司 一种用于铝合金模板加工用表面处理设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3447869B2 (ja) * 1995-09-20 2003-09-16 株式会社荏原製作所 洗浄方法及び装置
JP2000108024A (ja) * 1998-10-02 2000-04-18 Toshiba Mach Co Ltd Ｃｍｐ研磨装置
US6692339B1 (en) * 1999-11-05 2004-02-17 Strasbaugh Combined chemical mechanical planarization and cleaning
US6461224B1 (en) * 2000-03-31 2002-10-08 Lam Research Corporation Off-diameter method for preparing semiconductor wafers
KR20070069780A (ko) * 2005-12-28 2007-07-03 동부일렉트로닉스 주식회사 반도체용 연마장치
JP5663295B2 (ja) * 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材
US20140024299A1 (en) * 2012-07-19 2014-01-23 Wen-Chiang Tu Polishing Pad and Multi-Head Polishing System
JP6100002B2 (ja) * 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
JP6113624B2 (ja) * 2013-10-11 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
CN107627201A (zh) 2018-01-26
JP2018015890A (ja) 2018-02-01
CN107627201B (zh) 2020-07-03
TWI703644B (zh) 2020-09-01
TW201812928A (zh) 2018-04-01

Similar Documents

Publication Publication Date Title
JP6672207B2 (ja) 基板の表面を研磨する装置および方法
EP1719161B1 (en) Polishing apparatus
JP6882017B2 (ja) 研磨方法、研磨装置、および基板処理システム
KR102074269B1 (ko) 기판의 표면을 연마하는 장치 및 방법
JP2008155292A (ja) 基板の加工方法および加工装置
CN104282533A (zh) 研磨方法及研磨装置
US20220130662A1 (en) Substrate processing device, substrate processing method, and storage medium storing program for causing computer to execute method for controlling substrate processing device
JP6794275B2 (ja) 研磨方法
TW201335983A (zh) 處理基材之系統及方法
TW201922413A (zh) 基板處理裝置及基板處理方法
JP6849506B2 (ja) 基板保持装置、基板処理装置、基板処理方法、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
TWI756620B (zh) 研磨機構，研磨頭，研磨裝置，及研磨方法
JP2011143516A (ja) 加工装置
JP6887016B2 (ja) ゲッタリング層形成装置、ゲッタリング層形成方法及びコンピュータ記憶媒体
JP2017208460A (ja) 洗浄装置及び洗浄方法
JP6074154B2 (ja) 加工装置
KR102628175B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2010005717A (ja) 加工装置
JP6920141B2 (ja) 研磨装置
JP6666214B2 (ja) 基板の表面を研磨する装置および方法、プログラムを記録したコンピュータ読み取り可能な記録媒体
JP2017147334A (ja) 基板の裏面を洗浄する装置および方法
JP2003326459A (ja) 研磨方法
JP7308265B2 (ja) 分離装置及び分離方法
JP6873782B2 (ja) 研磨装置、研磨方法、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
JP2018022740A (ja) 基板の表面を研磨する装置および方法、プログラムを記録したコンピュータ読み取り可能な記録媒体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190604

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190604

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20190604

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20190621

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190827

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20191024

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200212

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200304

R150 Certificate of patent or registration of utility model

Ref document number: 6672207

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250