JP6671551B1 - 多層プリント基板 - Google Patents

多層プリント基板 Download PDF

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Publication number
JP6671551B1
JP6671551B1 JP2019532158A JP2019532158A JP6671551B1 JP 6671551 B1 JP6671551 B1 JP 6671551B1 JP 2019532158 A JP2019532158 A JP 2019532158A JP 2019532158 A JP2019532158 A JP 2019532158A JP 6671551 B1 JP6671551 B1 JP 6671551B1
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JP
Japan
Prior art keywords
conductor
power supply
wiring layer
layer
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2019532158A
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English (en)
Japanese (ja)
Other versions
JPWO2020165953A1 (ja
Inventor
玲仁 小林
玲仁 小林
大和田　哲
哲 大和田
安泰 関本
安泰 関本
尚俊 杉山
尚俊 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of JP6671551B1 publication Critical patent/JP6671551B1/ja
Publication of JPWO2020165953A1 publication Critical patent/JPWO2020165953A1/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2019532158A 2019-02-12 2019-02-12 多層プリント基板 Expired - Fee Related JP6671551B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/004879 WO2020165953A1 (ja) 2019-02-12 2019-02-12 多層プリント基板

Publications (2)

Publication Number Publication Date
JP6671551B1 true JP6671551B1 (ja) 2020-03-25
JPWO2020165953A1 JPWO2020165953A1 (ja) 2021-02-18

Family

ID=70000817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019532158A Expired - Fee Related JP6671551B1 (ja) 2019-02-12 2019-02-12 多層プリント基板

Country Status (3)

Country Link
JP (1) JP6671551B1 (zh)
TW (1) TW202031106A (zh)
WO (1) WO2020165953A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210183758A1 (en) * 2019-12-16 2021-06-17 Intel Corporation Conductive polygon power and ground interconnects for integrated-circuit packages
US11538793B2 (en) 2020-10-27 2022-12-27 Mediatek Singapore Pte. Ltd. Semiconductor structure
US20220223512A1 (en) * 2021-01-08 2022-07-14 Mediatek Inc. Semiconductor package structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4395989B2 (ja) * 2000-05-12 2010-01-13 パナソニック株式会社 プリント配線板
JP2003297963A (ja) * 2002-04-03 2003-10-17 Matsushita Electric Ind Co Ltd 多層回路基板および電子機器
JP4273098B2 (ja) * 2004-09-07 2009-06-03 キヤノン株式会社 多層プリント回路板
JP4047351B2 (ja) * 2005-12-12 2008-02-13 キヤノン株式会社 多層プリント回路板
JP6611555B2 (ja) * 2015-10-16 2019-11-27 キヤノン株式会社 プリント回路板及び電子機器

Also Published As

Publication number Publication date
JPWO2020165953A1 (ja) 2021-02-18
TW202031106A (zh) 2020-08-16
WO2020165953A1 (ja) 2020-08-20

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