JP6657535B2 - スパッタ成膜装置およびスパッタ成膜方法 - Google Patents
スパッタ成膜装置およびスパッタ成膜方法 Download PDFInfo
- Publication number
- JP6657535B2 JP6657535B2 JP2017249664A JP2017249664A JP6657535B2 JP 6657535 B2 JP6657535 B2 JP 6657535B2 JP 2017249664 A JP2017249664 A JP 2017249664A JP 2017249664 A JP2017249664 A JP 2017249664A JP 6657535 B2 JP6657535 B2 JP 6657535B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- substrate
- waveform portion
- unit
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 65
- 238000004544 sputter deposition Methods 0.000 claims description 25
- 230000015572 biosynthetic process Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 14
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 238000005477 sputtering target Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- Plasma Technology (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017249664A JP6657535B2 (ja) | 2017-12-26 | 2017-12-26 | スパッタ成膜装置およびスパッタ成膜方法 |
| KR1020180086178A KR102330318B1 (ko) | 2017-12-26 | 2018-07-24 | 스퍼터 성막 장치 및 스퍼터 성막 방법 |
| CN201811070882.3A CN109957773B (zh) | 2017-12-26 | 2018-09-14 | 溅射成膜装置和溅射成膜方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017249664A JP6657535B2 (ja) | 2017-12-26 | 2017-12-26 | スパッタ成膜装置およびスパッタ成膜方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019116644A JP2019116644A (ja) | 2019-07-18 |
| JP6657535B2 true JP6657535B2 (ja) | 2020-03-04 |
Family
ID=67023202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017249664A Active JP6657535B2 (ja) | 2017-12-26 | 2017-12-26 | スパッタ成膜装置およびスパッタ成膜方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6657535B2 (ko) |
| KR (1) | KR102330318B1 (ko) |
| CN (1) | CN109957773B (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111893441A (zh) * | 2019-05-06 | 2020-11-06 | 领凡新能源科技(北京)有限公司 | 膜层的制备方法和反应腔室 |
| JP2021095609A (ja) * | 2019-12-18 | 2021-06-24 | キヤノントッキ株式会社 | 成膜装置、成膜方法及び電子デバイスの製造方法 |
| JP7344929B2 (ja) * | 2021-06-14 | 2023-09-14 | キヤノントッキ株式会社 | 成膜装置、成膜方法、及び電子デバイスの製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3344318B2 (ja) * | 1998-05-27 | 2002-11-11 | 日本電気株式会社 | スパッタ装置 |
| WO2000028104A1 (en) * | 1998-11-06 | 2000-05-18 | Scivac | Sputtering apparatus and process for high rate coatings |
| JP2001003166A (ja) * | 1999-04-23 | 2001-01-09 | Nippon Sheet Glass Co Ltd | 基体表面に被膜を被覆する方法およびその方法による基体 |
| JP2001200357A (ja) * | 2000-01-19 | 2001-07-24 | Nippon Sheet Glass Co Ltd | 成膜装置と成膜方法 |
| JP2007162100A (ja) * | 2005-12-15 | 2007-06-28 | Asahi Glass Co Ltd | スパッタリング成膜方法 |
| JP5124344B2 (ja) * | 2008-05-26 | 2013-01-23 | 株式会社アルバック | バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置並びに出力方法 |
| JP5573597B2 (ja) * | 2010-10-28 | 2014-08-20 | 日本電気硝子株式会社 | 多層膜の製造方法 |
| JP6134815B2 (ja) * | 2013-02-25 | 2017-05-24 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 隣接スパッタカソードを用いた装置およびその操作方法 |
| CN106488996B (zh) * | 2014-07-09 | 2019-07-23 | 梭莱先进镀膜工业有限公司 | 具有动靶的溅镀装置 |
| US20180312964A1 (en) * | 2015-06-16 | 2018-11-01 | Schneider Gmbh & Co. Kg | Device, method and use for the coating of lenses |
| JP2017066427A (ja) | 2015-09-28 | 2017-04-06 | 株式会社Ｓｃｒｅｅｎホールディングス | 成膜装置 |
-
2017
- 2017-12-26 JP JP2017249664A patent/JP6657535B2/ja active Active
-
2018
- 2018-07-24 KR KR1020180086178A patent/KR102330318B1/ko active IP Right Grant
- 2018-09-14 CN CN201811070882.3A patent/CN109957773B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109957773A (zh) | 2019-07-02 |
| KR20190078468A (ko) | 2019-07-04 |
| KR102330318B1 (ko) | 2021-11-22 |
| JP2019116644A (ja) | 2019-07-18 |
| CN109957773B (zh) | 2023-12-26 |
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