JP6657535B2 - スパッタ成膜装置およびスパッタ成膜方法 - Google Patents

スパッタ成膜装置およびスパッタ成膜方法 Download PDF

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Publication number
JP6657535B2
JP6657535B2 JP2017249664A JP2017249664A JP6657535B2 JP 6657535 B2 JP6657535 B2 JP 6657535B2 JP 2017249664 A JP2017249664 A JP 2017249664A JP 2017249664 A JP2017249664 A JP 2017249664A JP 6657535 B2 JP6657535 B2 JP 6657535B2
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Japan
Prior art keywords
target
substrate
waveform portion
unit
power supply
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JP2017249664A
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English (en)
Japanese (ja)
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JP2019116644A (ja
Inventor
新 渡部
新 渡部
崇 竹見
崇 竹見
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to JP2017249664A priority Critical patent/JP6657535B2/ja
Priority to KR1020180086178A priority patent/KR102330318B1/ko
Priority to CN201811070882.3A priority patent/CN109957773B/zh
Publication of JP2019116644A publication Critical patent/JP2019116644A/ja
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Plasma Technology (AREA)
  • Electroluminescent Light Sources (AREA)
JP2017249664A 2017-12-26 2017-12-26 スパッタ成膜装置およびスパッタ成膜方法 Active JP6657535B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017249664A JP6657535B2 (ja) 2017-12-26 2017-12-26 スパッタ成膜装置およびスパッタ成膜方法
KR1020180086178A KR102330318B1 (ko) 2017-12-26 2018-07-24 스퍼터 성막 장치 및 스퍼터 성막 방법
CN201811070882.3A CN109957773B (zh) 2017-12-26 2018-09-14 溅射成膜装置和溅射成膜方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017249664A JP6657535B2 (ja) 2017-12-26 2017-12-26 スパッタ成膜装置およびスパッタ成膜方法

Publications (2)

Publication Number Publication Date
JP2019116644A JP2019116644A (ja) 2019-07-18
JP6657535B2 true JP6657535B2 (ja) 2020-03-04

Family

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JP2017249664A Active JP6657535B2 (ja) 2017-12-26 2017-12-26 スパッタ成膜装置およびスパッタ成膜方法

Country Status (3)

Country Link
JP (1) JP6657535B2 (ko)
KR (1) KR102330318B1 (ko)
CN (1) CN109957773B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111893441A (zh) * 2019-05-06 2020-11-06 领凡新能源科技(北京)有限公司 膜层的制备方法和反应腔室
JP2021095609A (ja) * 2019-12-18 2021-06-24 キヤノントッキ株式会社 成膜装置、成膜方法及び電子デバイスの製造方法
JP7344929B2 (ja) * 2021-06-14 2023-09-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3344318B2 (ja) * 1998-05-27 2002-11-11 日本電気株式会社 スパッタ装置
WO2000028104A1 (en) * 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
JP2001003166A (ja) * 1999-04-23 2001-01-09 Nippon Sheet Glass Co Ltd 基体表面に被膜を被覆する方法およびその方法による基体
JP2001200357A (ja) * 2000-01-19 2001-07-24 Nippon Sheet Glass Co Ltd 成膜装置と成膜方法
JP2007162100A (ja) * 2005-12-15 2007-06-28 Asahi Glass Co Ltd スパッタリング成膜方法
JP5124344B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置並びに出力方法
JP5573597B2 (ja) * 2010-10-28 2014-08-20 日本電気硝子株式会社 多層膜の製造方法
JP6134815B2 (ja) * 2013-02-25 2017-05-24 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 隣接スパッタカソードを用いた装置およびその操作方法
CN106488996B (zh) * 2014-07-09 2019-07-23 梭莱先进镀膜工业有限公司 具有动靶的溅镀装置
US20180312964A1 (en) * 2015-06-16 2018-11-01 Schneider Gmbh & Co. Kg Device, method and use for the coating of lenses
JP2017066427A (ja) 2015-09-28 2017-04-06 株式会社Screenホールディングス 成膜装置

Also Published As

Publication number Publication date
CN109957773A (zh) 2019-07-02
KR20190078468A (ko) 2019-07-04
KR102330318B1 (ko) 2021-11-22
JP2019116644A (ja) 2019-07-18
CN109957773B (zh) 2023-12-26

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