JP6657201B2 - 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド - Google Patents

凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド Download PDF

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Publication number
JP6657201B2
JP6657201B2 JP2017518223A JP2017518223A JP6657201B2 JP 6657201 B2 JP6657201 B2 JP 6657201B2 JP 2017518223 A JP2017518223 A JP 2017518223A JP 2017518223 A JP2017518223 A JP 2017518223A JP 6657201 B2 JP6657201 B2 JP 6657201B2
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Japan
Prior art keywords
polishing head
polishing
cap
head assembly
floor
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JP2017518223A
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English (en)
Japanese (ja)
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JP2017530560A5 (enExample
JP2017530560A (ja
Inventor
ピーター・アルブレヒト
サミート・エス・バガヴァット
チュウ・アレックス
一郎 吉村
一郎 吉村
ユンビャオ・シン
ローランド・バンダム
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GlobalWafers Co Ltd
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GlobalWafers Co Ltd
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Publication of JP2017530560A5 publication Critical patent/JP2017530560A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2017518223A 2014-10-13 2015-10-05 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド Active JP6657201B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/512,779 US9566687B2 (en) 2014-10-13 2014-10-13 Center flex single side polishing head having recess and cap
US14/512,779 2014-10-13
PCT/US2015/054033 WO2016060872A2 (en) 2014-10-13 2015-10-05 Center flex single side polishing head having recess and cap

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019081061A Division JP6867430B2 (ja) 2014-10-13 2019-04-22 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド

Publications (3)

Publication Number Publication Date
JP2017530560A JP2017530560A (ja) 2017-10-12
JP2017530560A5 JP2017530560A5 (enExample) 2018-11-22
JP6657201B2 true JP6657201B2 (ja) 2020-03-04

Family

ID=54325753

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2017518223A Active JP6657201B2 (ja) 2014-10-13 2015-10-05 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド
JP2019081061A Active JP6867430B2 (ja) 2014-10-13 2019-04-22 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド
JP2020186478A Active JP7239539B2 (ja) 2014-10-13 2020-11-09 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2019081061A Active JP6867430B2 (ja) 2014-10-13 2019-04-22 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド
JP2020186478A Active JP7239539B2 (ja) 2014-10-13 2020-11-09 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド

Country Status (3)

Country Link
US (1) US9566687B2 (enExample)
JP (3) JP6657201B2 (enExample)
WO (1) WO2016060872A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111823130A (zh) * 2020-07-17 2020-10-27 中国科学院微电子研究所 一种抛光头及抛光装置
US12420376B2 (en) 2021-12-23 2025-09-23 Globalwafers Co., Ltd. Polishing head assembly having recess and cap

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600634B2 (en) 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
US11081359B2 (en) 2018-09-10 2021-08-03 Globalwafers Co., Ltd. Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
JP7349791B2 (ja) * 2019-01-16 2023-09-25 株式会社東京精密 Ｃｍｐ装置
KR102270392B1 (ko) 2019-10-01 2021-06-30 에스케이실트론 주식회사 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치
WO2022193010A1 (en) * 2021-03-16 2022-09-22 Vuereal Inc. A gimbal bonding tool and a method to correct surface non-uniformities using a bonding tool
US20220410340A1 (en) * 2021-06-25 2022-12-29 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
CN113510609B (zh) * 2021-07-12 2023-09-08 长鑫存储技术有限公司 晶圆以及晶圆的处理方法
US12482662B2 (en) 2022-02-21 2025-11-25 Globalwafers Co., Ltd. Systems and methods for producing epitaxial wafers
CN117976799B (zh) * 2024-03-28 2024-06-11 广东省旭晟半导体股份有限公司 一种提高led封装器件出光效率的封装方法
CN119820454B (zh) * 2025-03-20 2025-07-15 北京特思迪半导体设备有限公司 抛光压盘及抛光设备
CN119927788B (zh) * 2025-04-08 2025-08-01 河北同光半导体股份有限公司 晶圆的研磨抛光加工方法
CN120190703B (zh) * 2025-05-26 2025-09-26 北京特思迪半导体设备有限公司 上研磨抛光盘系统

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
JP3329644B2 (ja) 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法
US6146259A (en) 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
JP3076291B2 (ja) 1997-12-02 2000-08-14 日本電気株式会社 研磨装置
JP2000084836A (ja) * 1998-09-08 2000-03-28 Speedfam-Ipec Co Ltd キャリア及び研磨装置
US6162116A (en) 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
JP4122103B2 (ja) * 1999-02-17 2008-07-23 不二越機械工業株式会社 ウェーハの研磨装置
JP4056205B2 (ja) * 1999-10-15 2008-03-05 株式会社荏原製作所 ポリッシング装置および方法
EP1284840A2 (en) * 2000-05-12 2003-02-26 Multi-Planar Technologies, Inc. Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same
US6623343B2 (en) * 2000-05-12 2003-09-23 Multi Planar Technologies, Inc. System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
JP2002086352A (ja) * 2000-09-13 2002-03-26 Matsushita Electric Ind Co Ltd 接着装置、および研磨治具
JP2002270551A (ja) * 2001-03-13 2002-09-20 Toshiba Ceramics Co Ltd 研磨ヘッドおよびこれを用いた研磨装置
US6893327B2 (en) 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2003039306A (ja) * 2001-07-27 2003-02-13 Tokyo Seimitsu Co Ltd ウエーハ研磨装置
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
JP4090247B2 (ja) 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
US6755726B2 (en) 2002-03-25 2004-06-29 United Microelectric Corp. Polishing head with a floating knife-edge
JP4264289B2 (ja) * 2003-04-22 2009-05-13 信越半導体株式会社 ウエーハ研磨装置及びその研磨ヘッド並びにウエーハ研磨方法
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7364496B2 (en) 2006-03-03 2008-04-29 Inopla Inc. Polishing head for polishing semiconductor wafers
JP2007307623A (ja) * 2006-05-16 2007-11-29 Elpida Memory Inc 研磨装置
JP2007331093A (ja) * 2006-05-17 2007-12-27 Elpida Memory Inc 研磨装置
JP2007324497A (ja) * 2006-06-05 2007-12-13 Matsushita Electric Ind Co Ltd 弾性体およびこの弾性体を具備した研磨装置
JP4374370B2 (ja) 2006-10-27 2009-12-02 信越半導体株式会社 研磨ヘッド及び研磨装置
DE112007003710T5 (de) 2007-11-20 2010-12-02 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
JP2010225711A (ja) * 2009-03-23 2010-10-07 Consortium For Advanced Semiconductor Materials & Related Technologies 研磨方法
JP2013004928A (ja) * 2011-06-21 2013-01-07 Shin Etsu Handotai Co Ltd 研磨ヘッド、研磨装置及びワークの研磨方法
JP5807580B2 (ja) * 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111823130A (zh) * 2020-07-17 2020-10-27 中国科学院微电子研究所 一种抛光头及抛光装置
US12420376B2 (en) 2021-12-23 2025-09-23 Globalwafers Co., Ltd. Polishing head assembly having recess and cap

Also Published As

Publication number Publication date
JP6867430B2 (ja) 2021-04-28
JP7239539B2 (ja) 2023-03-14
US9566687B2 (en) 2017-02-14
WO2016060872A2 (en) 2016-04-21
US20160101502A1 (en) 2016-04-14
WO2016060872A3 (en) 2016-06-09
JP2019153801A (ja) 2019-09-12
JP2017530560A (ja) 2017-10-12
JP2021044561A (ja) 2021-03-18

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