JP5314267B2 - 保持リング、保持リングに負荷をかけるフレキシブル膜及び保持リングアセンブリ - Google Patents
保持リング、保持リングに負荷をかけるフレキシブル膜及び保持リングアセンブリ Download PDFInfo
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- JP5314267B2 JP5314267B2 JP2007298303A JP2007298303A JP5314267B2 JP 5314267 B2 JP5314267 B2 JP 5314267B2 JP 2007298303 A JP2007298303 A JP 2007298303A JP 2007298303 A JP2007298303 A JP 2007298303A JP 5314267 B2 JP5314267 B2 JP 5314267B2
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- Prior art keywords
- annular
- retaining ring
- flexible membrane
- concentric
- ring
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
- Laminated Bodies (AREA)
Description
Claims (9)
- 環状チャンバを提供するように形作られ、内側及び外側エッジを有する環状下面と、前記環状下面の内側及び外側エッジから延びる同心の内側及び外側側壁と、前記内側及び外側側壁の上部エッジから水平方向に延びる環状同心リム部と、前記内側エッジと前記外側エッジとの間に配置された、前記環状下面から下へ延びる2つの環状同心突出部とを備えるフレキシブル膜と、
を備え、前記フレキシブル膜の前記同心の内側及び外側側壁が、前記保持リングの上環状面の下に延びる湾曲部を有し、
前記フレキシブル膜の下に配置され、基板のエッジを取り囲んで前記基板を保持するように構成された内面と、研磨パッドに接触するように構成された下面と、環状上面と、前記環状上面内の2つの環状同心凹部とを備える環状保持リングと、
を備え、
前記フレキシブル膜の環状同心突出部が、前記環状保持リングの前記環状同心凹部内に嵌合するように寸法付けられている、保持リングアセンブリ。 - 前記フレキシブル膜の環状下面が、各々が、前記環状下面から下へ延びる2つの環状同心突出部の間に配置された複数の円形ホールをさらに備え、
前記保持リングの環状上面が、各々が、2つの前記環状同心凹部の間に配置された複数の円筒形凹部をさらに備え、
前記フレキシブル膜が、保持リングに固着するように構成されている、請求項1に記載の保持リングアセンブリ。 - 前記環状保持リングが、環状下部と、環状上部と、前記上部と下部との間の接合層とをさらに備える、請求項1に記載の保持リングアセンブリ。
- 前記環状保持リングの環状上部がさらに、その外面に沿った環状リップ部によって画成され、前記環状リップ部が、水平下面と、垂直外面と、非平坦上面とを有する、請求項3に記載の保持リングアセンブリ。
- 前記環状保持リングの環状上部がさらに、下環状面及び上環状面によって画成され、前記下環状面が、前記上環状面よりも幅が広い、請求項3に記載の保持リングアセンブリ。
- 保持リングに負荷をかけるフレキシブル膜であって、
内側及び外側エッジを有する環状下面と、
前記環状下面の内側及び外側エッジから延びる環状チャンバを包囲する同心の内側及び外側側壁と、
を備え、前記フレキシブル膜の前記同心の内側及び外側側壁が、前記保持リングの上環状面の下に延びる湾曲部を有し、
前記内側及び外側側壁の上部エッジから水平方向に延びる環状同心周縁と、
前記内側エッジと前記外側エッジとの間に配置された、前記環状下面から下へ延びる2つの環状同心突出部と、
を備えるフレキシブル膜。 - 前記フレキシブル膜の環状同心周縁及び環状同心突出部が、前記内側及び外側側壁よりも厚い、請求項6に記載のフレキシブル膜。
- 前記フレキシブル膜の環状下面が、複数のホールをさらに備え、各ホールが、前記2つの環状同心突出部の間に配置されている、請求項6に記載のフレキシブル膜。
- 前記フレキシブル膜が、弾性材料で形成されている、請求項6に記載のフレキシブル膜。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86709006P | 2006-11-22 | 2006-11-22 | |
US60/867,090 | 2006-11-22 | ||
US89170507P | 2007-02-26 | 2007-02-26 | |
US60/891,705 | 2007-02-26 | ||
US11/741,691 | 2007-04-27 | ||
US11/741,691 US7575504B2 (en) | 2006-11-22 | 2007-04-27 | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013024749A Division JP5568653B2 (ja) | 2006-11-22 | 2013-02-12 | 保持リング、保持リングに負荷をかけるフレキシブル膜及び保持リングアセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008137149A JP2008137149A (ja) | 2008-06-19 |
JP5314267B2 true JP5314267B2 (ja) | 2013-10-16 |
Family
ID=38969432
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007298303A Active JP5314267B2 (ja) | 2006-11-22 | 2007-11-16 | 保持リング、保持リングに負荷をかけるフレキシブル膜及び保持リングアセンブリ |
JP2013024749A Active JP5568653B2 (ja) | 2006-11-22 | 2013-02-12 | 保持リング、保持リングに負荷をかけるフレキシブル膜及び保持リングアセンブリ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013024749A Active JP5568653B2 (ja) | 2006-11-22 | 2013-02-12 | 保持リング、保持リングに負荷をかけるフレキシブル膜及び保持リングアセンブリ |
Country Status (9)
Country | Link |
---|---|
US (1) | US7575504B2 (ja) |
EP (1) | EP1925398B1 (ja) |
JP (2) | JP5314267B2 (ja) |
KR (3) | KR100940614B1 (ja) |
CN (1) | CN101293332B (ja) |
AT (1) | ATE503610T1 (ja) |
DE (1) | DE602007013517D1 (ja) |
SG (1) | SG143190A1 (ja) |
TW (2) | TWI448356B (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7572504B2 (en) * | 2005-06-03 | 2009-08-11 | The Procter + Gamble Company | Fibrous structures comprising a polymer structure |
US7654888B2 (en) * | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
US7727055B2 (en) * | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
US8033895B2 (en) * | 2007-07-19 | 2011-10-11 | Applied Materials, Inc. | Retaining ring with shaped profile |
DE112007003710T5 (de) * | 2007-11-20 | 2010-12-02 | Shin-Etsu Handotai Co., Ltd. | Polierkopf und Poliervorrichtung |
KR101617716B1 (ko) * | 2008-03-25 | 2016-05-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 개량된 캐리어 헤드 멤브레인 |
US7749052B2 (en) * | 2008-09-08 | 2010-07-06 | Applied Materials, Inc. | Carrier head using flexure restraints for retaining ring alignment |
US8475231B2 (en) * | 2008-12-12 | 2013-07-02 | Applied Materials, Inc. | Carrier head membrane |
US10160093B2 (en) | 2008-12-12 | 2018-12-25 | Applied Materials, Inc. | Carrier head membrane roughness to control polishing rate |
EP3406402B1 (en) * | 2010-08-06 | 2021-06-30 | Applied Materials, Inc. | Substrate edge tuning with retaining ring |
US20130035022A1 (en) * | 2011-08-05 | 2013-02-07 | Paik Young J | Two-Part Plastic Retaining Ring |
US20130102152A1 (en) * | 2011-10-20 | 2013-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
KR102236929B1 (ko) | 2012-06-05 | 2021-04-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 인터로크 피쳐들을 갖는 2-파트 리테이닝 링 |
KR101387923B1 (ko) | 2012-08-27 | 2014-04-22 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드 |
US8998676B2 (en) | 2012-10-26 | 2015-04-07 | Applied Materials, Inc. | Retaining ring with selected stiffness and thickness |
US10532441B2 (en) | 2012-11-30 | 2020-01-14 | Applied Materials, Inc. | Three-zone carrier head and flexible membrane |
KR101410358B1 (ko) * | 2013-02-25 | 2014-06-20 | 삼성전자주식회사 | 화학적 기계적 연마장치용 멤브레인 및 화학적 기계적 연마장치용 연마헤드 |
WO2014163735A1 (en) * | 2013-03-13 | 2014-10-09 | Applied Materials, Inc. | Reinforcement ring for carrier head |
US9227297B2 (en) | 2013-03-20 | 2016-01-05 | Applied Materials, Inc. | Retaining ring with attachable segments |
KR101515424B1 (ko) * | 2013-10-22 | 2015-04-29 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 |
JP6232297B2 (ja) * | 2014-01-21 | 2017-11-15 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
TWI658899B (zh) * | 2014-03-31 | 2019-05-11 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨方法 |
US9368371B2 (en) | 2014-04-22 | 2016-06-14 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
US10252397B2 (en) * | 2014-10-30 | 2019-04-09 | Applied Materials, Inc. | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes |
KR101583815B1 (ko) * | 2014-12-22 | 2016-01-11 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드 |
KR102264785B1 (ko) * | 2015-02-16 | 2021-06-14 | 삼성전자주식회사 | 연마 헤드 및 이를 갖는 연마 캐리어 장치 |
US10500695B2 (en) | 2015-05-29 | 2019-12-10 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
KR101655075B1 (ko) * | 2015-08-21 | 2016-09-07 | 주식회사 케이씨텍 | 화학 기계적 연마 장치 |
US10589399B2 (en) * | 2016-03-24 | 2020-03-17 | Applied Materials, Inc. | Textured small pad for chemical mechanical polishing |
CN113997194B (zh) | 2016-07-25 | 2024-04-05 | 应用材料公司 | 用于化学机械抛光的保持环 |
US11397139B2 (en) * | 2017-02-27 | 2022-07-26 | Leco Corporation | Metallographic grinder and components thereof |
CN108687657A (zh) * | 2017-04-05 | 2018-10-23 | 中芯国际集成电路制造(北京)有限公司 | 一种化学机械研磨设备 |
CN209615159U (zh) * | 2018-11-28 | 2019-11-12 | 凯斯科技股份有限公司 | 化学机械式研磨装置用承载头的卡环及具备其的承载头 |
CN112548848B (zh) * | 2019-09-26 | 2022-09-23 | 清华大学 | 一种承载头和化学机械抛光设备 |
CN111318959B (zh) * | 2020-04-16 | 2024-02-06 | 清华大学 | 一种用于化学机械抛光的保持环和承载头 |
US11724355B2 (en) | 2020-09-30 | 2023-08-15 | Applied Materials, Inc. | Substrate polish edge uniformity control with secondary fluid dispense |
KR20220116311A (ko) | 2020-10-13 | 2022-08-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 접촉 연장부 또는 조절가능한 정지부를 갖는 기판 연마 장치 |
US11623321B2 (en) | 2020-10-14 | 2023-04-11 | Applied Materials, Inc. | Polishing head retaining ring tilting moment control |
WO2022187249A1 (en) * | 2021-03-04 | 2022-09-09 | Applied Materials, Inc. | Polishing carrier head with floating edge control |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
KR100485002B1 (ko) | 1996-02-16 | 2005-08-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 작업물폴리싱장치및방법 |
US6183354B1 (en) | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6056632A (en) | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
US6019670A (en) | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
US5916015A (en) | 1997-07-25 | 1999-06-29 | Speedfam Corporation | Wafer carrier for semiconductor wafer polishing machine |
US6116992A (en) | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
US6143127A (en) | 1998-05-14 | 2000-11-07 | Applied Materials, Inc. | Carrier head with a retaining ring for a chemical mechanical polishing system |
US6251215B1 (en) | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
US6159079A (en) | 1998-09-08 | 2000-12-12 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
US6089961A (en) | 1998-12-07 | 2000-07-18 | Speedfam-Ipec Corporation | Wafer polishing carrier and ring extension therefor |
US20020173242A1 (en) | 1999-04-19 | 2002-11-21 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US6527624B1 (en) * | 1999-03-26 | 2003-03-04 | Applied Materials, Inc. | Carrier head for providing a polishing slurry |
US6186880B1 (en) | 1999-09-29 | 2001-02-13 | Semiconductor Equipment Technology | Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
DE60024559T2 (de) | 1999-10-15 | 2006-08-24 | Ebara Corp. | Verfahren und Gerät zum Polieren eines Werkstückes |
US6726528B2 (en) * | 2002-05-14 | 2004-04-27 | Strasbaugh | Polishing pad with optical sensor |
US6663466B2 (en) * | 1999-11-17 | 2003-12-16 | Applied Materials, Inc. | Carrier head with a substrate detector |
US6361419B1 (en) * | 2000-03-27 | 2002-03-26 | Applied Materials, Inc. | Carrier head with controllable edge pressure |
JP2001277098A (ja) * | 2000-03-29 | 2001-10-09 | Matsushita Electric Ind Co Ltd | 研磨装置および研磨方法 |
US6558232B1 (en) | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
EP2085181A1 (en) | 2000-07-31 | 2009-08-05 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
EP1335814A1 (en) * | 2000-11-21 | 2003-08-20 | Memc Electronic Materials S.P.A. | Semiconductor wafer, polishing apparatus and method |
US6890249B1 (en) | 2001-12-27 | 2005-05-10 | Applied Materials, Inc. | Carrier head with edge load retaining ring |
US6872130B1 (en) | 2001-12-28 | 2005-03-29 | Applied Materials Inc. | Carrier head with non-contact retainer |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
JP3091590U (ja) * | 2002-07-23 | 2003-02-07 | 水源 陳 | シリコンウェハの研磨用定位リングの構造 |
TW544375B (en) * | 2002-09-09 | 2003-08-01 | Taiwan Semiconductor Mfg | Chemical mechanical polishing head |
TWM255104U (en) | 2003-02-05 | 2005-01-11 | Applied Materials Inc | Retaining ring with flange for chemical mechanical polishing |
US7033252B2 (en) | 2004-03-05 | 2006-04-25 | Strasbaugh | Wafer carrier with pressurized membrane and retaining ring actuator |
JP4583207B2 (ja) | 2004-03-31 | 2010-11-17 | 不二越機械工業株式会社 | 研磨装置 |
WO2006025641A1 (en) * | 2004-09-02 | 2006-03-09 | Joon-Mo Kang | Retaining ring for chemical mechanical polishing |
EP2797109B1 (en) | 2004-11-01 | 2018-02-28 | Ebara Corporation | Polishing apparatus |
JP5112614B2 (ja) * | 2004-12-10 | 2013-01-09 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
US7186171B2 (en) * | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
JP4814677B2 (ja) | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
-
2007
- 2007-04-27 US US11/741,691 patent/US7575504B2/en active Active
- 2007-10-26 KR KR1020070108352A patent/KR100940614B1/ko active IP Right Grant
- 2007-11-16 JP JP2007298303A patent/JP5314267B2/ja active Active
- 2007-11-19 EP EP07022411A patent/EP1925398B1/en active Active
- 2007-11-19 AT AT07022411T patent/ATE503610T1/de not_active IP Right Cessation
- 2007-11-19 DE DE602007013517T patent/DE602007013517D1/de active Active
- 2007-11-21 SG SG200717956-7A patent/SG143190A1/en unknown
- 2007-11-22 CN CN2007101655918A patent/CN101293332B/zh active Active
- 2007-11-22 TW TW098125730A patent/TWI448356B/zh active
- 2007-11-22 TW TW096144345A patent/TWI432288B/zh active
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2009
- 2009-07-31 KR KR1020090070573A patent/KR101358821B1/ko active IP Right Grant
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2013
- 2013-02-12 JP JP2013024749A patent/JP5568653B2/ja active Active
- 2013-06-17 KR KR1020130068914A patent/KR101335554B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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JP2008137149A (ja) | 2008-06-19 |
ATE503610T1 (de) | 2011-04-15 |
SG143190A1 (en) | 2008-06-27 |
TW201000257A (en) | 2010-01-01 |
EP1925398A1 (en) | 2008-05-28 |
EP1925398B1 (en) | 2011-03-30 |
DE602007013517D1 (de) | 2011-05-12 |
KR20090089279A (ko) | 2009-08-21 |
KR20080046556A (ko) | 2008-05-27 |
TWI432288B (zh) | 2014-04-01 |
KR101335554B1 (ko) | 2013-12-02 |
TW200833465A (en) | 2008-08-16 |
KR20130083873A (ko) | 2013-07-23 |
TWI448356B (zh) | 2014-08-11 |
CN101293332B (zh) | 2012-08-08 |
JP2013116554A (ja) | 2013-06-13 |
US20080119118A1 (en) | 2008-05-22 |
CN101293332A (zh) | 2008-10-29 |
JP5568653B2 (ja) | 2014-08-06 |
KR100940614B1 (ko) | 2010-02-05 |
US7575504B2 (en) | 2009-08-18 |
KR101358821B1 (ko) | 2014-02-10 |
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