DE602007013517D1 - Haltering, flexible Membran zur Anwendung einer Belastung auf den Haltering und Halteringanordnung - Google Patents

Haltering, flexible Membran zur Anwendung einer Belastung auf den Haltering und Halteringanordnung

Info

Publication number
DE602007013517D1
DE602007013517D1 DE602007013517T DE602007013517T DE602007013517D1 DE 602007013517 D1 DE602007013517 D1 DE 602007013517D1 DE 602007013517 T DE602007013517 T DE 602007013517T DE 602007013517 T DE602007013517 T DE 602007013517T DE 602007013517 D1 DE602007013517 D1 DE 602007013517D1
Authority
DE
Germany
Prior art keywords
retaining ring
flexible membrane
assembly
applying
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007013517T
Other languages
English (en)
Inventor
Steven M Zuniga
Andrew J Nagengast
Jeonghoon Oh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE602007013517D1 publication Critical patent/DE602007013517D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
DE602007013517T 2006-11-22 2007-11-19 Haltering, flexible Membran zur Anwendung einer Belastung auf den Haltering und Halteringanordnung Active DE602007013517D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86709006P 2006-11-22 2006-11-22
US89170507P 2007-02-26 2007-02-26
US11/741,691 US7575504B2 (en) 2006-11-22 2007-04-27 Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly

Publications (1)

Publication Number Publication Date
DE602007013517D1 true DE602007013517D1 (de) 2011-05-12

Family

ID=38969432

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007013517T Active DE602007013517D1 (de) 2006-11-22 2007-11-19 Haltering, flexible Membran zur Anwendung einer Belastung auf den Haltering und Halteringanordnung

Country Status (9)

Country Link
US (1) US7575504B2 (de)
EP (1) EP1925398B1 (de)
JP (2) JP5314267B2 (de)
KR (3) KR100940614B1 (de)
CN (1) CN101293332B (de)
AT (1) ATE503610T1 (de)
DE (1) DE602007013517D1 (de)
SG (1) SG143190A1 (de)
TW (2) TWI448356B (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7572504B2 (en) * 2005-06-03 2009-08-11 The Procter + Gamble Company Fibrous structures comprising a polymer structure
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US8033895B2 (en) * 2007-07-19 2011-10-11 Applied Materials, Inc. Retaining ring with shaped profile
DE112007003710T5 (de) * 2007-11-20 2010-12-02 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
KR101617716B1 (ko) * 2008-03-25 2016-05-03 어플라이드 머티어리얼스, 인코포레이티드 개량된 캐리어 헤드 멤브레인
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
EP3406402B1 (de) * 2010-08-06 2021-06-30 Applied Materials, Inc. Substratkantenbearbeitung mit einem haltering
US20130035022A1 (en) * 2011-08-05 2013-02-07 Paik Young J Two-Part Plastic Retaining Ring
US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
KR102236929B1 (ko) 2012-06-05 2021-04-06 어플라이드 머티어리얼스, 인코포레이티드 인터로크 피쳐들을 갖는 2-파트 리테이닝 링
KR101387923B1 (ko) 2012-08-27 2014-04-22 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드
US8998676B2 (en) 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
KR101410358B1 (ko) * 2013-02-25 2014-06-20 삼성전자주식회사 화학적 기계적 연마장치용 멤브레인 및 화학적 기계적 연마장치용 연마헤드
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
US9227297B2 (en) 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
KR101515424B1 (ko) * 2013-10-22 2015-04-29 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인
JP6232297B2 (ja) * 2014-01-21 2017-11-15 株式会社荏原製作所 基板保持装置および研磨装置
TWI658899B (zh) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 研磨裝置及研磨方法
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
US10252397B2 (en) * 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
KR101583815B1 (ko) * 2014-12-22 2016-01-11 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드
KR102264785B1 (ko) * 2015-02-16 2021-06-14 삼성전자주식회사 연마 헤드 및 이를 갖는 연마 캐리어 장치
US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
KR101655075B1 (ko) * 2015-08-21 2016-09-07 주식회사 케이씨텍 화학 기계적 연마 장치
US10589399B2 (en) * 2016-03-24 2020-03-17 Applied Materials, Inc. Textured small pad for chemical mechanical polishing
CN113997194B (zh) 2016-07-25 2024-04-05 应用材料公司 用于化学机械抛光的保持环
US11397139B2 (en) * 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
CN108687657A (zh) * 2017-04-05 2018-10-23 中芯国际集成电路制造(北京)有限公司 一种化学机械研磨设备
CN209615159U (zh) * 2018-11-28 2019-11-12 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
CN112548848B (zh) * 2019-09-26 2022-09-23 清华大学 一种承载头和化学机械抛光设备
CN111318959B (zh) * 2020-04-16 2024-02-06 清华大学 一种用于化学机械抛光的保持环和承载头
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
KR20220116311A (ko) 2020-10-13 2022-08-22 어플라이드 머티어리얼스, 인코포레이티드 접촉 연장부 또는 조절가능한 정지부를 갖는 기판 연마 장치
US11623321B2 (en) 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
WO2022187249A1 (en) * 2021-03-04 2022-09-09 Applied Materials, Inc. Polishing carrier head with floating edge control

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
KR100485002B1 (ko) 1996-02-16 2005-08-29 가부시키가이샤 에바라 세이사꾸쇼 작업물폴리싱장치및방법
US6183354B1 (en) 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6056632A (en) 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US6019670A (en) 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US5916015A (en) 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6116992A (en) 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6143127A (en) 1998-05-14 2000-11-07 Applied Materials, Inc. Carrier head with a retaining ring for a chemical mechanical polishing system
US6251215B1 (en) 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6159079A (en) 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6089961A (en) 1998-12-07 2000-07-18 Speedfam-Ipec Corporation Wafer polishing carrier and ring extension therefor
US20020173242A1 (en) 1999-04-19 2002-11-21 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6186880B1 (en) 1999-09-29 2001-02-13 Semiconductor Equipment Technology Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
DE60024559T2 (de) 1999-10-15 2006-08-24 Ebara Corp. Verfahren und Gerät zum Polieren eines Werkstückes
US6726528B2 (en) * 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
US6663466B2 (en) * 1999-11-17 2003-12-16 Applied Materials, Inc. Carrier head with a substrate detector
US6361419B1 (en) * 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
JP2001277098A (ja) * 2000-03-29 2001-10-09 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
EP2085181A1 (de) 2000-07-31 2009-08-05 Ebara Corporation Substrathaltevorrichtung und Substratpoliervorrichtung
EP1335814A1 (de) * 2000-11-21 2003-08-20 Memc Electronic Materials S.P.A. Poliervorrichtung für eine halbleiterscheibe und methode
US6890249B1 (en) 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP3091590U (ja) * 2002-07-23 2003-02-07 水源 陳 シリコンウェハの研磨用定位リングの構造
TW544375B (en) * 2002-09-09 2003-08-01 Taiwan Semiconductor Mfg Chemical mechanical polishing head
TWM255104U (en) 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing
US7033252B2 (en) 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
JP4583207B2 (ja) 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
WO2006025641A1 (en) * 2004-09-02 2006-03-09 Joon-Mo Kang Retaining ring for chemical mechanical polishing
EP2797109B1 (de) 2004-11-01 2018-02-28 Ebara Corporation Poliervorrichtung
JP5112614B2 (ja) * 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
JP4814677B2 (ja) 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置

Also Published As

Publication number Publication date
JP2008137149A (ja) 2008-06-19
ATE503610T1 (de) 2011-04-15
SG143190A1 (en) 2008-06-27
TW201000257A (en) 2010-01-01
EP1925398A1 (de) 2008-05-28
EP1925398B1 (de) 2011-03-30
KR20090089279A (ko) 2009-08-21
KR20080046556A (ko) 2008-05-27
TWI432288B (zh) 2014-04-01
KR101335554B1 (ko) 2013-12-02
JP5314267B2 (ja) 2013-10-16
TW200833465A (en) 2008-08-16
KR20130083873A (ko) 2013-07-23
TWI448356B (zh) 2014-08-11
CN101293332B (zh) 2012-08-08
JP2013116554A (ja) 2013-06-13
US20080119118A1 (en) 2008-05-22
CN101293332A (zh) 2008-10-29
JP5568653B2 (ja) 2014-08-06
KR100940614B1 (ko) 2010-02-05
US7575504B2 (en) 2009-08-18
KR101358821B1 (ko) 2014-02-10

Similar Documents

Publication Publication Date Title
DE602007013517D1 (de) Haltering, flexible Membran zur Anwendung einer Belastung auf den Haltering und Halteringanordnung
EA200870238A1 (ru) Узел наконечника и/или переходный узел для картриджа
ATE532768T1 (de) Pyridylinhibitoren der hedgehog-signalvermittlung
ATE529220T1 (de) Flexible membran für einen trägerkopf
TW200716244A (en) Fluid filter
DE60314138D1 (de) Elektroleitfähige farbstoffe und beschichtungen auf kohlenstofffibrilenbasis
ATE489985T1 (de) Abdichtung einer katheternabenbefestigung
TW200715965A (en) Substituted N-[pyrimidin-2-ylmethyl] carboxamides and their use as herbicides and plant growth regulators
ATE469575T1 (de) Ringsatz
ATE516453T1 (de) Luftfedereinrichtung
DK1753440T3 (da) Oral administrationsform indeholdende probiotiske bakterier
GB2467897A (en) Turbine nozzle segment and assembly
TW200738695A (en) Cis-4,5-biaryl-2-heterocyclic-imidazolines as MDM2 inhibitors
DE602005024830D1 (de) Membran und membranpumpe
BRPI0602897A (pt) dispositivo aplicador de anel anastomótico
CR8385A (es) Pirimidinas sustituidas con sulfoximina como inhibidores de cdk y/o vegf, su preparacion y sus usos como medicamento
ATE397425T1 (de) Implantat zur änderung der iris-farbe
ATE535729T1 (de) Bremsscheibe
BRPI0700847A (pt) dispositivo de batente de debreagem
DE602006005207D1 (de) Mikroorganismen des Genus Corynebakteriums mit Resistenz gegen Kanamycin und erhöhter L-Lysin-Produktivität und Verfahren zur Herstellung von L-Lysin damit
DE602004026424D1 (de) Zusammensetzungen zur haarbehandlung
ATE492758T1 (de) Dichtungsanordnung
DE602006011540D1 (de) Bremsaktuator und Verfahren zur dessen Herstellung
TW200834220A (en) Color wheel
FR2956890B1 (fr) Robinet a bague d'etancheite elastomere/ceramique