ATE503610T1 - Haltering, flexible membran zur anwendung einer belastung auf den haltering und halteringanordnung - Google Patents

Haltering, flexible membran zur anwendung einer belastung auf den haltering und halteringanordnung

Info

Publication number
ATE503610T1
ATE503610T1 AT07022411T AT07022411T ATE503610T1 AT E503610 T1 ATE503610 T1 AT E503610T1 AT 07022411 T AT07022411 T AT 07022411T AT 07022411 T AT07022411 T AT 07022411T AT E503610 T1 ATE503610 T1 AT E503610T1
Authority
AT
Austria
Prior art keywords
retainer ring
flexible membrane
assembly
applying
load
Prior art date
Application number
AT07022411T
Other languages
English (en)
Inventor
Steven M Zuniga
Andrew J Nagengast
Jeonghoon Oh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE503610T1 publication Critical patent/ATE503610T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
  • Laminated Bodies (AREA)
AT07022411T 2006-11-22 2007-11-19 Haltering, flexible membran zur anwendung einer belastung auf den haltering und halteringanordnung ATE503610T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86709006P 2006-11-22 2006-11-22
US89170507P 2007-02-26 2007-02-26
US11/741,691 US7575504B2 (en) 2006-11-22 2007-04-27 Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly

Publications (1)

Publication Number Publication Date
ATE503610T1 true ATE503610T1 (de) 2011-04-15

Family

ID=38969432

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07022411T ATE503610T1 (de) 2006-11-22 2007-11-19 Haltering, flexible membran zur anwendung einer belastung auf den haltering und halteringanordnung

Country Status (9)

Country Link
US (1) US7575504B2 (de)
EP (1) EP1925398B1 (de)
JP (2) JP5314267B2 (de)
KR (3) KR100940614B1 (de)
CN (1) CN101293332B (de)
AT (1) ATE503610T1 (de)
DE (1) DE602007013517D1 (de)
SG (1) SG143190A1 (de)
TW (2) TWI432288B (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7572504B2 (en) * 2005-06-03 2009-08-11 The Procter + Gamble Company Fibrous structures comprising a polymer structure
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US8033895B2 (en) * 2007-07-19 2011-10-11 Applied Materials, Inc. Retaining ring with shaped profile
DE112007003710T5 (de) * 2007-11-20 2010-12-02 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
CN103252711B (zh) * 2008-03-25 2016-06-29 应用材料公司 改良的承载头薄膜
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
TWI540021B (zh) * 2010-08-06 2016-07-01 應用材料股份有限公司 以扣環調校基板邊緣
CN103733315A (zh) * 2011-08-05 2014-04-16 应用材料公司 两件式塑料保持环
US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
KR102236929B1 (ko) 2012-06-05 2021-04-06 어플라이드 머티어리얼스, 인코포레이티드 인터로크 피쳐들을 갖는 2-파트 리테이닝 링
KR101387923B1 (ko) 2012-08-27 2014-04-22 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드
US8998676B2 (en) 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
KR101410358B1 (ko) * 2013-02-25 2014-06-20 삼성전자주식회사 화학적 기계적 연마장치용 멤브레인 및 화학적 기계적 연마장치용 연마헤드
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
US9227297B2 (en) 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
KR101515424B1 (ko) * 2013-10-22 2015-04-29 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인
JP6232297B2 (ja) * 2014-01-21 2017-11-15 株式会社荏原製作所 基板保持装置および研磨装置
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
US10252397B2 (en) * 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
KR101583815B1 (ko) * 2014-12-22 2016-01-11 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드
KR102264785B1 (ko) * 2015-02-16 2021-06-14 삼성전자주식회사 연마 헤드 및 이를 갖는 연마 캐리어 장치
US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
KR101655075B1 (ko) * 2015-08-21 2016-09-07 주식회사 케이씨텍 화학 기계적 연마 장치
KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
KR102420066B1 (ko) 2016-07-25 2022-07-11 어플라이드 머티어리얼스, 인코포레이티드 Cmp를 위한 리테이닝 링
US11397139B2 (en) * 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
CN108687657A (zh) * 2017-04-05 2018-10-23 中芯国际集成电路制造(北京)有限公司 一种化学机械研磨设备
CN209615159U (zh) * 2018-11-28 2019-11-12 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
CN112548848B (zh) * 2019-09-26 2022-09-23 清华大学 一种承载头和化学机械抛光设备
CN111318959B (zh) * 2020-04-16 2024-02-06 清华大学 一种用于化学机械抛光的保持环和承载头
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
JP2023516869A (ja) 2020-10-13 2023-04-21 アプライド マテリアルズ インコーポレイテッド 接点延長部又は調節可能な止め具を有する基板研磨装置
US11623321B2 (en) 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
WO2022187249A1 (en) * 2021-03-04 2022-09-09 Applied Materials, Inc. Polishing carrier head with floating edge control

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
KR100485002B1 (ko) 1996-02-16 2005-08-29 가부시키가이샤 에바라 세이사꾸쇼 작업물폴리싱장치및방법
US6183354B1 (en) 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6056632A (en) 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US6019670A (en) 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US5916015A (en) 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6116992A (en) 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6143127A (en) * 1998-05-14 2000-11-07 Applied Materials, Inc. Carrier head with a retaining ring for a chemical mechanical polishing system
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6159079A (en) 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6089961A (en) 1998-12-07 2000-07-18 Speedfam-Ipec Corporation Wafer polishing carrier and ring extension therefor
US20020173242A1 (en) 1999-04-19 2002-11-21 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6527624B1 (en) 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6186880B1 (en) 1999-09-29 2001-02-13 Semiconductor Equipment Technology Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
DE60024559T2 (de) 1999-10-15 2006-08-24 Ebara Corp. Verfahren und Gerät zum Polieren eines Werkstückes
US6726528B2 (en) * 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
US6663466B2 (en) * 1999-11-17 2003-12-16 Applied Materials, Inc. Carrier head with a substrate detector
US6361419B1 (en) * 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
JP2001277098A (ja) * 2000-03-29 2001-10-09 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6857945B1 (en) 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
EP1177859B1 (de) 2000-07-31 2009-04-15 Ebara Corporation Substrathalter und Poliervorrichtung
JP2004520705A (ja) * 2000-11-21 2004-07-08 エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ 半導体ウエハ、研磨装置及び方法
US6890249B1 (en) 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP3091590U (ja) * 2002-07-23 2003-02-07 水源 陳 シリコンウェハの研磨用定位リングの構造
TW544375B (en) * 2002-09-09 2003-08-01 Taiwan Semiconductor Mfg Chemical mechanical polishing head
TWM255104U (en) 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing
US7033252B2 (en) 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
JP4583207B2 (ja) 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
WO2006025641A1 (en) * 2004-09-02 2006-03-09 Joon-Mo Kang Retaining ring for chemical mechanical polishing
KR101186239B1 (ko) 2004-11-01 2012-09-27 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
JP5112614B2 (ja) * 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
JP4814677B2 (ja) 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置

Also Published As

Publication number Publication date
TWI448356B (zh) 2014-08-11
SG143190A1 (en) 2008-06-27
JP5314267B2 (ja) 2013-10-16
DE602007013517D1 (de) 2011-05-12
US20080119118A1 (en) 2008-05-22
CN101293332B (zh) 2012-08-08
CN101293332A (zh) 2008-10-29
KR100940614B1 (ko) 2010-02-05
TW201000257A (en) 2010-01-01
KR20090089279A (ko) 2009-08-21
JP2008137149A (ja) 2008-06-19
TW200833465A (en) 2008-08-16
JP2013116554A (ja) 2013-06-13
TWI432288B (zh) 2014-04-01
KR20080046556A (ko) 2008-05-27
US7575504B2 (en) 2009-08-18
EP1925398A1 (de) 2008-05-28
KR20130083873A (ko) 2013-07-23
JP5568653B2 (ja) 2014-08-06
EP1925398B1 (de) 2011-03-30
KR101358821B1 (ko) 2014-02-10
KR101335554B1 (ko) 2013-12-02

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