JP5250243B2 - キャリアヘッド用フレキシブル膜 - Google Patents
キャリアヘッド用フレキシブル膜 Download PDFInfo
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- JP5250243B2 JP5250243B2 JP2007298308A JP2007298308A JP5250243B2 JP 5250243 B2 JP5250243 B2 JP 5250243B2 JP 2007298308 A JP2007298308 A JP 2007298308A JP 2007298308 A JP2007298308 A JP 2007298308A JP 5250243 B2 JP5250243 B2 JP 5250243B2
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- annular
- flexible membrane
- retaining ring
- concentric
- extending
- Prior art date
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- 239000012528 membrane Substances 0.000 claims abstract description 104
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 64
- 238000005498 polishing Methods 0.000 description 53
- 239000000463 material Substances 0.000 description 26
- 239000002002 slurry Substances 0.000 description 13
- 239000004696 Poly ether ether ketone Substances 0.000 description 10
- 229920002530 polyetherether ketone Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 3
- -1 for example Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
- Y10T428/24182—Inward from edge of web or sheet
Description
本発明の実施は、以下の特徴のうちの1つ以上を含むことができる。外側環状部は、その外壁に沿った環状凹部と、その内壁に沿って内方に突出する環状段部とを有することができる。環状凹部は、環状部が曲がることを可能にすることができる。環状段部は、非水平の上面及び下面を有することができる。フレキシブル膜は、外側環状部に接続された2つの環状フラップを有することができる。外側環状部に接続された2つの環状フラップは、内方に延びる水平部と、厚いリム部とを有することができる。リム部は、ベースアセンブリに固着されるように構成することができる。上環状フラップは、下環状フラップよりも幅が狭い水平部を有することができる。フレキシブル膜がキャリアヘッドに固着されたときに、主部の上の空間を複数のチャンバに分けるために、複数の同心環状フラップを主部に接続することができる。例えば、フレキシブル膜は、主部に接続された4つの同心環状フラップを有することができる。主部に接続された最も内側の同心環状フラップは、外側に延びる水平部と、水平部の外縁部に沿った厚いリム部と、主部と水平部の間に結合された環状傾斜部とを有することができる。環状傾斜部は、水平部との接合点よりも、主部との接合点においてより大きな半径を有することができる。主部に接続された外側の3つの同心環状フラップは、それぞれ、主部から延びる垂直部と、垂直部から延びる水平部と、水平部の外縁部に沿った厚いリム部とを有することができ、厚いリム部は、ベースアセンブリに固着することができる。水平部は、主部に接続された外側の3つの同心環状フラップのうちの少なくとも1つの垂直部よりも小さい厚さを有することができる。主部に接続された第2及び第3の外側の同心環状フラップは、約1.5〜2.0の水平部の長さと垂直部の長さの比を有することができる。主部に接続された外側の3つの同心環状フラップのうちの少なくとも1つは、水平部と垂直部の間の接合点に切り欠きを含むことができる。切り欠きは、水平部が垂直方向に曲がることを可能にする。同心環状フラップのうちの少なくとも1つは、主部との接合点に切り欠きを含むことができる。切り欠きは、主部における圧迫を低減することができる。複数の同心環状フラップのうちの第1のものは、横方向に延びる部分と、横方向に延びる部分を主部に接続する垂直方向に延びる部分とを含むことができ、複数の同心環状フラップのうちの第2のものは、横方向に延びる部分と、横方向に延びる部分を主部に接続する対角線上に延びる部分とを含むことができる。複数の同心環状フラップのうちの第1のものは、最も外側のフラップとすることができ、また、複数の同心環状フラップのうちの第2のものは、最も内側のフラップとすることができる。
Claims (13)
- フレキシブル膜であって、
基板取付け面を提供する下面を持つ主部と、
前記主部の外縁部から延びる外側環状部と、
前記フレキシブル膜がキャリアヘッドに固着されたときに、前記主部の上の空間を複数のチャンバに分けるために、前記外側環状部に接続された2つの環状フラップと、
を備え、
前記主部と前記外側環状部との間の接合点が、周辺縁部ヒンジと、前記外側環状部の外壁に沿った前記ヒンジの上の環状凹部とを備え、前記周辺縁部ヒンジが、適合するように構成された丸みのある内面及び外面を有する、フレキシブル膜。 - 前記外側環状部が、その外壁に沿った環状凹部と、非水平の上面及び下面を有し、その内壁に沿って内方に突出している環状段部とを備える、請求項1に記載のフレキシブル膜。
- 前記外側環状部に接続された前記2つの環状フラップが、内方に延びる水平部と、厚いリム部とを備え、前記リム部が、ベースアセンブリに固着されるように構成されており、前記上環状フラップが、前記下環状フラップよりも幅が狭い水平部を有する、請求項1に記載のフレキシブル膜。
- 前記フレキシブル膜がキャリアヘッドに固着されたときに、前記主部の上の空間を複数のチャンバに分けるために、前記主部に接続された複数の同心環状フラップをさらに備える、請求項1に記載のフレキシブル膜。
- 前記複数の同心環状フラップのうちの第1のものが、横方向に延びる部分と、前記横方向に延びる部分を前記主部に接続する垂直方向に延びる部分とを含み、前記複数の同心環状フラップのうちの第2のものが、横方向に延びる部分と、前記横方向に延びる部分を前記主部に接続する対角線上に延びる部分とを含む、請求項4に記載のフレキシブル膜。
- 前記複数の同心環状フラップのうちの第1のものが、最も外側のフラップである、請求項5に記載のフレキシブル膜。
- 前記複数の同心環状フラップのうちの第2のものが、最も内側のフラップである、請求項5に記載のフレキシブル膜。
- 前記複数の同心環状フラップのうちの最も内側の同心環状フラップが、外方に延びる水平部と、ベースアセンブリに固着されるように構成された、前記水平部の外縁部に沿った厚いリム部と、前記主部との接合点に、前記水平部との接合点においてよりも大きい半径を有し、前記主部と前記水平部との間に接合された環状の角度のついた部分とを備える、請求項4に記載のフレキシブル膜。
- 前記複数の同心フラップの最も外側の同心環状フラップが、前記主部から延びる垂直部と、前記垂直部から延びる水平部と、ベースアセンブリに固着されるように構成された、前記水平部の外縁部に沿った厚いリム部とを備える、請求項4に記載のフレキシブル膜。
- 前記水平部が、前記垂直部よりも小さい厚みを有する、請求項9に記載のフレキシブル膜。
- 前記水平部の長さと、前記垂直部の長さの比が、約1.5〜2.0である、請求項9に記載のフレキシブル膜。
- 前記複数の同心環状フラップのうちの第2のものが、前記横方向に延びる部分と前記垂直方向に延びる横方向部分との間の接合点に切り欠きを含む、請求項5に記載のフレキシブル膜。
- 前記同心環状フラップのうちの少なくとも1つが、前記主部との接合点に切り欠きを含む、請求項4に記載のフレキシブル膜。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86709006P | 2006-11-22 | 2006-11-22 | |
US60/867,090 | 2006-11-22 | ||
US89170507P | 2007-02-26 | 2007-02-26 | |
US60/891,705 | 2007-02-26 | ||
US11/741,692 US7727055B2 (en) | 2006-11-22 | 2007-04-27 | Flexible membrane for carrier head |
US11/741,692 | 2007-04-27 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013024750A Division JP5568654B2 (ja) | 2006-11-22 | 2013-02-12 | キャリアヘッド用フレキシブル膜 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008142884A JP2008142884A (ja) | 2008-06-26 |
JP5250243B2 true JP5250243B2 (ja) | 2013-07-31 |
Family
ID=38996609
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007298308A Active JP5250243B2 (ja) | 2006-11-22 | 2007-11-16 | キャリアヘッド用フレキシブル膜 |
JP2013024750A Active JP5568654B2 (ja) | 2006-11-22 | 2013-02-12 | キャリアヘッド用フレキシブル膜 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013024750A Active JP5568654B2 (ja) | 2006-11-22 | 2013-02-12 | キャリアヘッド用フレキシブル膜 |
Country Status (8)
Country | Link |
---|---|
US (3) | US7727055B2 (ja) |
EP (1) | EP1925399B1 (ja) |
JP (2) | JP5250243B2 (ja) |
KR (1) | KR100942620B1 (ja) |
CN (1) | CN101293334B (ja) |
AT (1) | ATE529220T1 (ja) |
SG (2) | SG143191A1 (ja) |
TW (2) | TWI552829B (ja) |
Families Citing this family (42)
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US7727055B2 (en) * | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
US7654888B2 (en) * | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
JP5042778B2 (ja) * | 2007-10-31 | 2012-10-03 | 信越半導体株式会社 | ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置 |
DE112007003710T5 (de) * | 2007-11-20 | 2010-12-02 | Shin-Etsu Handotai Co., Ltd. | Polierkopf und Poliervorrichtung |
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ATE529220T1 (de) | 2011-11-15 |
JP2008142884A (ja) | 2008-06-26 |
US20110212672A1 (en) | 2011-09-01 |
KR20080046557A (ko) | 2008-05-27 |
JP2013116555A (ja) | 2013-06-13 |
CN101293334B (zh) | 2016-03-23 |
TW200902227A (en) | 2009-01-16 |
KR100942620B1 (ko) | 2010-02-17 |
TWI433753B (zh) | 2014-04-11 |
US20100240287A1 (en) | 2010-09-23 |
US20080119122A1 (en) | 2008-05-22 |
EP1925399A2 (en) | 2008-05-28 |
SG175554A1 (en) | 2011-11-28 |
US7950985B2 (en) | 2011-05-31 |
TWI552829B (zh) | 2016-10-11 |
EP1925399A3 (en) | 2008-07-02 |
US7727055B2 (en) | 2010-06-01 |
CN101293334A (zh) | 2008-10-29 |
EP1925399B1 (en) | 2011-10-19 |
TW201422364A (zh) | 2014-06-16 |
US8469776B2 (en) | 2013-06-25 |
JP5568654B2 (ja) | 2014-08-06 |
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