JP6657183B2 - 高ブレークダウンn型埋め込み層 - Google Patents
高ブレークダウンn型埋め込み層 Download PDFInfo
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- 230000015556 catabolic process Effects 0.000 title description 5
- 239000004065 semiconductor Substances 0.000 claims description 95
- 239000000758 substrate Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 45
- 239000002019 doping agent Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 18
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 17
- 229910052698 phosphorus Inorganic materials 0.000 claims description 17
- 239000011574 phosphorus Substances 0.000 claims description 17
- 229910052787 antimony Inorganic materials 0.000 claims description 12
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 12
- 229910052785 arsenic Inorganic materials 0.000 claims description 9
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 9
- 238000002513 implantation Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 15
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000007943 implant Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Description
Claims (23)
- 半導体デバイスであって、
p型半導体材料を含む基板と、
前記基板に配置されるn型埋め込み層であって、
アンチモンとヒ素とそれらの組み合わせとから成るグループから選択されるドーパントでの第1のドーピング濃度を有し、前記基板の頂部表面より下に埋め込み頂部表面を有する、メイン層と、
前記メイン層の下に位置し、前記第1のドーピング濃度よりも低い第2のドーピング濃度を有する、軽くドープされた層と、
を含む、前記n型埋め込み層と、
前記基板を介して貫通することなく前記基板の下部層に達するように前記n型埋め込み層を介して延在するディープトレンチ構造であって、前記ディープトレンチ構造の底部部分を覆って前記基板に接する誘電体ライナーを含む、前記ディープトレンチ構造と、
前記基板の前記頂部表面から延在して前記ディープトレンチ構造と前記n型埋め込み層の前記埋め込み頂部表面とに隣接する、n型の自己整合されたシンカーと、
を含む、半導体デバイス。 - 請求項1に記載の半導体デバイスであって、
前記p型半導体材料が、5Ωcm〜10Ωcmの抵抗率を有する、半導体デバイス。 - 請求項1に記載の半導体デバイスであって、
前記メイン層におけるn型ドーパントの少なくとも50パーセントがアンチモンである、半導体デバイス。 - 請求項1に記載の半導体デバイスであって、
前記ディープトレンチ構造が、前記基板の前記頂部表面に定義される閉ループ構成を含む、半導体デバイス。 - 請求項1に記載の半導体デバイスであって、
前記n型の自己整合されたシンカーが、前記n型埋め込み層の前記埋め込み頂部表面まで延在し、閉ループ構成を有する、半導体デバイス。 - 請求項1に記載の半導体デバイスであって、
前記第1のドーピング濃度が5×1018cm−3よりも大きく、前記第2のドーピング濃度が1×1016cm−3から10×1017cm−3までの範囲である、半導体デバイス。 - 請求項1に記載の半導体デバイスであって、
前記第1のドーピング濃度が前記第2のドーピング濃度よりも少なくとも50倍大きい、半導体デバイス。 - 請求項1に記載の半導体デバイスであって、
前記n型埋め込み層に結合される電極であって、前記n型埋め込み層を80ボルトと110ボルトの間にバイアスするように構成される、前記電極を更に含む、半導体デバイス。 - 半導体デバイスであって、
第1の導電型の第1のドーパントを含む第1の半導体層と、
前記第1の半導体層の上に位置する第2の半導体層であって、前記第1の導電型の第2のドーパントを含み、前記第1の半導体層から離れて面する頂部表面を有する、前記第2の半導体層と、
前記第1の半導体層と前記第2の半導体層との間に位置する埋め込み層であって、
前記第1の半導体層内の第1の埋め込み層であって、前記第1の半導体層に隣接し、前記第1の導電型と反対の第2の導電型の第3のドーパントを含み、第1のドーピング濃度を有する、前記第1の埋め込み層と、
前記第1の埋め込み層上に位置する第2の埋め込み層であって、前記第2の半導体層に隣接し、前記第1のドーピング濃度よりも高い第2のドーピング濃度で前記第2の導電型の第4のドーパントを含む、前記第2の埋め込み層と、
を有する、前記埋め込み層と、
を含む、半導体デバイス。 - 請求項9に記載の半導体デバイスであって、
前記第2の埋め込み層が、前記第1の半導体層内と前記第2の半導体層内とに延在する、半導体デバイス。 - 請求項9に記載の半導体デバイスであって、
前記第2の埋め込み層が、前記第2の半導体層内に位置する頂部層と、前記第1の半導体層内に位置して前記頂部層に隣接する底部層とを含む、半導体デバイス。 - 請求項9に記載の半導体デバイスであって、
前記第1の半導体層を介して貫通することなしに前記第1の半導体層に達するように前記第2の半導体層の前記頂部表面から前記埋め込み層を介して延在するディープトレンチ構造であって、前記ディープトレンチ構造の底部部分を覆って前記第1の半導体層に接する誘電体ライナーを含む、前記ディープトレンチ構造を更に含む、半導体デバイス。 - 請求項9に記載の半導体デバイスであって、
前記第2の半導体層から前記埋め込み層に延在し、閉ループ構造を有するシンカーを更に含む、半導体デバイス。 - 半導体デバイスを形成する方法であって、
p型半導体材料を含む基板の第1のエピタキシャル層を提供することと、
第1の注入層を形成するために、第1のn型ドーパントを第1のドーズ量で前記基板に注入することと、
第2の注入層を形成するために、第2のn型ドーパントを前記第1のドーズ量よりも少ない第2のドーズ量で100keVを上回るエネルギーで前記基板に注入することと、
前記基板にp型エピタキシャル層を定義し、前記p型エピタキシャル層の上に位置するn型埋め込み層を形成するために、少なくとも30分間の1150℃〜1225℃の温度での第1の熱駆動プロセスにおいて、前記基板を加熱することと、
を含み、
前記n型埋め込み層が、
第1のドーピング濃度と前記基板の頂部表面より下の埋め込み頂部表面とを有するメイン層と、
前記p型エピタキシャル層より上で前記メイン層より下に位置し、前記第1のドーピング濃度よりも低い第2のドーピング濃度を有する、軽くドープされた層と、
を含む、方法。 - 請求項14に記載の方法であって、
前記p型エピタキシャル層における前記p型半導体材料が、5Ωcm〜10Ωcmの抵抗率を有する、方法。 - 請求項14に記載の方法であって、
前記第1のn型ドーパントが、アンチモンを含み、5×1014cm−2より大きい前記第1のドーズ量で注入される、方法。 - 請求項14に記載の方法であって、
前記第2のn型ドーパントが、リンを含み、前記基板にわたって注入される、方法。 - 請求項14に記載の方法であって、
前記n型埋め込み層が局地化されたn型埋め込み層を含むように、前記第2のn型ドーパントが、リンを含み、注入マスクにより露出されたエリアを介して前記基板に注入される、方法。 - 請求項14に記載の方法であって、
前記p型エピタキシャル層が形成された後に、少なくとも120分間の1125℃〜1200℃の温度での第2の熱駆動プロセスにおいて、前記基板を加熱することを更に含む、方法。 - 請求項14に記載の方法であって、
前記基板を介して貫通することなしに前記p型エピタキシャル層に達するように、前記n型埋め込み層を介して前記基板の前記頂部表面から延在する、前記基板におけるディープトレンチを形成することと、
前記ディープトレンチの底部部分を覆い、前記基板に接する誘電体ライナーを形成することと、
を更に含む、方法。 - 請求項20に記載の方法であって、
前記ディープトレンチが、前記基板の前記頂部表面に定義される閉ループ構成を含む、方法。 - 請求項20に記載の方法であって、
前記n型埋め込み層の前記埋め込み頂部表面に隣接する、前記基板におけるn型の自己整合されたシンカーを形成するように、前記ディープトレンチが形成された後に、前記ディープトレンチに近接する前記基板に第3のn型ドーパントを注入することを更に含む、方法。 - 請求項14に記載の方法であって、
前記n型埋め込み層の前記埋め込み頂部表面まで延在し、閉ループ構成を有する、前記基板におけるn型シンカーを形成することを更に含む、方法。
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