JP6656315B2 - 粘着性組成物 - Google Patents
粘着性組成物 Download PDFInfo
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- JP6656315B2 JP6656315B2 JP2018131369A JP2018131369A JP6656315B2 JP 6656315 B2 JP6656315 B2 JP 6656315B2 JP 2018131369 A JP2018131369 A JP 2018131369A JP 2018131369 A JP2018131369 A JP 2018131369A JP 6656315 B2 JP6656315 B2 JP 6656315B2
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- resin
- film
- adhesive
- adhesive composition
- organic electronic
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 85
- 239000000853 adhesive Substances 0.000 title claims description 52
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- 229920005989 resin Polymers 0.000 claims description 77
- 239000011347 resin Substances 0.000 claims description 77
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 41
- 229920006223 adhesive resin Polymers 0.000 claims description 38
- 239000000126 substance Substances 0.000 claims description 36
- 239000012855 volatile organic compound Substances 0.000 claims description 32
- 239000002313 adhesive film Substances 0.000 claims description 30
- 239000004840 adhesive resin Substances 0.000 claims description 30
- -1 halogen ion Chemical class 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 20
- 239000002253 acid Substances 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000003999 initiator Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- 229910052736 halogen Inorganic materials 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 7
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 claims description 6
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
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- 238000010926 purge Methods 0.000 claims description 5
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- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
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- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
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- 101100116570 Caenorhabditis elegans cup-2 gene Proteins 0.000 claims 1
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
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- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
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- 238000003825 pressing Methods 0.000 description 4
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- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
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- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 3
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- 150000002148 esters Chemical class 0.000 description 3
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- 150000004706 metal oxides Chemical class 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
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- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 229910020366 ClO 4 Inorganic materials 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229920002877 acrylic styrene acrylonitrile Polymers 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
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- 238000007259 addition reaction Methods 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
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- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
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- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
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- MLKIVXXYTZKNMI-UHFFFAOYSA-N 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one Chemical compound CCCCCCCCCCCCC1=CC=C(C(=O)C(C)(C)O)C=C1 MLKIVXXYTZKNMI-UHFFFAOYSA-N 0.000 description 1
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- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
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- SKGGDIBONVPOAU-UHFFFAOYSA-N CO[SiH](OC)OC.C(C)(=O)NOC(C)=O Chemical compound CO[SiH](OC)OC.C(C)(=O)NOC(C)=O SKGGDIBONVPOAU-UHFFFAOYSA-N 0.000 description 1
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- 239000005977 Ethylene Substances 0.000 description 1
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- 238000003109 Karl Fischer titration Methods 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 239000011324 bead Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
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- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical group C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
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- 125000002091 cationic group Chemical group 0.000 description 1
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- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
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- CFZHYQLSRIAXQB-UHFFFAOYSA-N formyl 2-(2-phenylethyl)benzoate Chemical compound O=COC(=O)C1=CC=CC=C1CCC1=CC=CC=C1 CFZHYQLSRIAXQB-UHFFFAOYSA-N 0.000 description 1
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- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
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- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
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- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
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- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
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- 235000007586 terpenes Nutrition 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- HDUMBHAAKGUHAR-UHFFFAOYSA-J titanium(4+);disulfate Chemical compound [Ti+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HDUMBHAAKGUHAR-UHFFFAOYSA-J 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
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Description
[一般式1]
X≦1000ppm
[一般式2]
Y≦250ppm、
前記有機電子装置は、粘着フィルムの上端をカバーするカバー基板22をさらに含むことができる。
Polyisobutylene(Mw340k、Cl10ppm>)90g、粘着付与樹脂(H−DCPD系、s.p.125℃、volatile0.5wt%>)10g、アクリレート(Trimethylolpropane triacrylate)6g、光開始剤(2、2−dimethoxy−1、2−diphenylethan−1−one)0.5gを固形分20%となるようにtolueneを追加して撹拌してコーティング液を作る。
光開始剤(2、2−dimethoxy−1、2−diphenylethan−1−one)含量を0.2gにして、乾燥時間を10分にしたことを除いて、実施例1と同一の方法で粘着フィルムを製造した。
パージトラップ(Purge and Trap)−気体クロマトグラフィー/質量分析法を用いて150℃1時間乾燥させた時、2wt%以上の揮発性有機化合物が検出される粘着付与樹脂(KOLONG SU90)を使用し、乾燥時間を10分にしたことを除いて、実施例1と同一の方法で粘着フィルムを製造した。
Acid Valueが5の粘着付与樹脂製品(REAGEM 5110、parchem)を使用し、乾燥時間を10分にしたことを除いて、実施例1と同一の方法で粘着フィルムを製造した。
ASTM D 7359:2008に基づいて測定した塩素イオンの含量が300ppm以上のブチルゴムを使用し、乾燥時間を10分にしたことを除いて、実施例1と同一の方法で粘着フィルムを製造した。
測定器機:Purge & Trap sampler−GC/MSD system(P & T:JAI JTD−505III、GC/MS:Agilent 7890B/5977A)フィルムにコーティングしたサンプルを約50mg内外に計量し、80℃30分間Purge and Trapを実施した後、GC−MSを使用して総揮発量を測定した。測定された揮発量は、トルエンを標準試薬として定量する。
フィルムにコーティングした約50mg内外に計量されたサンプルの前処理は、EN 50267−2−1 & 502672−2に基づき、微量元素の測定は、ASTM D 7395:2008に基づいて測定し、酸価はASTM D974測定法に基づいて測定した。
ガラス基板に点灯テストを行うことができる素子を蒸着する。コーティングしたシート上の接着フィルムをインキャップ用ガラス基板に熱ラミした後、基板で80℃で加熱した状態で5kg/cm2の圧力で押しながら3分間真空圧着する。合着したサンプルをオーブンで100℃2時間熱硬化する。熱硬化したサンプルを85℃85%RH恒温、恒湿条件でダークスポットを観察する。300時間観察して、生成されるダークスポットがない場合と、ある場合とをチェックする。
硝子基板に素子を蒸着する。コーティングしたシート上の接着フィルムをインケブ用ガラス基板に熱ラミした後、基板において80℃にて加熱した状態で5kg/cm2の圧力で押しながら3分間真空圧着する。合着したサンプルをオーブンで100℃2時間熱硬化する。前記のように接着フィルムを有機電子素子に適用した後、配線腐食、バブル発生及びTFTダメージ可否を目視で確認した。
21:基板
22:カバー基板
23:有機電子素子
Claims (13)
- 有機電子素子の全面を封止するための粘着性組成物であって、
粘着樹脂、及び、1(KOHmg/g)以下の酸価(Acid Value)を有する粘着付与樹脂を含み、
粘着樹脂がオレフィン系樹脂であり、
粘着性組成物をフィルムに製造した後、50mgの前記フィルムサンプルに対し、25℃及び50%相対湿度の条件で24時間維持した後、ASTM D3451−06(2012)に基づいて測定した水分含量が0.01重量%以上1重量%以下である、下記一般式1及び2を満足する粘着性組成物:
[一般式1]
X≦1000ppm
[一般式2]
Y≦250ppm
前記一般式1において、Xは、前記組成物をフィルムに製造した後、50mgの前記フィルムサンプルをパージトラップ(Purge&Trap)−気体クロマトグラフィー/質量分析法を用いて80℃で30分間維持した後、測定した揮発性有機化合物の量であり、
前記一般式2において、Yは、前記組成物をフィルムに製造した後、50mgの前記フィルムサンプルでASTM D 7359:2008に基づいて測定した、前記組成物が含んでいるイオン性物質の量である。 - 前記イオン性物質は、ハロゲンイオンであることを特長とする、請求項1に記載の粘着性組成物。
- 粘着樹脂は、スチレン系樹脂、熱可塑性エラストマ、ポリオキシアルキレン系樹脂、ポリエステル系樹脂、ポリ塩化ビニル系樹脂、ポリカーボネート系樹脂、ポリフェニレンスルフィド系樹脂、炭化水素の混合物、ポリアミド系樹脂、アクリレート系樹脂、エポキシ系樹脂、シリコーン系樹脂、フッ素系樹脂またはこれらの混合物をさらに含むことを特長とする、請求項1に記載の粘着性組成物。
- 粘着樹脂は、ASTM D 7359:2008に基づいて測定したハロゲンイオンの含量が300ppm未満であることを特長とする、請求項1に記載の粘着性組成物。
- 沸点が100℃以下である有機溶剤をさらに含むことを特長とする、請求項1に記載の粘着性組成物。
- 光開始剤をさらに含むことを特長とする、請求項1に記載の粘着性組成物。
- 光開始剤は、光ラジカル開始剤であることを特長とする、請求項6に記載の粘着性組成物。
- 粘着付与樹脂が粘着樹脂100重量部に対して5重量部〜100重量部に含まれることを特長とする、請求項1に記載の粘着性組成物。
- 粘着樹脂100重量部に対して2重量部未満のシランカップリング剤をさらに含むことを特長とする、請求項1に記載の粘着性組成物。
- 請求項1による粘着性組成物を含むことを特長とする粘着フィルム。
- 基板と、前記基板上に形成された有機電子素子と、前記有機電子素子を封止する請求項10に記載の粘着フィルムとを含む有機電子装置。
- 前記有機電子素子が有機発光ダイオードであることを特長とする、請求項11に記載の有機電子装置。
- 上部に有機電子素子が形成された基板に、請求項10に記載の粘着フィルムが前記有機電子素子をカバーするように適用する段階を含む有機電子装置の製造方法。
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Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150016879A (ko) * | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
KR101574023B1 (ko) * | 2013-09-24 | 2015-12-02 | 주식회사 엘지화학 | 경화성 조성물 |
KR101574024B1 (ko) * | 2013-09-24 | 2015-12-02 | 주식회사 엘지화학 | 점착성 조성물 |
US10647890B2 (en) | 2015-06-09 | 2020-05-12 | Lg Chem, Ltd. | Adhesive composition, adhesive film comprising same, and organic electronic device comprising same |
US10385237B2 (en) | 2015-06-09 | 2019-08-20 | Lg Chem, Ltd. | Organic electronic device |
KR101687334B1 (ko) * | 2015-12-04 | 2016-12-19 | 주식회사 이녹스 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
KR101665593B1 (ko) * | 2015-12-04 | 2016-10-14 | 주식회사 이녹스 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
JP7418943B2 (ja) | 2016-04-29 | 2024-01-22 | 三星ディスプレイ株式會社 | 表示装置 |
KR102166466B1 (ko) * | 2016-09-26 | 2020-10-16 | 주식회사 엘지화학 | 점착 조성물 |
WO2018074505A1 (ja) * | 2016-10-19 | 2018-04-26 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
JP7010597B2 (ja) * | 2017-03-30 | 2022-01-26 | リンテック株式会社 | 粘着剤組成物、封止シート、及び封止体 |
CN110603301B (zh) * | 2017-05-05 | 2022-09-30 | 3M创新有限公司 | 聚合物膜和含有此类膜的显示设备 |
JP6676593B2 (ja) * | 2017-09-08 | 2020-04-08 | リンテック株式会社 | 樹脂シートおよび半導体装置 |
KR102475857B1 (ko) | 2017-09-18 | 2022-12-12 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 |
US10734605B2 (en) * | 2018-07-19 | 2020-08-04 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible OLED device and manufacturing method thereof |
CN109233092A (zh) * | 2018-08-02 | 2019-01-18 | 阜南盛原木业有限公司 | 一种耐水高强度胶合板 |
JP2021117239A (ja) * | 2020-01-22 | 2021-08-10 | キヤノン株式会社 | フォトレジスト組成物、液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
KR102328421B1 (ko) * | 2021-05-03 | 2021-11-19 | 주동식 | 피착제의 종류와 관계없이 점착가능한 아크릴계 점착테이프 및 이의 제조방법 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5703169A (en) | 1996-01-24 | 1997-12-30 | Adhesives Research, Inc. | Non-corrosive, low volatiles-containing pressure sensitive adhesive |
JP4215898B2 (ja) | 1998-08-27 | 2009-01-28 | 株式会社カネカ | 粘着剤組成物 |
WO2004009720A2 (en) * | 2002-07-24 | 2004-01-29 | Adhesives Research, Inc. | Transformable pressure sensitive adhesive tape and use thereof in display screens |
JP2004307787A (ja) | 2003-04-08 | 2004-11-04 | Hitachi Kasei Polymer Co Ltd | 電子機器用粘着テープ類 |
DE10322830A1 (de) * | 2003-05-19 | 2004-12-09 | Tesa Ag | Verfahren zur kontinuierlichen Herstellung von Polymeren aus vinylischen Verbindungen durch Substanz-beziehungsweise Lösungsmittelpolymerisation |
JP2005298703A (ja) * | 2004-04-13 | 2005-10-27 | Mitsui Chemicals Inc | 粘着性フィルム、筐体およびそれを用いた有機el発光素子 |
US7732552B2 (en) | 2006-01-27 | 2010-06-08 | Momentive Performance Materials Inc. | Low VOC epoxy silane oligomer and compositions containing same |
JP5089894B2 (ja) * | 2006-03-10 | 2012-12-05 | 日東電工株式会社 | 微粒子含有粘弾性層、及び感圧性接着テープ又はシート |
JP4953717B2 (ja) * | 2006-05-19 | 2012-06-13 | リンテック株式会社 | 光学機能性フィルム貼合用粘着剤、光学機能性フィルム及びその製造方法 |
JP5064873B2 (ja) | 2007-04-23 | 2012-10-31 | 三菱樹脂株式会社 | 活性エネルギー線硬化型粘着組成物 |
WO2009148716A2 (en) | 2008-06-02 | 2009-12-10 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
KR101623220B1 (ko) * | 2008-06-02 | 2016-05-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착성 캡슐화 조성물 및 그로 제조된 전자 소자 |
JP2010251117A (ja) | 2009-04-15 | 2010-11-04 | Jsr Corp | 有機el素子用透明封止材 |
JP2010260964A (ja) | 2009-05-07 | 2010-11-18 | Idemitsu Kosan Co Ltd | 難燃性樹脂組成物及びその成形体 |
KR20120024928A (ko) | 2009-06-04 | 2012-03-14 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 연신 분리가능한 감압성 접착제 |
DE102009036968A1 (de) * | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
JP2011068718A (ja) | 2009-09-24 | 2011-04-07 | Nitto Denko Corp | 両面接着性粘着シート |
TW201130944A (en) | 2009-11-18 | 2011-09-16 | 3M Innovative Properties Co | Flexible assembly and method of making and using the same |
JP2011225835A (ja) * | 2010-03-30 | 2011-11-10 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着剤組成物、粘着剤、両面粘着シート、光学部材用粘着剤、タッチパネル |
JP5399312B2 (ja) | 2010-04-26 | 2014-01-29 | 日東電工株式会社 | 粘着シート |
JP5556433B2 (ja) * | 2010-06-25 | 2014-07-23 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着剤組成物の製造方法、熱伝導性感圧接着性シート、及び電子部品 |
US9284475B2 (en) | 2010-10-21 | 2016-03-15 | Basell Poliolefine Italia S.R.L. | Pressure sensitive adhesive with butene-1 copolymers |
US20120122359A1 (en) | 2010-11-16 | 2012-05-17 | 3M Innovative Properties Company | Ionically crosslinkable poly(isobutylene) adhesive polymers |
KR101279980B1 (ko) * | 2010-12-29 | 2013-07-05 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
CN103930501B (zh) | 2011-11-14 | 2017-09-12 | Lg化学株式会社 | 粘合膜 |
KR101554378B1 (ko) | 2011-11-18 | 2015-09-21 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
EP2781571B1 (en) * | 2012-01-06 | 2020-07-29 | LG Chem, Ltd. | Encapsulation film |
BR112014018597A8 (pt) | 2012-01-31 | 2017-07-11 | Jx Nippon Oil & Energy Corp | Método de produção de base de óleo combustível |
JP6031049B2 (ja) | 2012-02-03 | 2016-11-24 | 昭和電工株式会社 | 光硬化性透明粘着シート用組成物、光学用粘着シート |
TWI488930B (zh) * | 2012-03-12 | 2015-06-21 | Lg Chemical Ltd | 壓感性黏著組成物 |
KR101574024B1 (ko) * | 2013-09-24 | 2015-12-02 | 주식회사 엘지화학 | 점착성 조성물 |
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